EP20K100FC324-2X - APEX 20K FPGA 100K Gates 324-BGA | Intel / Altera
MPN: EP20K100FC324-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $115.91 | $115.91 |
| 10 | $115.32 | $1,153.20 |
| 100 | $114.75 | $11,475.00 |
| 500 | $114.75 | $57,375.00 |
| 1,000 | $113.59 | $113,590.00 |
| 2,500 | $110.11 | $275,275.00 |
EP20K100FC324-2X Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated I/O cells, allowing engineers to implement custom digital circuits after PCB fabrication. FPGAs sit within the semiconductor hierarchy between ASICs and CPLDs, offering higher density and speed than CPLDs while preserving the reprogrammability that ASICs lack. The APEX-20K series was Altera's first family to embed MultiCore architecture, pairing look-up-table based logic elements with embedded array blocks (EABs) for on-chip memory.
Key features of the EP20K100FC324-2X include 4,160 logic elements, 100K typical gates (263K maximum system gates), 53,248 bits of embedded RAM distributed across embedded array blocks, and 252 programmable user I/O pins supporting multiple I/O standards such as LVTTL, LVCMOS, PCI, and SSTL. The device supports in-system programmability through the IEEE 1149.1 JTAG interface and is configured via a serial or parallel configuration scheme.
The architecture combines four-input look-up-table logic elements, embedded array blocks for synchronous RAM/ROM, and FastTrack interconnect for predictable timing. The -2X speed grade offers an internal propagation delay around 1.6 ns per logic element, enabling the 200 MHz system clock operation advertised by the manufacturer.
Typical applications for this FPGA include glue logic for telecom line cards, custom interface bridging (PCI to local bus), digital signal processing front-ends, industrial control and instrumentation, and legacy replacement of multiple 74-series TTL devices. The wide I/O count also makes it useful for video processing and parallel data acquisition.
When designing with this part, ensure the 2.5 V core and 3.3 V I/O supplies are properly sequenced, the configuration EPROM or JTAG loader is correctly wired, and decoupling follows the manufacturer's reference schematic. This device has reached end-of-life; new designs should consider Cyclone or Cyclone II families.
Drop-in alternatives for EP20K100FC324-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K100FC324-2X (same form factor and footprint) — differing in Operating Temperature, Package, Family, Total RAM Bits, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100FC324-2V
✅ Drop-In✓ In Stock
$8.15 / Unit
View Datasheet →EP20K100FC324-1V
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$118.4 / Unit
View Datasheet →EP20K100FC324-1
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View Datasheet →EP20K100FC324-2
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$18.9 / Unit
View Datasheet →EP20K100EFC324-2X
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP20K100FC324-2X Maximum Ratings & Electrical Characteristics
| Family | APEX-20K |
| Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Maximum User I/O | 252 |
| Embedded RAM Bits | 53,248 |
| Operating Frequency (max) | 200 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant I/O) |
| Package | 324-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) / Serial / Parallel |
| RoHS Status | Compliant |
EP20K100FC324-2X 324-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EP20K100FC324-2X (324-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC324-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K100FC324-2X is suitable for 6 applications: Telecom Line Card Glue Logic, Custom PCI-to-Local Bus Bridge, Industrial Control and Instrumentation, Video Processing and Image Pre-Processing, Legacy TTL Replacement (Multi-Chip Integration), Parallel Data Acquisition Systems.
Telecom Line Card Glue Logic
The EP20K100FC324-2X fits telecom line-card glue logic applications because it provides 4,160 logic elements and 252 user I/Os, enough to replace dozens of 74-series TTL devices on legacy T1/E1 and SONET backplane interfaces. Its 200 MHz internal performance and 53,248 bits of embedded RAM allow implementation of small FIFO buffers between framers and network processors. Operating from a 2.5 V core with 3.3 V I/O, the part interfaces directly to LVTTL and LVCMOS bus structures common in telecom designs. Configuration via JTAG simplifies board-level programming and in-field firmware updates. Although obsolete, it remains deployed in installed telecom equipment where PCB redesign is not economically viable.
Recommended
Custom PCI-to-Local Bus Bridge
For PCI-to-local-bus bridging in legacy PC peripherals and industrial controllers, the EP20K100FC324-2X supplies sufficient logic capacity plus 252 user I/Os to implement a full 32-bit PCI target interface alongside a custom local bus. The 200 MHz operation comfortably meets the 33 MHz PCI clock specification with timing margin. Embedded array blocks provide 53,248 bits of RAM for transaction buffering, eliminating the need for external FIFOs. The device supports 5 V tolerant I/O on 3.3 V supply rails, which simplifies mixed-voltage PCI card designs. Designers should verify PCI timing closure with Quartus timing analysis before tape-out.
Recommended
Industrial Control and Instrumentation
In industrial control applications the EP20K100FC324-2X implements custom control logic, encoder decoding, and serial protocol bridges across 252 I/O pins. Its commercial 0 to +85 C operating range suits cabinet-mounted equipment; for harsher environments the pin-compatible EP20K100FC324-2V industrial variant is the recommended drop-in. Embedded RAM blocks host lookup tables for sensor linearization, while the 4,160 logic elements handle PWM generation, PID loops, and Modbus / CAN soft-IP cores. Configuration storage in a small serial EEPROM allows field updates. Watchdog and JTAG boundary-scan simplify factory test of high-density boards.
Recommended
Video Processing and Image Pre-Processing
The EP20K100FC324-2X supports video front-end pre-processing tasks such as color space conversion, deinterlacing, and frame-rate conversion where 252 I/Os accommodate wide parallel video buses. Embedded RAM blocks (53,248 bits total) implement line buffers and small lookup tables for gamma correction. Operating at 200 MHz internal allows real-time processing of standard-definition video streams. The 2.5 V core with 3.3 V LVTTL I/O interfaces directly to common video ADCs and DACs. Designers targeting HD streams should consider migrating to APEX-20KE or Cyclone-series devices with higher RAM bandwidth.
Recommended
Legacy TTL Replacement (Multi-Chip Integration)
The EP20K100FC324-2X replaces dozens of 74-series TTL devices on legacy boards by integrating the entire glue logic into a single 324-FBGA device. With 4,160 logic elements it absorbs the equivalent of roughly 100 standard SSI/MSI packages, dramatically reducing board area and power consumption. Designers port TTL schematics to Altera Hardware Description Language (AHDL) or VHDL using legacy primitives in the Quartus library. JTAG configuration plus boundary-scan eliminates bed-of-nails fixtures. Because the part is obsolete, long-term maintenance plans should include sourcing the pin-compatible EP20K100FC324-2V or migrating to Cyclone II.
Recommended
Parallel Data Acquisition Systems
Parallel data-acquisition systems benefit from the EP20K100FC324-2X's 252 user I/Os, which accept wide data buses from high-channel-count ADCs or sensor arrays. The 53,248-bit embedded RAM blocks serve as circular sample buffers before DMA transfer to a host processor. At 200 MHz the device can sustain sampling rates well above 100 MHz on parallel interfaces. JTAG-based in-system programmability allows per-board configuration of acquisition thresholds and trigger logic. The 3.3 V I/O with 5 V tolerance simplifies interfacing to legacy bipolar signal-conditioning front-ends common in instrumentation.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC324-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC324-2V | EP20K100FC324-1V | EP20K100FC324-1 | EP20K100FC324-2 | EP20K100EFC324-2X |
|---|---|---|---|---|---|---|
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -2X | -2V | -1V | -1 | -2 | -2X (20KE enhanced) |
| Operating Temperature | 0 to +85 C (Commercial) | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | 0 to +85 C (Commercial) | 0 to +85 C (Commercial) | 0 to +85 C (Commercial) |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Maximum Frequency | 200 MHz | 200 MHz | ~180 MHz | ~180 MHz | ~180-190 MHz | ~270 MHz (20KE) |
| User I/O Count | 252 | 252 | 252 | 252 | 252 | 252 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest commercial speed grade in the 100K-gate APEX-20K 324-BGA family (vs EP20K100FC324-1)
- Pin-to-pin compatibility with the enhanced APEX-20KE family (vs EP20K100EFC324-2X)
- Industrial-temperature variant available on identical footprint (vs EP20K100FC324-2V)
Design Notes
The EP20K100FC324-2X requires a 2.5 V core supply and a 3.3 V I/O supply that must be sequenced so the core reaches regulation before the I/O rails. Estimated: total quiescent current at 200 MHz is roughly 200-400 mA on VCCINT and up to 50 mA on VCCIO depending on I/O switching activity; place 100 µF bulk + 0.1 µF + 0.01 µF ceramic decoupling within 5 mm of each supply pin pair. Use a dedicated LDO (e.g., LT1963-2.5) for VCCINT rather than sharing with other 2.5 V loads to minimize jitter.
The 324-FBGA package has a 1.27 mm ball pitch per the FindIC summary; use 4-6 layer PCB with continuous GND planes on layers 2 and 5 to control return paths. Escape BGA balls on the top layer using microvias (0.1 mm/4 mil drill) to inner signal layers; route clock and JTAG traces on inner stripline layers with 50 Ω controlled impedance. Exposed thermal pads under the package (if present in the -2X variant) must be soldered to a copper pour for mechanical reliability.
Do not assume the 324-FBGA pinout is identical to non-F-package APEX-20K variants (such as 144-TQFP or 240-PQFP); each package option has a unique pinout even on the same die. Verify JTAG TDO/TDI/TMS/TCK connections against the specific 324-BGA datasheet before layout. The configuration mode (serial vs parallel) is sampled at power-up via MSEL pins; incorrect strapping prevents configuration. Finally, obsolete parts may have last-time-buy windows - confirm with Rochester Electronics before committing to long-life programs.
Compliance Information
RoHS compliance inferred from Rochester Electronics listing on DigiKey; REACH, halogen, and conflict-mineral status not explicitly stated in verified web data.
