EP20K100QC240-3V - APEX 20KE FPGA 100K Gates 189 I/O 240-BFQFP | Intel
MPN: EP20K100QC240-3V ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $110 | $11,000.00 |
| 250 | $98.75 | $24,687.50 |
| 500 | $87.2 | $43,600.00 |
EP20K100QC240-3V Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks, interconnect, and I/O cells that engineers can program after manufacturing to implement custom digital circuits. FPGAs sit within the programmable logic hierarchy above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs. The APEX 20KE family specifically targets SOPC (System-On-a-Programmable-Chip) integration, combining LUT logic, product-term logic, and embedded memory blocks in one fabric.
Key features of the EP20K100QC240-3V include a -3 speed grade, 0.22 µm process technology, maximum operating frequency of 167 MHz, in-system programmability via IEEE 1149.1 JTAG, and support for multiple I/O standards including LVTTL, LVCMOS, and LVDS. The MultiCore architecture lets designers place register-intensive logic in LUTs and combinatorial glue logic in product-term blocks, optimizing silicon efficiency for mixed datapath/control designs.
Typical applications include telecommunications line cards, high-speed datapath processing, DSP co-processing, glue-logic integration, and PCI bus interface bridging. The 53,248 bits of embedded memory can be configured as RAM, ROM, or FIFO, enabling single-chip implementation of state machines with on-chip buffering.
When designing with this part, note that the -3V suffix indicates the device is lead-free and RoHS-compliant, while -3 alone denotes the standard lead-bearing variant. Both share the same 240-BFQFP footprint (32x32 mm) and identical die, so PCB layouts can accommodate either part. Designers should use the Quartus II design software (legacy) for synthesis, place-and-route, and timing closure.
Drop-in alternatives for EP20K100QC240-3V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K100QC240-3V (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Total RAM Bits, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100QC240-3N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP20K100QC240-3
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →EP20K100QC240-2
✅ Drop-In✓ In Stock
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View Datasheet →EP20K100QC240-1
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$98 / Unit
View Datasheet →EP20K100QC240-1XV
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP20K100QC240-3V Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX-20K |
| Logic Logic Elements / Cells | 4,160 |
| Total System Gates | 100,000 |
| Total RAM Bits | 53,248 |
| Number of User I/O | 189 |
| Number of Logic Blocks | 53248 (LABs) |
| Core Voltage | 2.375 V to 2.625 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Maximum Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Mounting Type | Surface Mount |
| Package | 240-BFQFP (32 x 32 mm) |
| Speed Grade | -3 (fastest APEX 20KE grade) |
| Lead-Free / RoHS | Yes (-3V suffix) |
| In-System Programmability | Yes (IEEE 1149.1 JTAG) |
EP20K100QC240-3V 240-bfqfp (32 x 32 mm) Pin Configuration Guide
Pin configuration for EP20K100QC240-3V (240-bfqfp (32 x 32 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100QC240-3V.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K100QC240-3V is suitable for 6 applications: Telecommunications Line Cards, DSP Co-Processing and Acceleration, PCI Bus Interface Bridging, Glue-Logic Integration and Chip-Set Replacement, Industrial Control and Automation, Legacy Telecom and Datacom Backplane Bridging.
Telecommunications Line Cards
The EP20K100QC240-3V fits telecom line-card designs through its combination of 100K system gates, 53,248 bits of embedded memory, and 189 user I/O pins enabling multi-protocol bridging. The MultiCore architecture lets designers place high-speed datapath (such as framer/mapper logic) in LUT cells while mapping glue control logic to product-term blocks. Operating at 167 MHz internal frequency, the part can handle T1/E1 aggregation, HDLC controllers, and UART multiplexing within a single device. The 240-BFQFP package provides the thermal headroom and pin density needed for chassis backplane interfaces while supporting LVDS I/O for low-EMI serial links.
Recommended
DSP Co-Processing and Acceleration
With 4,160 logic elements and 167 MHz timing closure, the EP20K100QC240-3V serves as a co-processor that offloads DSP routines from a host DSP or microcontroller. The MultiCore architecture supports parallel multiplier/accumulator structures and FFT butterflies, while the 53 kbits of embedded RAM acts as a circular buffer for sample data. Designers can implement custom FIR filters, FFT engines, and video-processing kernels. The 240-BFQFP package exposes enough user I/O (189 pins) to stream parallel data buses between the host processor and the FPGA without multiplexing penalties.
Recommended
PCI Bus Interface Bridging
The EP20K100QC240-3V's 100K gate capacity and 189 user I/O pins make it well-suited as a PCI-to-local-bus bridge, a common use case for APEX 20KE devices in industrial PCs and embedded motherboards. The 167 MHz performance supports 33 MHz PCI at full throughput, while the JTAG boundary-scan capability simplifies board-level test. Embedded memory blocks handle PCI transaction FIFOs without external SRAM, reducing BOM cost. Designers can route 32-bit PCI plus local bus plus interrupt and arbitration signals within the 189 available user I/O pins.
Recommended
Glue-Logic Integration and Chip-Set Replacement
Designers frequently choose the EP20K100QC240-3V to consolidate discrete 74-series glue logic, FIFOs, and address-decoder PLDs into a single programmable device. The MultiCore architecture's product-term logic is well-suited to decoder, mux, and state-machine functions, while LUT logic handles wider datapaths. Replacing 5-15 discrete logic chips with one APEX 20KE cuts PCB area, simplifies sourcing, and adds in-system reconfigurability for late-stage design fixes. The 240-BFQFP footprint provides ample I/O for chip-set replacement in legacy industrial and military designs.
Recommended
Industrial Control and Automation
Industrial control applications leverage the EP20K100QC240-3V's embedded memory for storing PLC ladder-logic-equivalent state machines and the high I/O count for interfacing to sensor arrays and motor-control peripherals. The 2.5V core and 167 MHz internal clock support deterministic timing for closed-loop control loops, while the LVDS I/O standard enables noise-immune communication with industrial sensors over long cable runs. The 240-BFQFP package is robust for industrial thermal environments and supports both commercial and industrial temperature grades within the family.
Recommended
Legacy Telecom and Datacom Backplane Bridging
Backplane bridging designs in legacy telecom and datacom systems frequently use the EP20K100QC240-3V to translate between proprietary backplane protocols, custom serial formats, and standard buses. The 189 user I/O pins are sufficient for 8-bit to 32-bit parallel bus widths plus clock, frame-sync, and interrupt signals. Embedded memory acts as elastic-store FIFO between mismatched clock domains. The JTAG-based in-system programmability allows remote firmware upgrades, valuable for unmanned or hard-to-access sites.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100QC240-3V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100QC240-3N | EP20K100QC240-3 | EP20K100QC240-2 | EP20K100QC240-1 | EP20K100QC240-1XV |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP (32x32 mm) | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (slower) | -1 (slowest) | -1 (slowest, lead-free) |
| Lead-Free / RoHS | Yes | Yes | No (leaded) | No (leaded, default) | No (leaded, default) | Yes (lead-free, XV) |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Total System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| User I/O Count | 189 | 189 | 189 | 189 | 189 | 189 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lead-free RoHS construction while sharing identical die with leaded -3 variant (vs EP20K100QC240-3)
- Fastest -3 speed grade in the APEX 20KE 100K family (vs EP20K100QC240-2)
- MultiCore architecture with embedded memory for single-chip implementations (vs EP20K100QC240-1)
Design Notes
The 240-BFQFP package uses a 0.5 mm lead pitch and gull-wing leads. PCB layout must use 0.15-0.20 mm wide traces between lands with at least 4 mil spacing for the inner rows; do not route signals through the lead footprint. Place decoupling capacitors (0.1 µF ceramic plus 10 µF tantalum) within 5 mm of every VCCINT/VCCIO pin pair. For the PLL analog supply pins, use a ferrite bead and 10 µF tantalum bypass.
Configure I/O banks for LVDS only when adjacent I/O standards permit. APEX 20KE requires that all I/O in a bank share the same VCCIO reference voltage. For high-speed LVDS outputs (>200 MHz toggle), use controlled-impedance routing (50 ohm differential, 100 ohm differential), keep trace length matching to within 0.5 mm, and use ground-plane reference with via stitching every 10 mm.
Estimated: the APEX 20KE configuration flash memory is one-time-programmable for some device variants. Engineers planning field upgrades must select a serial-configuration scheme or use JTAG-based in-system programmability. When migrating between -3, -2, and -1 speed grades, expect ~25-40% timing closure differences - re-run Quartus II timing analysis after any speed-grade swap. Do not assume -V (lead-free) and non-V variants share identical thermal profiles; the lead-free solder-joint metallurgy has slightly different thermal-fatigue characteristics.
Compliance Information
Lead-free / RoHS compliant per -3V suffix designation. AEC-Q100 qualification is not applicable for legacy Altera APEX 20KE FPGAs (automotive applications require newer Cyclone Auto parts). Halogen-free and conflict-minerals compliance not specified in available data.
