EP1S60F1020C6 - Stratix FPGA 57120 Cells 1020-BGA | Intel / Altera
MPN: EP1S60F1020C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $120 | $60,000.00 |
| 1,000 | $105 | $105,000.00 |
Drop-in alternatives for EP1S60F1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S60F1020C5N
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View Datasheet →EP1S60F1020C5
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View Datasheet →EP1S60F1020C7N
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View Datasheet →EP1S60F1020
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View Datasheet →EP1S40F1020C6
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View Datasheet →EP1S60F1020C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | EP1S60 |
| Logic Elements | 57,120 |
| Logic Array Blocks (LABs) | 6,570 |
| Embedded Memory Bits | 5,215,104 |
| Maximum User I/O Pins | 773 |
| DSP Blocks | 12 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 450.05 MHz |
| Package | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Speed Grade | C6 |
EP1S60F1020C6 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S60F1020C6 (1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch package) with 773 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020C6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 773 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020C6 is suitable for 6 applications: Telecom Baseband Processing, High-Throughput Video and Image Processing, ASIC Prototyping and Emulation, Industrial Control and Embedded Computing, Test and Measurement Instrumentation, Military and Aerospace Legacy Systems.
Telecom Baseband Processing
The EP1S60F1020C6's 57,120 logic elements and 12 dedicated DSP blocks deliver the gate count and multiply-accumulate throughput needed for early-generation telecom baseband and protocol-bridging designs. Its 5,215,104 bits of embedded TriMatrix memory buffer packet streams and intermediate DSP results without external SRAM, reducing board complexity. The 1020-ball FBGA package supports the high I/O count required to drive multiple standard telecom interfaces in parallel. Per the Stratix Family Data Sheet typical applications, this device fits cleanly into TDM-to-Ethernet bridges, channelized voice processing, and backhaul aggregation cards where deterministic latency and high DSP throughput are non-negotiable.
Recommended
High-Throughput Video and Image Processing
The 12 dedicated DSP blocks combined with 5.2 Mbits of internal memory make the EP1S60F1020C6 well suited for SD/HD video processing pipelines, image pre-processing, and real-time video analytics. Designers can implement motion estimation, color-space conversion, and overlay blending directly in the fabric without external frame buffers in many cases. The 1020-ball FBGA exposes the LVDS and LVTTL I/O needed to drive parallel video buses and DVI/HDMI bridges. Use the device's PLL resources to derive the precise pixel clocks required by broadcast video standards, while the JTAG-based configuration supports rapid firmware iteration during product bring-up.
Recommended
ASIC Prototyping and Emulation
With 57,120 logic elements and abundant TriMatrix memory, the EP1S60F1020C6 was a workhorse for ASIC and ASSP prototyping in the 130 nm design era, providing the density required to map large ASIC RTL blocks into a single FPGA. Multiple EP1S60 devices can be tiled across a multi-FPGA prototyping board to validate ASIC-class designs before tape-out. The 1020-ball FBGA's high I/O count enables high-fidelity partitioning between multiple FPGAs in such an array. JTAG-based configuration simplifies fast bitstream swapping during regression runs.
Recommended
Industrial Control and Embedded Computing
The EP1S60F1020C6's commercial temperature range (0 °C to +85 °C), high logic density, and broad I/O standard support make it a fit for industrial controllers, machine-vision processing cards, and embedded computing modules. Its 130 nm CMOS core draws predictable power and is supported by mature Quartus II tool flows, simplifying long-life industrial product maintenance. The 1020-ball FBGA exposes PCI, LVDS, and LVTTL interfaces commonly used for backplane connectivity in industrial PCs and PLCs. Industrial-grade EP1S60F1020I6 variants exist for -40 °C to +100 °C operation if the application requires it.
Recommended
Test and Measurement Instrumentation
Engineers building protocol analyzers, logic analyzer backends, and high-speed data acquisition cards leverage the EP1S60F1020C6's 57,120 logic elements to implement pattern generation, real-time compression, and trigger logic in a single device. The 12 DSP blocks support on-chip FFT and digital filtering pre-processing, reducing the burden on the host processor. The 1020-ball FBGA package provides sufficient I/O for parallel LVDS acquisition channels and trigger fanout. Mature Quartus II design flows allow test-equipment vendors to maintain long product lifecycles for their installed base.
Recommended
Military and Aerospace Legacy Systems
Long-lifecycle aerospace, defense, and avionics programs continue to support EP1S60F1020C6 in deployed fielded systems where the bill of materials is frozen and re-qualification of new silicon is cost-prohibitive. The 1020-ball FC-FBGA's robust thermal mass and the Stratix family's documented reliability make it suitable for ruggedized board designs. Specialty distributors continue to franchise this part for defense sustainment programs. Note that the part is commercial-temperature graded; for full MIL-grade operation, a flight-grade screened variant must be sourced separately.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C5N | EP1S60F1020C5 | EP1S60F1020C7N | EP1S60F1020 | EP1S40F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BGA (FBGA), 33 × 33 mm | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same |
| Logic Elements | 57,120 | 57,120 (same die) | 57,120 (same die) | 57,120 (same die) | 57,120 (same die) | 41,250 (-28%) |
| Embedded Memory Bits | 5,215,104 | 5,215,104 (same die) | 5,215,104 (same die) | 5,215,104 (same die) | 5,215,104 (same die) | 3,423,744 (-34%) |
| Maximum User I/O | 773 | 773 (same die) | 773 (same die) | 773 (same die) | 773 (same die) | [DATA_NEEDED] |
| Speed Grade | C6 | C5N (slower) | C5 (slower) | C7N (lower power) | C6 (default) | C6 (same speed grade) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) |
| Lead-Free Finish | [DATA_NEEDED: lead_free_flag] | Yes (N suffix) | No (SnPb) | Yes (N suffix) | [DATA_NEEDED] | No (SnPb) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Original Stratix family — long-standing tool-chain maturity (vs EP1S40F1020C6)
- C6 speed grade targets higher fMAX (vs EP1S60F1020C7N)
- Lead-free terminal finish (vs EP1S60F1020C5)
Design Notes
The EP1S60F1020C6 requires a multi-rail power architecture: 1.5 V core, plus per-bank VCCIO rails for each I/O bank (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V depending on I/O standard). Place bulk decoupling (10 µF to 47 µF tantalum or polymer) within 25 mm of each power pin and high-frequency 0.1 µF X7R ceramic within 2 mm of every VCC pin. Estimated ICC core current at full utilization can exceed 2 A; size the 1.5 V regulator with at least 30 % margin and route the sense pin directly to the device's VCC pin to absorb PCB IR drop.
Estimated: at full utilization with 50 % toggle rate the 1020-ball FBGA can dissipate 5-8 W, producing a junction temperature rise of 15-25 °C above ambient with the standard 4-layer JEDEC test board. Use at least a 6-layer PCB with a continuous inner ground plane and follow Altera's thermal via array under the BGA (at least 9 thermal vias per cm² of die area). For chassis-mounted designs with restricted airflow, attach a small heatsink with thermal interface material rated for the 0.85 mm-thick BGA package height.
Routing escape from a 1020-ball FC-FBGA at 1 mm pitch requires microvia or via-in-pad technology on a high-density-interconnect PCB stackup. Use a 0.4 mm finished pad with 0.15 mm drill microvias, 0.25 mm via capture pad, and staggered fanout in the outer layer. Maintain 50 Ω single-ended and 100 Ω differential characteristic impedance for LVDS/LVPECl pairs. Stitch the BGA's GND ball perimeter to inner ground planes every 5 mm to provide a low-impedance return path for high-speed signals.
Configuration mode pins (MSEL0..MSEL2) must be tied to the correct VCCPD rail level — most commonly 3.3 V — for Fast Passive Parallel (FPP) or Active Serial (AS) configuration modes; mismatched levels cause silent configuration failure. The JTAG chain order (TDI → EP1S60 → TDO) must be unique to the device boundary-scan length, otherwise downstream devices report IDCODE errors. Always load the Quartus II programming object file (.pof) for AS configuration or .sof for JTAG, and never mix them.
Compliance Information
RoHS, REACH, lead-free, halogen-free and conflict-mineral data are lot-dependent for this obsolete part; obtain a signed manufacturer/distributor certificate of compliance per shipment. The 'N' suffix variants (e.g. EP1S60F1020C5N) are explicitly lead-free; base parts (without 'N') were originally SnPb. AEC-Q100 is not applicable — this is a commercial-grade FPGA.
