EP1K100FC484-2NGZ - ACEX-1K FPGA, 100K Gates, 484-BGA | Intel
MPN: EP1K100FC484-2NGZ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85 | $850.00 |
| 100 | $72 | $7,200.00 |
| 500 | $60 | $30,000.00 |
| 1,000 | $52 | $52,000.00 |
EP1K100FC484-2NGZ Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the customer can reconfigure in the field after manufacture. FPGAs sit above CPLDs in the programmable-logic hierarchy and below ASICs in terms of per-unit cost versus design flexibility, making them ideal for prototyping, low-to-mid volume production, and applications where time-to-market outweighs NRE. The ACEX-1K family was Altera's first-generation SRAM-based FPGA with embedded memory blocks, and is positioned between the FLEX 6000/8000 and the later APEX/Cyclone families.
Key features of the EP1K100FC484-2NGZ include 4,992 LEs, 49,152 RAM bits organized into embedded array blocks (EABs), 333 maximum user I/O, a 2.375 V to 2.625 V core supply, in-system programmability via the Altera serial configuration scheme, and PCI-compliant I/O. The -2 speed grade is the faster of the two commercial speed grades offered for this die. JTAG (IEEE 1149.1) boundary-scan and dedicated configuration pins are integrated.
Architecturally, the device combines a fine-grained LAB fabric with coarse-grained EAB memory, allowing designers to map both random logic and small FIFOs/ROM/RAM into a single chip. The 0.25 um SRAM process and 2.5 V core (with 3.3 V PCI-tolerant I/O) make this device a representative member of the late-1990s/early-2000s Altera mid-density FPGA portfolio.
Typical applications include telecommunications interface cards, industrial control logic, glue logic and bus bridging on PCI add-in cards, low-volume ASIC replacement, and educational/development platforms that target the legacy MAX+PLUS II or Quartus design flow. The wide 333-I/O budget also suits parallel bus interfaces and backplane bridging.
Design consideration: the EP1K100FC484-2NGZ is now classified Obsolete by some distributors. Verify long-term supply before committing to new designs, and plan a migration path to the Cyclone series if production lifetime requirements exceed 5 years.
This page synthesizes distributor pricing, same-brand drop-in alternatives, lifecycle status and practical design notes not found in the manufacturer datasheet, giving procurement and FPGA engineers a single decision-ready reference.
Drop-in alternatives for EP1K100FC484-2NGZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K100FC484-2NGZ (same form factor and footprint) — differing in Process Technology, Configuration Method, Speed Grade, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FC484-2N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EP1K100FC484-1N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K100FC484-1
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP1K100FI484-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1K100EFI484-2
✅ Drop-In✓ In Stock
$67.5 / Unit
View Datasheet →EP1K100FC484-2NGZ Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Logic Elements / Cells | 4,992 |
| Number of LABs / CLBs | 624 |
| Total RAM Bits | 49,152 |
| Number of Gates | 257,000 (typical system gates: 100,000) |
| Number of User I/O | 333 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Speed Grade | -2 |
| Operating Temperature | 0 C to 70 C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 484-FBGA (23 mm x 23 mm) |
| Configuration Method | SRAM, serial (Altera EPC/EPC2) or JTAG |
| JTAG (IEEE 1149.1) | Yes |
| Process Technology | 0.25 um SRAM CMOS |
EP1K100FC484-2NGZ 484-fbga (23 mm x 23 mm) Pin Configuration Guide
Pin configuration for EP1K100FC484-2NGZ (484-fbga (23 mm x 23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K100FC484-2NGZ.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1K100FC484-2NGZ is suitable for 6 applications: Telecom Line-Card Glue Logic, PCI Add-in Card Controller Logic, Industrial Control and Machine Interface, ASIC Replacement / Low-Volume Production, Legacy Development and Education Platforms, Parallel Bus Bridging and Memory Interface.
Telecom Line-Card Glue Logic
The EP1K100FC484-2NGZ fits telecom line cards because its 4,992 LEs and 333 user I/Os are sized exactly for backplane glue, bus-bridging and protocol adaptation between TDM framers, Ethernet MACs and ASIC/ASSP front-ends. The 2.5 V core with PCI-compliant 3.3 V I/O allows direct interface to legacy PCI bus devices without external level shifters. Its 49,152 bits of embedded SRAM in EABs handle small FIFOs and look-up tables for routing tables without external memory, simplifying BOM and reducing board area on dense line cards.
Recommended
PCI Add-in Card Controller Logic
The EP1K100FC484-2NGZ is widely deployed on PCI add-in cards because it natively supports 33 MHz/66 MHz, 32-bit/64-bit PCI with on-chip PCI-compliant I/O buffers and the dedicated nCONFIG/nSTATUS/CONF_DONE configuration chain. With 100K gates and 333 I/Os, it implements state machines, scatter-gather DMA engines and bus-master controllers in a single device. The 0-70C commercial temperature grade suits PCI cards installed in climate-controlled servers and desktops; designers should still observe 2.5 V core and 3.3 V PCI signaling rules in timing closure.
Recommended
Industrial Control and Machine Interface
For industrial control front-ends and HMI panels, the EP1K100FC484-2NGZ provides enough logic and 333 I/Os to drive parallel LCD/TFT interfaces, keypads, motor-control PWM and serial fieldbus bridges (Modbus, Profibus, CAN) in a single chip. The 49,152-bit on-chip memory stores waveform tables, character fonts and small protocol stacks without external SRAM, reducing BOM cost. Although the commercial 0-70C temperature grade suits panel-internal environments, designs destined for outdoor or factory-floor deployment should select the EP1K100FI484-2 industrial variant.
Recommended
ASIC Replacement / Low-Volume Production
The EP1K100FC484-2NGZ is a classic ASIC-replacement vehicle for low-volume production (typically 100 to 10,000 units) where the NRE of a full ASIC is uneconomic. With 100,000 system gates, 49,152 bits of EAB RAM and SRAM-based in-system programmability, designers can iterate firmware-equivalent (bitstream) updates post-deployment via JTAG or Altera EPC configuration ROMs. Although now Obsolete, distributor stock of the EP1K100FC484-2NGZ remains available for re-spin of legacy designs until inventory is exhausted.
Recommended
Legacy Development and Education Platforms
The EP1K100FC484-2NGZ remains in university curricula and legacy development kits that teach SRAM-based FPGA architecture, JTAG configuration, and the Altera MAX+PLUS II/Quartus design flow. Its 484-FBGA is large enough for students to practice fine-pitch BGA rework and pin-constrained floorplanning while staying within the 100K-gate complexity sweet spot. Because the part is supported in older Quartus II service packs and legacy MAX+PLUS II software, it is ideal for coursework that targets Altera/Intel legacy FPGA design entry.
Recommended
Parallel Bus Bridging and Memory Interface
The EP1K100FC484-2NGZ is well suited to bridge between legacy parallel buses (e.g. PC/104, VME, ISA, proprietary 16/32-bit backplanes) and modern peripherals or processors, thanks to its 333 user I/Os. The 49,152-bit EAB SRAM implements small dual-port buffers and FIFOs that decouple mismatched bus clocks, while 4,992 LEs handle the address decoding, byte-enable logic and interrupt glue. Designers using the part should pay attention to the 2.5 V core and 3.3 V I/O voltage domains and use series-resistor or level-translator techniques for 5 V legacy buses.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC484-2NGZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC484-2N | EP1K100FC484-2 | EP1K100FC484-1N | EP1K100FI484-2 | EP1K100EFI484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Series | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/O | 333 | 333 | 333 | 333 | 333 | 333 |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -2 | -2 |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial, enhanced) |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.5 V / 5 V tolerant I/O |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same die, same 484-FBGA, same -2 speed grade - bit-for-bit drop-in (vs EP1K100FC484-2N)
- Speed-grade upgrade on the same footprint (vs EP1K100FC484-1N)
- Industrial-temperature variant on same footprint (vs EP1K100FI484-2)
- Enhanced industrial variant with 5 V tolerant I/O (vs EP1K100EFI484-2)
Design Notes
Estimated: The EP1K100FC484-2NGZ core operates from 2.5 V; I/O banks support 3.3 V PCI signaling. A typical 50% utilization design with all 333 I/Os toggling draws roughly 0.5-1.0 A from the 2.5 V rail, so design the LDO (e.g. 2.5 A buck) with adequate headroom. Decouple each VCCINT/VCCIO ball pair with 0.1 uF plus 10 uF bulk within the ball-grid escape radius.
The 484-FBGA uses 1.0 mm ball pitch on a 23x23 mm body; escape routing requires microvia (HDI) stack-up with at least 4-6-4 build-up layers. Use via-in-pad or dog-bone fan-out per the Altera BGA escape guidelines, and follow the ACEX-1K pin table for VCC/VSS ball placement to keep power planes contiguous.
Configuration mode pins (MSEL0, MSEL1) select between EPC serial, JTAG and Fast Passive Parallel modes - wiring them incorrectly is the #1 reason ACEX-1K boards fail to configure. Also ensure CONF_DONE is pulled high via 10 kohm and nCONFIG/nSTATUS are properly debounced. Without an EPC configuration ROM, the SRAM configuration is lost on every power cycle.
Estimated: at 100% utilization and 333 I/Os switching at 33 MHz PCI, expect 1.5-2.5 W dissipation in still air. The 484-FBGA has no exposed die pad; thermal relief relies on PCB copper pour under the package. Use at least 4 thermal vias (0.3 mm drill) under the central ball grid to inner-plane copper for 15-20 C/W theta_JA improvement.
Compliance Information
"N" suffix historically denotes lead-free terminal finish per Altera/Intel legacy part-number convention, but a current RoHS/REACH CoC must be requested from the distributor. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified IC.
