BTM9011EPXUMA1 - 10A Full-Bridge Motor Driver, 7-18V | Infineon
MPN: BTM9011EPXUMA1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.28 | $228.00 |
| 500 | $2.04 | $1,020.00 |
| 1,000 | $1.8 | $1,800.00 |
| 3,000 | $1.62 | $4,860.00 |
BTM9011EPXUMA1 Overview
A full-bridge motor driver IC (also known as an H-bridge) is a topology that uses four switching elements arranged in an H configuration to drive a DC or bipolar stepper motor in both directions from a single supply rail. The full-bridge sits within the broader hierarchy: motor driver IC -> motion controller -> power management IC -> semiconductor. By integrating the four MOSFETs plus gate drive, charge pump, current sense, and protection into one monolithic die, the BTM9011EPXUMA1 eliminates dozens of discrete components that an equivalent discrete solution would require.
Key features include a typical path resistance of 175 mΩ at 25 °C, pulse current capability of 5.2 A for tpulse ≤ 1 s at 85 °C (4.2 A for tpulse ≤ 10 s at 85 °C), a normal supply voltage range of 7 V to 18 V with an extended range of 4.5 V to 40 V, and a minimum current limitation. PWM operation is supported up to 20 kHz. The SPI interface enables diagnostic readout and parameter configuration, while the integrated protection set includes overtemperature, overcurrent, and undervoltage lockout.
The device is implemented in BCD technology and qualified to AEC-Q100 for automotive use. Compared with discrete MOSFET bridges, the integrated full-bridge cuts PCB area by roughly 60%, reduces parasitic loop inductance, and simplifies EMI compliance thanks to tighter gate-driver timing and shorter power paths.
Typical applications include automotive door-lock actuators, trunk latches, fuel-flap actuators, seat adjusters, mirror-fold motors, and HVAC flap control. The combination of 10 A current limit, 20 kHz PWM, and SPI diagnostics makes the part well suited to body-electronics modules that must report fault status to a central ECU.
When designing with this part, place a low-ESR 100 nF + 10 µF ceramic bypass on VS as close to the IC as possible, and tie the exposed pad to a continuous ground copper pour of at least 100 mm² to stay within the thermal envelope at full 10 A load. The SPI bus should be pulled up to VIO and isolated from the motor phase traces with a ground guard ring to avoid conducted-noise coupling during PWM transitions.
Drop-in alternatives for BTM9011EPXUMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with BTM9011EPXUMA1 (same form factor and footprint) — differing in Package, Topology, Automotive Qualification, Number of Channels, Current Limitation.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
BTM9010EPXUMA1
✅ Drop-In📋 Reference alternative (not in catalog)
BTG7003A1EPWXUMA2
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →BTH60801EPLXUMA1
✅ Drop-In✓ In Stock
$1.74 / Unit
View Datasheet →BTH62004ESAXUMA1
✅ Drop-In✓ In Stock
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View Datasheet →BTM9011EPXUMA1 Maximum Ratings & Electrical Characteristics
| Topology | Full-bridge (H-bridge) with integrated power MOSFETs |
| Output Current Limit | 10 A (typ) |
| Path Resistance (per HS+LS) | 175 mΩ typical at 25 °C |
| Pulse Current (tpulse ≤ 1 s at 85 °C) | 5.2 A |
| Pulse Current (tpulse ≤ 10 s at 85 °C) | 4.2 A |
| Supply Voltage Range (normal) | 7 V to 18 V |
| Supply Voltage Range (extended) | 4.5 V to 40 V |
| PWM Frequency | up to 20 kHz |
| Interface | SPI (status, configuration, diagnostics) |
| Current Limitation | Min, integrated |
| Technology | BCD (Bipolar-CMOS-DMOS) monolithic |
| Package | PG-TSDSO-14 with exposed pad |
| Mounting Type | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| Operating Temperature (junction) | -40 °C to +150 °C |
BTM9011EPXUMA1 Pin Configuration
| Pin 1 | VS — Motor supply voltage (7 V to 18 V normal, up to 40 V extended) |
| Pin 2 | OUT1 — Bridge output 1 to motor terminal A |
| Pin 3 | OUT2 — Bridge output 2 to motor terminal B |
| Pin 4 | GND — Power and logic ground |
| Pin 5 | EN — Enable / PWM input (active high) |
| Pin 6 | SDI — SPI serial data in |
| Pin 7 | SDO — SPI serial data out |
| Pin 8 | SCLK — SPI serial clock |
| Pin 9 | CSN — SPI chip select (active low) |
| Pin 10 | VIO — Logic I/O supply for SPI reference level |
| Pin 11 | DIAG — Diagnostic flag output (open-drain) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | EP — Exposed pad - thermal and ground, must be soldered to PCB |
Typical Applications
BTM9011EPXUMA1 is suitable for 6 applications: Automotive Door-Lock Actuator, Trunk / Tailgate Latch Actuator, Fuel-Flap and Charge-Port Actuator, Mirror-Fold and Mirror-Adjust Motor, HVAC Flap and Mode Door Actuator, Body-Control Module (BCM) Daughter Card.
Automotive Door-Lock Actuator
The BTM9011EPXUMA1 is a strong fit for automotive door-lock actuators because its 10 A current limit exceeds the 2-4 A stall current of typical lock motors, while its 7-18 V normal / 4.5-40 V extended supply range handles 12 V vehicle rails with load-dump transients without external TVS. The H-bridge directly drives the motor in both directions from a single IC, replacing four discrete MOSFETs and a gate driver. SPI diagnostics report open-load, short-to-battery, and overtemperature faults to the BCM (body control module) over the same bus that configures current limit, allowing the ECU to log actuator health. AEC-Q100 qualification supports the underhood and door-module thermal environment.
Recommended
Trunk / Tailgate Latch Actuator
Trunk-latch and tailgate actuators require momentary high inrush current followed by a low hold current - a profile that matches the BTM9011EPXUMA1's 5.2 A pulse rating at tpulse ≤ 1 s and 4.2 A at tpulse ≤ 10 s at 85 °C. The integrated current limit prevents stall-current damage if the latch jams, while the SPI fault register lets the ECU distinguish between a mechanical fault and an electrical fault. The PG-TSDSO-14 exposed pad dissipates the latch pulse energy through a small copper pour on the tailgate PCB, eliminating the heatsink a discrete bridge would otherwise require.
Recommended
Fuel-Flap and Charge-Port Actuator
Fuel-flap and EV charge-port actuators draw 1-3 A continuous and run from a 12 V body rail, exactly the operating envelope of the BTM9011EPXUMA1. The integrated reverse-battery protection through the bridge topology removes the need for a separate polarity-reversal relay, simplifying the BOM. SPI configuration of the current-limit threshold lets the same hardware drive fuel-flap (low current) and charge-port (higher current) actuators with only firmware changes, supporting platform reuse across vehicle variants.
Recommended
Mirror-Fold and Mirror-Adjust Motor
Power mirror-fold and mirror-adjust motors are short-duty-cycle brushed DC loads with stall currents in the 3-6 A range. The BTM9011EPXUMA1's full-bridge topology provides direction control in a single IC and its 20 kHz PWM capability supports soft-start ramps that reduce acoustic noise from the mirror mechanism. The exposed pad of the PG-TSDSO-14 package handles the pulse dissipation on the small mirror PCB, where space is constrained and a discrete bridge would not fit.
Recommended
HVAC Flap and Mode Door Actuator
HVAC flap actuators (mode, blend, recirculation doors) operate from a 12 V body rail at currents below 2 A continuous but require bidirectional control and accurate position feedback via stall detection. The BTM9011EPXUMA1's adjustable current limit allows the HVAC controller to detect end-of-travel by current rise and stop the motor without a separate position sensor. The SPI bus links the actuator to the HVAC ECU for synchronised flap movement, while the AEC-Q100 qualification supports the cabin thermal environment up to 85 °C ambient.
Recommended
Body-Control Module (BCM) Daughter Card
Inside a BCM daughter card, the BTM9011EPXUMA1 integrates the power stage for one relay-replaced load (door lock, latch, or flap), while a multi-half-bridge driver such as the TLE94104EPXUMA1 handles the remaining loads. The 20 kHz PWM keeps switching noise above the AM-broadcast band, simplifying EMC compliance, and the SPI daisy-chain allows multiple BTM9011EPXUMA1 devices to share one SPI bus with only one CSN pin per IC. The exposed pad of the PG-TSDSO-14 ties into the BCM ground pour for stable thermal performance.
Recommended
Recommended Products Summary
Engineering reference data for BTM9011EPXUMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | BTM9010EPXUMA1 | BTG7003A1EPWXUMA2 | BTH60801EPLXUMA1 | BTH62004ESAXUMA1 |
|---|---|---|---|---|---|
| Package | PG-TSDSO-14 | PG-TSDSO-14 - same | PG-TSDSO-14 - same | PG-TSDSO-14 - same | PG-TSDSO-14 - same |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Topology | Full-bridge (H-bridge) | Full-bridge (H-bridge) | Single high-side switch | Single high-side switch | Dual high-side switch |
| Interface | SPI | SPI | SPI | SPI | SPI |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Key Differentiators
- Integrated full-bridge with 175 mΩ path resistance in PG-TSDSO-14 (vs TLE94104EPXUMA1)
- SPI diagnostics and configurable current limit (vs BTM9010EPXUMA1)
- Bidirectional motor drive in a single 14-pin IC (vs BTG7003A1EPWXUMA2)
Design Notes
At 5 A continuous motor current and 175 mΩ total path resistance, the BTM9011EPXUMA1 dissipates approximately 4.4 W in the bridge. Estimated junction-to-ambient thermal resistance for the PG-TSDSO-14 package on a standard 4-layer 1 oz copper PCB is around 35 K/W with a 100 mm² ground pour on the exposed pad, giving a 154 °C junction rise above 25 °C ambient. For continuous 5 A operation the exposed pad must be soldered to a continuous ground pour of at least 100 mm²; for short-pulse latch and lock applications no extra heatsink is required.
Place a 100 nF X7R ceramic bypass capacitor directly at the VS pin and a 10 µF aluminium-polymer or ceramic bulk capacitor within 5 mm of the IC. Route the motor phase traces (OUT1, OUT2) with wide copper pours on the top layer and stitch the GND return path with multiple vias to the inner ground plane. Keep SPI traces (SDI, SDO, SCLK, CSN) on the opposite side of the PCB from the motor traces and guard them with a ground ring to block conducted noise from the 20 kHz PWM transitions.
Do not operate the BTM9011EPXUMA1 above the 10 A current limit - the integrated current limit will engage, but sustained operation at the limit trips the overtemperature shutdown. Ensure the VIO logic supply is present before CSN is asserted on the SPI bus, otherwise the SDO pin may drive an indeterminate level and corrupt the status register read. The exposed pad is the primary heat-dissipation path and must not be left unsoldered - an un-soldered EP roughly triples the thermal resistance and will cause early thermal shutdown in latch-actuator pulses.
Compliance Information
AEC-Q100 qualified per Arrow and DigiKey distributor listings. RoHS and REACH compliant per Infineon product page. Halogen-free per Infineon green-product declaration.
