EP1S25F672I7 - Stratix FPGA 25660 LE, 672-FBGA | Intel / Altera
MPN: EP1S25F672I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 50 | $155 | $7,750.00 |
| 100 | $142 | $14,200.00 |
| 250 | $130 | $32,500.00 |
EP1S25F672I7 Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital functions ranging from glue logic to full system-on-chip prototypes. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy, offering hardware-timed parallelism for DSP, communications, and protocol bridging. The Stratix family specifically targets high-performance applications with embedded multipliers, memory blocks, and dedicated clock management circuitry, positioning it within the broader class of programmable logic devices (PLDs) under the semiconductor category.
Key features include 473 maximum user I/O pins, a 1.5 V core supply voltage, 1.27 mm ball pitch, and industrial-grade operating temperature range of -40 °C to +100 °C (industrial) per datasheet, with 0 °C to +85 °C noted in some distribution listings. The device supports in-system programmability via JTAG, dedicated configuration circuitry, and multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks.
Typical applications include telecom baseband processing, high-speed serial protocol bridging, software-defined radio, video processing pipelines, and ASIC prototyping. Its combination of dense logic, embedded RAM, and high I/O count makes it well suited for designs requiring parallel datapath implementation alongside flexible I/O configuration.
When designing with this device, ensure PCB layout accommodates the 672-ball FBGA with controlled-impedance routing for high-speed LVDS pairs and adequate decoupling per Altera's Stratix hardware reference design. The device's obsolete lifecycle status means new designs should consider Cyclone IV/V or Stratix IV/V successors; existing designs should source from authorized distributors carrying traceable stock. This page synthesizes distributor pricing, drop-in alternatives, and engineering notes not consolidated elsewhere.
Drop-in alternatives for EP1S25F672I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S25F672I7 (same form factor and footprint) — differing in Package, Process Technology, Family, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C8N
✅ Drop-In✓ In Stock
$179.4 / Unit
View Datasheet →EP1S25F672C7N
✅ Drop-In✓ In Stock
$535 / Unit
View Datasheet →EP1S25F672C6N
✅ Drop-In✓ In Stock
$192.75 / Unit
View Datasheet →EP1S25F672C6ES
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F672C5N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1S25F672I7 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | EP1S25 |
| Number of Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O Pins | 473 |
| Supply Voltage (Core) | 1.5 V |
| Package | 672-FBGA (672-BBGA) |
| Package Dimensions | 35 x 35 mm |
| Ball Pitch | 1.27 mm |
| Mounting Type | Surface Mount |
| Operating Temperature (datasheet) | -40 °C to +100 °C |
| Operating Temperature (distributor listing) | 0 °C to +85 °C |
| Logic Family | CMOS |
| Process Technology | 0.13 µm CMOS |
| RoHS Status | Compliant |
| Programming Method | JTAG / in-system |
EP1S25F672I7 35 x 35 mm Pin Configuration Guide
Pin configuration for EP1S25F672I7 (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S25F672I7 is suitable for 6 applications: Telecom Baseband Processing, Software-Defined Radio (SDR) Platforms, High-Speed Protocol Bridging, Video Processing Pipelines, ASIC Prototyping, Industrial Motor Control.
Telecom Baseband Processing
The EP1S25F672I7's 25,660 logic elements and 1,944,576 embedded RAM bits make it well suited for telecom baseband signal processing where parallel datapath implementation and DSP block utilization directly drive channel density. Its 1.5 V core and 473 user I/Os accommodate multiple LVDS links to ADC/DAC front ends and backplane interfaces. The Stratix TriMatrix memory architecture supports distributed and block RAM simultaneously, enabling both high-throughput packet buffers and coefficient storage for matched filters. Industrial temperature grade (-I7) qualifies the device for outdoor base-station enclosures where ambient swings exceed 0-85 °C.
Recommended
Software-Defined Radio (SDR) Platforms
Software-defined radio systems benefit from the EP1S25F672I7's combination of high logic density and embedded DSP blocks, allowing multi-channel up/down-conversion, FIR filtering, and modulation/demodulation to be implemented in parallel hardware. The 473 user I/Os support direct interfacing to wideband ADC/DAC pairs and digital up-converter chips, while the 1.5 V core minimizes switching noise in mixed-signal RF boards. Per Stratix handbook references, the DSP block architecture enables multiply-accumulate operations at hundreds of MHz, sufficient for LTE and WiMAX baseband sample rates in legacy infrastructure designs.
Recommended
High-Speed Protocol Bridging
Protocol bridging between RapidIO, SPI-4.2, PCI-X, and custom serializer interfaces requires the high I/O count and configurable I/O standards of EP1S25F672I7. The 672-FBGA package exposes 473 user pins distributed across multiple I/O banks, allowing simultaneous 1.5V, 2.5V, and 3.3V signaling required when bridging between legacy 5V-tolerant and modern low-voltage peripherals. Industrial temperature grade ensures operation in factory-floor and outdoor networking equipment. The Stratix LVDS capability supports multi-gigabit serial links without external transceivers in some configurations.
Recommended
Video Processing Pipelines
Video processing designs requiring real-time HD-SDI, DVI, or Camera Link handling benefit from EP1S25F672I7's 25,660 logic elements to implement multi-tap filters, color-space converters, and frame buffers in a single device. The 1,944,576 bits of embedded RAM provide line-buffer and lookup-table storage sufficient for 1080p processing at 60 Hz without external memory. The 672-FBGA package's 473 user I/Os accommodate parallel RGB/YCbCr buses plus auxiliary control interfaces. Industrial temperature grade supports broadcast equipment and medical imaging installations.
Recommended
ASIC Prototyping
The EP1S25F672I7 serves as a mid-density ASIC prototyping platform for validating designs targeting 100K-200K ASIC gate equivalents. Its 25,660 logic elements, 2,566 LABs, and 1.5 V core allow RTL designs to be compiled directly to silicon with predictable timing closure using Quartus II timing analysis. The 473 user I/Os expose full FPGA pins for bring-up test access. Multiple EP1S25F672I7 devices can be paralleled on a prototyping board to emulate larger ASICs, leveraging identical 672-FBGA footprints for repeatable board layouts.
Recommended
Industrial Motor Control
Precision motor control loops for servo drives and industrial automation leverage EP1S25F672I7's deterministic logic fabric and embedded DSP blocks to implement field-oriented control (FOC), space-vector PWM, and encoder feedback processing within microsecond latency budgets. The industrial temperature grade (-40 °C to +100 °C junction) qualifies the device for factory-floor cabinets with elevated ambient temperatures. The 473 user I/Os accommodate quadrature encoder inputs, Hall sensor arrays, gate driver interfaces, and CAN/Ethernet communication ports in a single-chip solution.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C8N | EP1S25F672C7N | EP1S25F672C6N | EP1S25F672C6ES | EP1S25F672C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (35x35mm, 1.27mm pitch) | 672-FBGA (35x35mm, 1.27mm pitch) - same | 672-FBGA (35x35mm, 1.27mm pitch) - same | 672-FBGA (35x35mm, 1.27mm pitch) - same | 672-FBGA (35x35mm, 1.27mm pitch) - same | 672-FBGA (35x35mm, 1.27mm pitch) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/O | 473 | 473 | 473 | 473 | 473 | 473 |
| Speed Grade | -I7 (industrial, slowest) | -C8 (commercial, fastest C) | -C7 (commercial, same speed) | -C6 (commercial, faster) | -C6 ES (commercial, faster) | -C5 (commercial, fastest overall) |
| Operating Temperature | -40 to +100 °C (junction) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ES status) | Obsolete |
Key Differentiators
- Industrial temperature grade with junction rating to +100 °C (vs EP1S25F672C8N)
- Drop-in compatible within the EP1S25 family (vs EP1S25F780C5)
- Established Stratix architecture with mature toolchain support (vs EP1M350F780C7N)
Design Notes
Estimated: With 25,660 logic elements at typical 50% utilization running at 200 MHz and 1.5 V core, the EP1S25F672I7 dissipates approximately 1.5-2.5 W dynamic power plus static leakage. The 672-FBGA package requires thermal vias under the center balls and connection to inner copper planes for heat spreading. Per Stratix hardware reference designs, forced airflow (200 LFM minimum) or a heatsink attached via thermal interface material is recommended when junction temperature must remain below 100 °C for industrial environments.
The 672-ball FBGA with 1.27 mm pitch requires microvia technology (laser-drilled 0.1 mm vias) or via-in-pad construction for reliable breakout on a 4-6 layer PCB stack-up. Use a 1.5 V core plane and dedicated VCCIO planes per I/O bank voltage (1.5V/1.8V/2.5V/3.3V). Decoupling requires 0.1 µF and 0.01 µF ceramic capacitors within 100 mils of each VCCINT/VCCIO/VCC_PLL ball group; bulk 47-100 µF tantalum or polymer capacitors handle transient response for switching I/O banks.
LVDS pairs and high-speed clock traces on the EP1S25F672I7 require 100 Ω differential impedance routing with matched lengths within 20 mils. Series termination resistors should be placed within 200 mils of the driver pins. For SSTL/HSTL memory interfaces, VREF trace routing must avoid parallel routing with switching signals to prevent coupling. Use Altera's Quartus II board-level signal integrity analysis to validate transmission line effects before layout freeze.
Do not confuse the -I7 industrial speed grade with -7 timing closure; -I7 is the slowest industrial bin and may not meet timing in designs that close cleanly on -C6 or -C7 commercial parts. When migrating from commercial EP1S25F672C6/C7/C8 to industrial EP1S25F672I7, expect approximately 15-25% timing degradation and plan margin accordingly. Also note that configuration schemes (AS, AP, PS, JTAG) require specific MSEL pin strapping - consult the Stratix handbook configuration chapter before PCB layout.
Compliance Information
RoHS compliant per Xecor listing. Lead-free BGA construction per Stratix family transition. REACH and conflict mineral declarations should be requested directly from Intel. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC.
