EP1C12Q240C7 - Cyclone FPGA 12K LEs 240-PQFP | Intel (Altera)
MPN: EP1C12Q240C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $60.48 | $60.48 |
| 10 | $55.2 | $552.00 |
| 100 | $48.9 | $4,890.00 |
| 500 | $42.3 | $21,150.00 |
| 1,000 | $36.75 | $36,750.00 |
Drop-in alternatives for EP1C12Q240C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C12Q240C6N
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View Datasheet →EP1C12Q240C8N
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View Datasheet →EP1C12Q240I7
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View Datasheet →EP1C12Q240C7N
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View Datasheet →EP1C12Q240I7N
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View Datasheet →EP1C12Q240C6
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View Datasheet →EP1C12Q240C7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Logic Elements | 12,060 |
| Embedded Memory Bits | 239,616 bits |
| Total RAM Bits | 239,616 |
| Number of Logic Cells / LEs | 12,060 |
| Number of LABs / CLBs | 1,206 |
| User I/O Pins | 173 |
| Number of I/O Banks | 8 (per datasheet family) |
| Number of PLLs | 2 (per Cyclone family spec; verify with revision) |
| Number of Multipliers (18x18) | 52 (Cyclone family) |
| Supply Voltage Core | 1.5 V |
| Process Technology | 130 nm SRAM |
| Package Type | 240-BFQFP (PQFP, 0.5 mm pitch) |
| Mounting Type | Surface Mount (gull-wing) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | 7 |
| Configuration | Volatile SRAM, external config device required |
EP1C12Q240C7 240-bfqfp (pqfp, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for EP1C12Q240C7 (240-bfqfp (pqfp, 0.5 mm pitch) package) with 173 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C12Q240C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 173 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C12Q240C7 is suitable for 6 applications: Industrial Control & Factory Automation, Telecom Line-Card Glue Logic, Video Processing Front-End, Software Defined Radio Baseband, Legacy Parallel Bus Extension, Motor Control & Power Conversion.
Industrial Control & Factory Automation
The EP1C12Q240C7 fits industrial control cabinets thanks to its 12,060 logic elements and 173 user I/O, which comfortably absorb encoder counting, PWM generation, and parallel bus glue logic that bridges PLC backplanes to stepper/servo drivers. With four PLLs it can synthesize independent clock domains for CAN, RS-485, and EtherCAT PHYs from a single 50 MHz crystal, eliminating multiple oscillators on the BOM. The BFQFP 240-pin package is hand-solderable for prototype retrofits and supports the 0C to 85C commercial range used in climate-controlled enclosures.
Recommended
Telecom Line-Card Glue Logic
The EP1C12Q240C7 is well suited to telecom line cards where it implements TDM bus aggregation, framing/deframing, and protocol bridging between backplane SERDES and payload processors. Its 52 dedicated 18x18 hardware multipliers handle A-law/u-law companding and small FIR filters without burning general-purpose LEs. The 239,616 bits of M4K RAM act as elastic buffers and rate-matching FIFOs between asynchronous clock domains. Hot-swap and JTAG support enable in-system reconfiguration during card insertion, and the 240-pin PQFP gives test-fixture access for ICT coverage.
Recommended
Video Processing Front-End
The EP1C12Q240C7 is used as a video front-end for capture cards, performing BT.656/BT.1120 decoding, color-space conversion, deinterlacing, and OSD overlay before pushing pixels to a DSP or SoC. Its 173 I/O pins allow parallel 16-bit ITU-R BT.656 input plus 24-bit RGB output plus control signals, all at 27-148.5 MHz pixel rates. The dedicated 18x18 multipliers accelerate 3x3 convolution kernels for sharpening or chroma filtering. M4K RAM blocks store line buffers with simple dual-port access, eliminating external SRAM in cost-sensitive designs.
Recommended
Software Defined Radio Baseband
In SDR baseband preprocessing, the EP1C12Q240C7 implements digital down-conversion (DDC), decimation filters, and channelizer logic between a high-speed ADC and a host processor. Its PLLs synthesize coherent sample clocks from a TCXO reference, while the 52 hardware 18x18 multipliers execute CIC and FIR compensation filters at baseband sample rates up to ~100 MHz. The 173 I/O pins accept parallel LVDS ADC data plus reference clock and sync, making it a cost-effective alternative to dedicated DSP chips for moderate-channel-count receivers in commercial wireless infrastructure.
Recommended
Legacy Parallel Bus Extension
The EP1C12Q240C7 serves as a bridge between modern SoCs and legacy 8/16-bit parallel peripherals such as ISA cards, VME bus, PC/104 modules, or proprietary DSP interfaces. With 173 user I/O it can implement a full 16-bit data bus plus 24-bit address plus control signals in a single chip, replacing 4-6 legacy bus-driver PLDs. The Quartus II design flow lets engineers instantiate bus arbiters, wait-state generators, and interrupt controllers as IP cores. Volatile SRAM configuration is acceptable since the device is permanently mounted on a production board.
Recommended
Motor Control & Power Conversion
The EP1C12Q240C7 handles Field-Oriented Control (FOC) and Space Vector PWM (SVPWM) for three-phase motor drives and solar inverters, where deterministic timing and parallel processing outperform microcontrollers. Its PLLs multiply a low-frequency crystal up to multi-MHz PWM carrier rates, while 52 dedicated multipliers execute Park/Clarke transforms and PI controllers in real time. The 173 user I/O drive gate-driver enable signals, brake control, and ADC sampling triggers, and the BFQFP package dissipates heat adequately for switching frequencies up to ~50 kHz with reasonable dead-time insertion.
Recommended
Recommended Products Summary
Engineering reference data for EP1C12Q240C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C12Q240C6N | EP1C12Q240C8N | EP1C12Q240I7 | EP1C12Q240C7N | EP1C12Q240C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-BFQFP (PQFP) | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same | 240-BFQFP (PQFP) - same |
| Speed Grade | 7 | 6 (faster) | 8 (slower) | 7 (same) | 7 (same) | 6 (faster) |
| Logic Elements | 12,060 | 12,060 (same) | 12,060 (same) | 12,060 (same) | 12,060 (same) | 12,060 (same) |
| User I/O Pins | 173 | 173 | 173 | 173 | 173 | 173 |
| Embedded RAM | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits | 239,616 bits |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C |
| Lead-Free Finish | [DATA_NEEDED] | Yes (N suffix) | Yes (N suffix) | [DATA_NEEDED] | Yes (N suffix) | No (SnPb) |
Key Differentiators
- 240-BFQFP package with 173 user I/O is hand-solderable for prototype retrofit (vs EP1C12F324C7 (324-FBGA))
- Cyclone I family with 130 nm process provides mature Verilog/VHDL synthesis (vs Modern Cyclone IV/V (40 nm/28 nm))
- 12,060 LEs with 239,616 bits of M4K RAM is cost-optimized for glue logic density (vs EP1C6Q240C8 (6K LEs, same 240-BFQFP))
Design Notes
Estimated: at 100% LE utilization with 173 I/O toggling at 100 MHz, the EP1C12Q240C7 core draws roughly 0.6 A from VCCINT (1.5 V) plus 0.2-0.5 A per VCCIO bank depending on switching frequency and load. Decoupling must use a 100 uF bulk + 0.1 uF X7R per power pin pair, placed within 5 mm of the pin. Use a separate 1.5 V regulator for VCCA (PLL analog supply) with a ferrite bead filter from VCCINT to suppress switching noise on the PLL reference.
The 240-pin BFQFP at 0.5 mm pitch requires 4-layer PCB minimum with continuous power and ground planes for return-current integrity. Fanout from perimeter pads to inner layers should use 0.15 mm (6 mil) traces with 0.2 mm (8 mil) spaces to maintain impedance control. Place an EPCS1/EPCS4 configuration flash within 50 mm of the FPGA DATA0/DCLK/nCONFIG pins to avoid configuration failures; longer traces need series termination.
MSEL[2:0] configuration-mode pins must be tied to VCCIO or GND through 1 kohm resistors and never left floating, or the device may enter an undefined configuration state. CONF_DONE must be pulled up to VCCIO via 10 kohm; nSTATUS must be pulled up to VCCIO via 10 kohm; nCONFIG requires an external pull-up plus a momentary push-button or supervisor to trigger reconfiguration. Volatile SRAM means the design is lost at every power-down - an EPCS flash is mandatory for stand-alone boot.
The 240-BFQFP package has a theta_JA of approximately 25 C/W (estimated for JEDEC EIA/JESD51 4-layer test board with airflow). At 1.5 W total dissipation, junction temperature rises ~38 C above ambient, leaving safe headroom within the 0C to 85C commercial range. For sealed enclosures, derate by 0.5 C/W per side and consider adding 100 cm^2 of copper pour on top side or thermal vias to inner ground plane.
Compliance Information
Original Cyclone I PQFP parts are typically SnPb-finished and not RoHS-compliant; the 'N' suffix variants are lead-free. RoHS and lead-free status of this exact lot must be verified with the supplier. AEC-Q100 is not applicable for this commercial-grade FPGA; the I7 industrial variant is also not AEC-Q100 qualified for automotive use.