EP1C12Q240C6NAA - Cyclone FPGA 12060 LE 173 I/O | Intel
MPN: EP1C12Q240C6NAA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.5 | $47.50 |
| 10 | $42.8 | $428.00 |
| 100 | $38.2 | $3,820.00 |
| 500 | $34.6 | $17,300.00 |
| 1,000 | $31.9 | $31,900.00 |
| 3,000 | $29.4 | $88,200.00 |
Drop-in alternatives for EP1C12Q240C6NAA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C12Q240C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$119 / Unit
View Datasheet →EP1C12Q240C8N
✅ Drop-In✓ In Stock
$24.8 / Unit
View Datasheet →EP1C12Q240I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$30.85 / Unit
View Datasheet →EP1C12Q240C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.1 / Unit
View Datasheet →EP1C12Q240I7
✅ Drop-In✓ In Stock
$30.1 / Unit
View Datasheet →EP1C12Q240C6NAA Maximum Ratings & Electrical Characteristics
| Ordering Code | EP1C12Q240C6NAA |
| Series | Cyclone |
| Logic Elements / Cells | 12060 |
| RAM Bits | 239616 |
| Total User I/O | 173 |
| Package | 240-BFQFP |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| MSL Level | 3 (168 Hours) |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Temperature Grade | Commercial (C suffix) |
| Speed Grade | -6 |
EP1C12Q240C6NAA 240-bfqfp Pin Configuration Guide
Complete pinout information for EP1C12Q240C6NAA (240-bfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12Q240C6NAA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12Q240C6NAA is suitable for 6 applications: Industrial Motor Control, Industrial Automation and Machine Logic, Video and Image Preprocessing, Protocol Bridging and Communication Interfaces, Test and Measurement Instrumentation, Custom I/O Expansion and Co-Processing.
Industrial Motor Control
The EP1C12Q240C6NAA fits industrial motor and inverter control because its 12,060 logic elements can implement multiple PWM channels, hall/encoder interfaces, dead-time generation, and current-loop state machines simultaneously. Its 173 user I/O pins allow separate connections for gate-driver signals, current-sense ADCs, fault inputs, and a host microcontroller interface without complex external muxing. In a typical 240-pin QFP layout, the FPGA sits close to gate drivers and analog front-ends, giving deterministic switching timing independent of OS scheduling. Designers should place the motor-control PWM state machines in one clock domain and use the FPGA's embedded memory for small look-up tables such as sine tables or commutation sequences. The commercial -6 temperature grade is suitable for indoor industrial cabinets; use an industrial-temperature variant if the controller is mounted near the motor or in an unsealed enclosure.
Recommended
Industrial Automation and Machine Logic
For factory automation, the EP1C12Q240C6NAA provides parallel logic for PLC-style machine control, safety interlock logic, conveyor synchronization, and high-speed sensor acquisition. Its 12,060 logic elements are sufficient to replace many SSI/ASIC glue-logic functions and small CPLDs, while the 173 I/O count connects directly to limit switches, optocoupler inputs, valve drivers, and communication PHY chips. The 240-pin QFP package is easier to route on a 4-layer industrial controller board than a fine-pitch BGA, and the 1.5V core reduces heat compared with older 2.5V or 3.3V FPGAs. The FPGA is typically configured from a serial SPI flash after power-up, allowing field updates of machine behavior over an Ethernet or USB bootloader. Because industrial environments often contain electrical noise, add series resistors on high-speed inputs and filter slow digital inputs before they reach the FPGA package.
Recommended
Video and Image Preprocessing
In video capture and imaging systems, the EP1C12Q240C6NAA can perform line buffering, pixel synchronization, Bayer-to-RGB interpolation, thresholding, and simple spatial filtering before passing data to a DSP or application processor. The 239,616 RAM bits can be organized into line buffers for 8-bit or 16-bit pixel streams, while the 173 user I/O are sufficient for a parallel CMOS sensor bus, a DDR/parallel output bus, and configuration signals. A 240-pin QFP is easier to route physically to a flat-flex camera connector than a very dense BGA, which reduces prototype cost. For higher-resolution streams, the FPGA's usable logic may run out if too many complex convolution kernels are implemented; consider using a higher-density Cyclone variant or moving heavy processing to a downstream GPU/ASIC. Place clock and pixel-data groups in compatible I/O banks and add series damping resistors to match trace impedances.
Recommended
Protocol Bridging and Communication Interfaces
The EP1C12Q240C6NAA is useful for protocol bridging between parallel memory/interface buses and slower serial industrial buses, or for translating between multiple processor-like interfaces. Its 173 user I/O allow direct connection of 8-bit or 16-bit host buses, SDRAM-like interfaces, UARTs, SPI masters, and simple parallel FIFO interfaces. The embedded RAM can implement FIFO buffers that absorb rate mismatches between a high-speed capture bus and a low-speed output bus. Configuration is straightforward from a serial configuration device, making it easy to iterate a bridging protocol in the field. Because many industrial protocols are proprietary or timing sensitive, the parallel hardware structure of an FPGA gives deterministic transmit/receive timing that is difficult with interrupts in a microcontroller. Check the manufacturer's I/O standard support before connecting 5V legacy buses, and use level translators when required.
Recommended
Test and Measurement Instrumentation
For test and measurement front ends, the EP1C12Q240C6NAA can acquire parallel ADC data, generate stimulus patterns, implement trigger logic, and communicate with an embedded host processor. Its 12,060 logic elements can hold a small soft-core processor or finite-state-machine controller, while the 239,616 RAM bits are useful for acquisition buffers, sine wave lookup tables, and calibration coefficient storage. Because many bench instruments need clean timing edges and low-latency trigger responses, the FPGA's hardware gates are preferable to a purely software-based approach. The 240-pin QFP package fits well on instruments that use through-hole or mixed assembly methods. Thermal management is important when continuously acquiring high-speed samples at high ambient temperature; size the power supply for the FPGA core and I/O loads, and provide forced-air cooling if multiple channels are active simultaneously.
Recommended
Custom I/O Expansion and Co-Processing
The EP1C12Q240C6NAA is effective as a programmable I/O expansion and co-processing device next to an MCU, DSP, or application processor. Its 173 I/O pins can be split into independent parallel ports, serial interfaces, chip enables, and interrupt lines, freeing the host processor from low-level signal timing. Logic elements can implement DMA-like read/write state machines, address decoding, checksum generation, and small cryptography or protocol blocks. The 240-pin QFP package keeps the component on a standard PCB without requiring blind vias, so it is practical in many mixed-signal boards. When using this architecture, define the host interface first and reserve enough I/O for future board revisions; unused I/O can be left as no-connect but should be configured as inputs with pull-ups or outputs low to avoid floating nodes during configuration.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12Q240C6NAA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12Q240C6N | EP1C12Q240C8N | EP1C12Q240I7N |
|---|---|---|---|---|
| Package | 240-BFQFP | 240-BFQFP | 240-BFQFP | 240-BFQFP |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 12060 | 12060 | 12060 | 12060 |
| RAM Bits | 239616 | 239616 | 239616 | 239616 |
| User I/O Count | 173 | 173 | 173 | 173 |
| Temperature Grade | Commercial (C suffix) | Commercial (C suffix) | Commercial (C suffix) | Industrial (I suffix) |
| Speed Grade | -6 | -6 | -8 | -7 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- -6 speed grade provides faster timing performance than -8 alternatives in the same package (vs EP1C12Q240C8N)
- Same 240-BFQFP package enables direct PCB reuse across speed and temperature variants (vs EP1C12Q240I7N)
- 173 user I/O pins in a 240-pin QFP, avoiding BGA routing complexity for I/O-centric designs (vs EP1C12F324I7N)
Design Notes
EP1C12Q240C6NAA uses a 1.5V core per the Cyclone family ordering reference, and the 240-pin package contains multiple core/IO power pins. Place low-ESR 0.1uF ceramic capacitors close to each power pin and provide bulk capacitors of at least 10uF per major power rail. Separate analog ground and digital ground only where recommended by the board's mixed-signal architecture; avoid splitting the ground plane under the FPGA because it can worsen noise for large QFP packages.
Estimated: since this is a 240-pin plastic QFP without an exposed pad, heat is removed primarily through package leads and board copper. For continuous operation with high I/O activity and large logic utilization, add airflow or a clip-on heatsink if the ambient temperature exceeds about 70C. The thermal resistance depends on PCB copper area, airflow, and solder joint quality; verify junction temperature using the manufacturer's thermal model or an actual prototype measurement.
Lock FPGA pin assignments before the PCB layout begins. Use the Intel/Altera Quartus pin planner and the Cyclone pin-out files for the 240-BFQFP package to avoid bank conflicts and configuration-pin conflicts. Keep high-speed clock inputs short and terminated according to the I/O standard; add series resistors on fast parallel data outputs to control overshoot. Because the package has 240 pins, route outward from the center of the package using multiple routing layers for complex designs.
Compliance Information
The trailing 'N' in Altera/Intel ordering codes often indicates a lead-free/RoHS-compliant package, but this was not explicitly verified in the fetched data. Confirm RoHS and REACH status from the manufacturer datasheet or an authorized distributor compliance report before use in regulated products.
