EP1AGX20CF484I6 - Arria GX FPGA 21.5K LE 484-FBGA | Intel
MPN: EP1AGX20CF484I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $122 | $61,000.00 |
| 1,000 | $108 | $108,000.00 |
Drop-in alternatives for EP1AGX20CF484I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1AGX20CF484C6
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View Datasheet →EP1AGX20CF484C7
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View Datasheet →EP1AGX20CF484C6N
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View Datasheet →EP1AGX20CF484C6NGA
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View Datasheet →EP1AGX20CF484C7N
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View Datasheet →EP1AGX20CF484I6 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 21,580 |
| LABs (Logic Array Blocks) | 1,079 |
| User I/O Pins | 230 |
| Total I/O Pins (Package) | 484 |
| Supply Voltage (Core) | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| Package Type | 484-BGA flip-chip (FC-FBGA) |
| Package Size | 23 x 23 mm |
| Operating Temperature | -40C to +100C (Industrial) |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| Embedded Memory | M512 + M4K blocks (total bits per family datasheet) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per distributor listing) |
| Lead-Free | Yes |
| Speed Grade | 6 |
| Device Grade | I (Industrial) |
EP1AGX20CF484I6 23 x 23 mm Pin Configuration Guide
Complete pinout information for EP1AGX20CF484I6 (23 x 23 mm package) with 484 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF484I6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 484 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF484I6 is suitable for 7 applications: Telecom Line-Card Packet Processing, Industrial Imaging and Video Bridging, Test and Measurement Backplanes, Embedded DSP Pre-Processing, Serial Protocol Bridging and IO Expansion, Aerospace and Defense Avionics Interfaces, Medical Imaging Reconstruction Pre-Processing.
Telecom Line-Card Packet Processing
The EP1AGX20CF484I6's integrated 3.125 Gbps transceivers and 21,580 logic elements make it well-suited for telecom line-card packet processing. Designers can implement multi-port Gigabit Ethernet MACs, packet classifiers, and QoS engines without external PHY ICs, reducing BOM cost and board area. The 1,079 LABs provide ample capacity for 256-entry deep packet buffers via M4K memory blocks, while the industrial temperature grade supports outdoor cabinet deployments. Compared with discrete ASIC + PHY solutions, this Arria GX FPGA offers field-reprogrammability for late-stage protocol updates and field-debug via SignalTap II.
Recommended
Industrial Imaging and Video Bridging
For industrial imaging pipelines, the EP1AGX20CF484I6 bridges Camera Link, CoaXPress, or proprietary high-speed serial sensors to Ethernet or PCIe backhaul. The 230 user I/O pins accept wide parallel image data buses, while the embedded transceivers serialize the output to 3.125 Gbps links. The 90 nm process delivers deterministic latency required for machine-vision triggering, and the industrial temperature grade ensures operation in factory-floor environments. Designers pair the device with external DDR2 SDRAM for frame buffering, using Altera's DDR2 controller IP within the Quartus II toolchain.
Recommended
Test and Measurement Backplanes
The EP1AGX20CF484I6 serves as the central FPGA in test and measurement backplanes, aggregating multiple instrument channels and routing data to host PCs via PCIe x4 or Gigabit Ethernet. Its transceiver resources support PXI Express and LXI class instruments, while the 21,580 logic elements implement on-board DSP for FFT, FIR filtering, and digital down-conversion. The 484-FBGA package's controlled-impedance ball grid enables the high signal-integrity required for multi-GHz analog front-end interfaces. Industrial temperature operation supports lab and field-deployed instrumentation.
Recommended
Embedded DSP Pre-Processing
The EP1AGX20CF484I6's embedded multiplier blocks accelerate DSP pre-processing tasks such as digital filtering, modulation/demodulation, and channel equalization. Designers implement these functions using the DSP Builder tool flow or hand-coded VHDL/Verilog targeting the dedicated multiplier blocks. The device's 1,079 LABs and embedded memory blocks support systolic FIR architectures for high-throughput baseband processing in software-defined radio applications. Compared with software-only DSP implementations, the FPGA achieves 10-100x throughput per watt for parallel arithmetic operations.
Recommended
Serial Protocol Bridging and IO Expansion
Use the EP1AGX20CF484I6 to bridge legacy parallel buses to high-speed serial links such as Serial RapidIO or PCIe, extending the service life of legacy processors. The FPGA's 230 user I/O pins map to wide legacy data buses (e.g., 32-bit PCI, 16-bit ISA), while the embedded transceivers provide the modern serial interface. Industrial temperature rating allows deployment in factory automation controllers where legacy processor cards need to be migrated to modern backplanes without rewriting firmware. Quartus II IP libraries provide ready-made bridging cores for common protocols.
Recommended
Aerospace and Defense Avionics Interfaces
The EP1AGX20CF484I6 supports MIL-STD-1553 and ARINC 429 avionics interface consolidation, where multiple legacy serial buses are aggregated into a single FPGA. Its industrial temperature grade meets many avionics bay environmental requirements, and its deterministic 90 nm silicon delivers the timing predictability required for safety-critical data buses. Designers implement the ARINC 429 transmitter/receiver logic in VHDL, using the abundant LAB resources for up to 32 simultaneous channels. The 484-FBGA package provides robust mechanical attachment for vibration-prone installations.
Recommended
Medical Imaging Reconstruction Pre-Processing
In medical imaging modalities such as ultrasound and CT, the EP1AGX20CF484I6 performs real-time beamforming and image reconstruction pre-processing. The FPGA's embedded multipliers handle the MAC-intensive beamforming calculations, while the transceivers aggregate raw data from multiple transducer arrays. Industrial temperature operation supports the controlled thermal environment of medical imaging carts. The 21,580 logic elements are sufficient for 64-channel beamforming, with the device's reprogrammability enabling late-stage algorithm updates as clinical protocols evolve.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF484I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF484C6 | EP1AGX20CF484C7 | EP1AGX20CF484C6N | EP1AGX20CF484C6NGA | EP1AGX20CF484C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (23x23) | 484-BGA (23x23) - same | 484-BGA (23x23) - same | 484-BGA (23x23) - same | 484-BGA (23x23) - same | 484-BGA (23x23) - same |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 |
| User I/O Pins | 230 | 230 | 230 | 230 | 230 | 230 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 6 | 6 | 7 | 6 | 6 | 7 |
| Lead-Free Finish | Yes (assumed) | Yes (assumed) | Yes (assumed) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Transceiver Speed | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
Key Differentiators
- Industrial temperature grade (-40C to +100C) vs commercial variants (vs EP1AGX20CF484C6)
- Speed grade 6 with stable supply chain for industrial designs (vs EP1AGX20CF484C7)
- Same die across all CF484-package variants enables design reuse (vs EP1AGX20CF484C6N)
Design Notes
The EP1AGX20CF484I6 requires multiple independent power rails: 1.2 V core (VCCINT), 3.3 V or 2.5 V I/O bank supplies (VCCIO), and a separate analog supply for the transceiver PLLs (VCCA). Per the Arria GX handbook, ramp rates must be monotonic and within datasheet limits to avoid latch-up. Use a dedicated LDO for VCCA to minimize jitter on the multi-gigabit transceivers, and decouple with 0.1 uF + 10 uF ceramic capacitors placed within 100 mils of each power pin.
The 484-BGA at 1.0 mm pitch (typical for this Altera package) requires a 4-6 layer PCB with microvia stack-up. Per the Altera package guidelines, use 0.8 mm finished laser-drilled microvias for the breakout and staggered vias for inner-row signals. Match differential pair lengths within 5 mils for the transceiver channels and implement 100 ohm differential impedance with controlled-impedance traces routed over a continuous ground reference plane.
Do not assume newer Quartus Prime versions support Arria GX - this family requires Quartus II 9.1 through 13.1. Use the Arria GX Device Handbook (not the generic Arria V handbook) for pinout, electrical characteristics, and IP library references. When migrating bitstreams between EP1AGX20CF484I6 and commercial-grade variants, re-validate timing because speed-grade differences (6 vs 7) directly affect fMAX of registered logic and DSP blocks.
Compliance Information
RoHS and lead-free per distributor listings on Mouser and Xecor. AEC-Q100 not formally qualified for automotive - use EP1AGX20CF484C6NGA for higher-reliability screening. REACH compliance assumed based on standard Intel/Altera policy.
