EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel
MPN: EP1SGX10CF672C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175.5 | $87,750.00 |
| 1,000 | $158 | $158,000.00 |
Drop-in alternatives for EP1SGX10CF672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C6
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View Datasheet →EP1S20F672C6
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View Datasheet →EP1S10F672C6
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View Datasheet →EP1S10F672C7
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View Datasheet →EP1SGX10CF672C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 362 |
| Total Memory Bits | 920,448 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | 672-FBGA (FineLine BGA) |
| Package Dimensions | 33 mm x 33 mm, 1 mm pitch |
| Operating Temperature | 0°C to +85°C (Commercial) |
| Speed Grade | C6 |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
EP1SGX10CF672C6 33 mm x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX10CF672C6 (33 mm x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10CF672C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX10CF672C6 is suitable for 6 applications: Telecom Line Card Interface Bridging, Baseband Signal Processing and DSP Co-Processing, Broadcast Video Processing and Routing, High-Speed Serial Interface Bridging (XAUI / Serial RapidIO), ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation.
Telecom Line Card Interface Bridging
The EP1SGX10CF672C6's integrated multi-gigabit serial transceivers and 362 user I/Os make it well-suited for telecom line cards that bridge between backplane serial links (such as SPI-4.2 or proprietary LVDS buses) and external SERDES lanes. Its 10K logic elements provide the datapath width needed for packet processing glue logic, while the 672-FBGA package supports dense parallel buses. Designers typically instantiate MAC layers, framer blocks, and rate-matching FIFOs in the fabric, with the hard transceivers handling the physical layer at 1-3 Gbps line rates.
Recommended
Baseband Signal Processing and DSP Co-Processing
The Stratix GX fabric includes dedicated embedded multiplier blocks suitable for FFT and channelization co-processing in baseband units. With 10,570 LEs and 920 Kbits of on-chip memory, the EP1SGX10CF672C6 can host multi-channel filter banks, correlators, and channel estimators offloading the host DSP. The 1.5 V core enables low power per MAC, while the serial transceivers move digitized IF samples between boards at multi-gigabit rates.
Recommended
Broadcast Video Processing and Routing
Broadcast video routers and format converters benefit from the EP1SGX10CF672C6's combination of high I/O count and embedded memory bandwidth. The device can perform SDI-to-HDMI bridging, color-space conversion, and frame-rate conversion while the parallel I/O banks handle uncompressed video buses. Its 362 user I/Os accommodate multiple SDI streams plus ancillary data and control interfaces within a single chip.
Recommended
High-Speed Serial Interface Bridging (XAUI / Serial RapidIO)
With multiple 3.125 Gbps-capable transceivers, the EP1SGX10CF672C6 can bridge between ASIC-class devices using XAUI, Serial RapidIO, or proprietary serial protocols. The 672-FBGA ball map routes four differential transceiver channels plus the reference clock infrastructure needed for backplane-class link training, with the FPGA fabric implementing 8b/10b encoding, clock compensation, and link-layer state machines.
Recommended
ASIC Prototyping and Emulation
The 10K logic elements and high I/O count make the EP1SGX10CF672C6 a usable prototyping vehicle for mid-complexity ASIC designs, especially those with serial I/O. Designers map ASIC blocks into the Stratix fabric and use the transceivers to emulate the production ASIC's SERDES interface, validating protocol behavior and timing before tape-out. Multi-FPGA partitioning can be supported by stacking multiple EP1SGX10CF672C6 or higher-density EP1S25F672C6 devices.
Recommended
Industrial Control and Test Instrumentation
The EP1SGX10CF672C6's commercial 0-85°C range, generous I/O, and on-chip memory suit industrial test and measurement platforms such as protocol analyzers, ATE interface cards, and high-speed data recorders. The serial transceivers stream digitized samples to host processors, while the fabric implements stimulus generation, response comparison, and result aggregation. The 672-FBGA package provides mechanical robustness for vibration-prone test environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10CF672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C6 | EP1S20F672C6 | EP1S10F672C6 | EP1S10F672C7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA |
| Logic Elements | 10,570 | ~25,660 | ~20,000 | ~10,570 | ~10,570 |
| Speed Grade | C6 | C6 | C6 | C6 | C7 (faster) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/Os | 362 | [DATA_NEEDED] | [DATA_NEEDED] | 362 | 362 |
| Embedded Memory (bits) | 920,448 | [DATA_NEEDED] | [DATA_NEEDED] | 920,448 | 920,448 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Pin-compatible density upgrade path within same 672-FBGA (vs EP1S10F672C6)
- Higher logic density in same footprint (vs EP1S25F672C6)
- Faster timing closure in same footprint (vs EP1S10F672C7)
- Family consistency with Quartus tool flow (vs Xilinx Virtex-II Pro XC2VP7)
Design Notes
Estimated: at full utilization of 10K logic elements toggling at ~200 MHz with all 20 transceivers active at 3.125 Gbps, the EP1SGX10CF672C6 core power consumption can reach 8-12 W on the 1.5 V rail. Designers should allocate dedicated switching regulator headroom and follow Altera's reference decoupling network, including bulk capacitors on each supply pin group and a pi-filter on the analog transceiver supply. Power sequencing must follow Intel's documented order (core before I/O) to avoid latch-up damage during configuration.
The high-speed serial transceiver channels on the EP1SGX10CF672C6 require controlled-impedance differential routing (typically 100 ohm differential) with matched lengths within a transceiver group. The reference clock input must be routed with controlled impedance and isolated from noisy digital traces. Use the Altera/Intel Quartus pin planner to assign transceiver channels and the Transceiver Toolkit to validate signal integrity at the intended line rate.
The 672-FBGA package at 1 mm ball pitch requires multilayer PCB construction with microvia or via-in-pad technology for reliable BGA assembly. Power and ground planes should be placed on inner layers adjacent to the BGA escape traces. Provide a minimum 4-layer stack-up with continuous ground plane beneath the device for transceiver return-current integrity; 6-10 layer stack-ups are typical for production designs.
Estimated: at 10 W dissipation in the 672-FBGA (theta_JA approximately 15-20 C/W with adequate PCB thermal vias), junction temperature rises 150-200 C above ambient. The commercial 85°C operating ceiling leaves limited thermal headroom; designers must include thermal vias under the package center pad and connect them to internal ground/power planes. For enclosed chassis, active cooling may be necessary when all transceivers are active.
Do not exceed the maximum I/O voltage of 3.3 V on user I/O banks; mixing 5 V tolerant signals requires level-shifters. Configuration mode (AS, PS, JTAG) must be selected correctly via MSEL pins before power-up. The JTAG chain order matters in multi-device configurations - consult the Stratix GX configuration handbook to avoid configuration failures. As of 2026-09-07, the part is NRND so confirm long-term availability before committing to new designs.
Compliance Information
Lifecycle status NRND per distributor data as of 2026-09-07. RoHS/REACH/lead-free status not confirmed in the provided web data - consult Intel's product compliance documentation for definitive certification. Not AEC-Q100 qualified - not intended for automotive applications.
