EP20K100TC144-3 - APEX 20K 100K Gates FPGA 144TQFP | Intel
MPN: EP20K100TC144-3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $19.8 | $19,800.00 |
EP20K100TC144-3 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the digital logic hierarchy, an FPGA sits above fixed-function ASICs in flexibility and below microprocessors in software programmability. The APEX 20K family specifically pioneered the combination of LUT logic with embedded memory blocks on a single die, paving the way for modern SoC FPGAs.
Key features of the EP20K100TC144-3 include 4,160 logic elements, 100K typical gates, four embedded system blocks providing 53,248 RAM bits, 416 macrocells, a MultiCore interconnect routing fabric, and IEEE 1149.1 JTAG boundary-scan support. The device is in-system programmable via the IEEE 1532 / 1149.1 interface, allowing rapid prototyping and field upgrades. The TQFP-144 package (also referenced as 144-LQFP, body size approximately 20 × 20 mm, 0.5 mm pitch) provides 101 usable I/O lines with multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
The device architecture combines fine-grained logic cells (LEs) with coarse-grained embedded system blocks. Logic elements are grouped into Logic Arrays (LABs), and ESBs can be configured as dual-port RAM, ROM, FIFO, or CAM. This hybrid architecture makes the APEX 20K suitable for designs that need both datapath logic and on-chip memory, such as communications glue logic, custom DSP pipelines, and bus-interface bridging.
Typical applications include telecom line-card glue logic, industrial control interfaces, custom peripheral bridges, and legacy ASIC replacement designs. The 100K-gate density is well suited to medium-complexity state machines, FIFO/buffer managers, and protocol converters. Designers migrating to this device typically use the Altera Quartus II design environment for synthesis, place-and-route, and bitstream generation.
When designing with the EP20K100TC144-3, pay attention to power-rail sequencing and decoupling. The 2.5 V core and 3.3 V/5 V tolerant I/Os require bulk and high-frequency decoupling close to each supply pin. Unused I/O pins should be left floating or driven to a defined logic level per Quartus II configuration to minimize in-rush current. Because the EP20K100TC144-3 has been in production since the early 2000s and the APEX 20K family is mature, lead time and lifecycle should be confirmed with the distributor before committing to new designs.
This page synthesizes distributor pricing, drop-in alternative guidance, and engineering design notes that complement the official datasheet.
Drop-in alternatives for EP20K100TC144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K100TC144-3 (same form factor and footprint) — differing in Package, Family, Operating Temperature, Speed Grade, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100TC144-1
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100TC144-2
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200TC144-3
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100EFC144-3
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100CT144C7
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EP20K100FC144-3
✅ Drop-In✓ In Stock
$59.5 / Unit
View Datasheet →EP20K100TC144-3 Maximum Ratings & Electrical Characteristics
| Series | APEX 20K |
| Family | APEX 20K (APEX 20KE-compatible die) |
| Logic Elements / Cells | 4,160 |
| Macrocells | 416 |
| Typical Gates | 100,000 |
| Number of I/O | 101 |
| Number of Logic Blocks/Elements | 4,160 |
| Total RAM Bits | 53,248 |
| Voltage - Supply | 2.5 V core |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Mounting Type | Surface Mount |
| Package | 144-LQFP / TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Propagation Delay | 1.6 ns |
| Maximum Internal Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -3 |
| In-System Programmability | IEEE 1149.1 / 1532 JTAG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP20K100TC144-3 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | GND — Ground |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | TDI — JTAG test data input |
| Pin 15 | TMS — JTAG test mode select |
| Pin 16 | TCK — JTAG test clock |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | VCCINT — Core supply voltage (2.5 V) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | GND — Ground |
| Pin 31 | I/O — User I/O pin (bank 2) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | I/O — User I/O pin (bank 2) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | VCCINT — Core supply voltage (2.5 V) |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O pin (bank 3) |
| Pin 41 | I/O — User I/O pin (bank 3) |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | I/O — User I/O pin (bank 3) |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | GND — Ground |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | VCCINT — Core supply voltage (2.5 V) |
| Pin 58 | GND — Ground |
| Pin 59 | I/O — User I/O pin (bank 4) |
| Pin 60 | I/O — User I/O pin (bank 4) |
| Pin 61 | I/O — User I/O pin (bank 4) |
| Pin 62 | I/O — User I/O pin (bank 4) |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 66 | I/O — User I/O pin (bank 4) |
| Pin 67 | GND — Ground |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | TDO — JTAG test data output |
| Pin 75 | I/O — User I/O pin (bank 4) |
| Pin 76 | VCCINT — Core supply voltage (2.5 V) |
| Pin 77 | GND — Ground |
| Pin 78 | I/O — User I/O pin (bank 5) |
| Pin 79 | I/O — User I/O pin (bank 5) |
| Pin 80 | I/O — User I/O pin (bank 5) |
| Pin 81 | I/O — User I/O pin (bank 5) |
| Pin 82 | I/O — User I/O pin (bank 5) |
| Pin 83 | I/O — User I/O pin (bank 5) |
| Pin 84 | I/O — User I/O pin (bank 5) |
| Pin 85 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 86 | I/O — User I/O pin (bank 5) |
| Pin 87 | GND — Ground |
| Pin 88 | I/O — User I/O pin (bank 5) |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | I/O — User I/O pin (bank 5) |
| Pin 91 | I/O — User I/O pin (bank 5) |
| Pin 92 | I/O — User I/O pin (bank 5) |
| Pin 93 | I/O — User I/O pin (bank 5) |
| Pin 94 | nCONFIG — Configuration control (active low) |
| Pin 95 | nSTATUS — Configuration status (active low) |
| Pin 96 | VCCINT — Core supply voltage (2.5 V) |
| Pin 97 | GND — Ground |
| Pin 98 | I/O — User I/O pin (bank 6) |
| Pin 99 | I/O — User I/O pin (bank 6) |
| Pin 100 | I/O — User I/O pin (bank 6) |
| Pin 101 | I/O — User I/O pin (bank 6) |
| Pin 102 | I/O — User I/O pin (bank 6) |
| Pin 103 | I/O — User I/O pin (bank 6) |
| Pin 104 | I/O — User I/O pin (bank 6) |
| Pin 105 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 106 | I/O — User I/O pin (bank 6) |
| Pin 107 | GND — Ground |
| Pin 108 | I/O — User I/O pin (bank 6) |
| Pin 109 | I/O — User I/O pin (bank 6) |
| Pin 110 | I/O — User I/O pin (bank 6) |
| Pin 111 | I/O — User I/O pin (bank 6) |
| Pin 112 | I/O — User I/O pin (bank 6) |
| Pin 113 | I/O — User I/O pin (bank 6) |
| Pin 114 | CONF_DONE — Configuration done indicator |
| Pin 115 | DCLK — Configuration clock |
| Pin 116 | DATA0 — Configuration data input |
| Pin 117 | I/O — User I/O pin (bank 7) |
| Pin 118 | I/O — User I/O pin (bank 7) |
| Pin 119 | VCCINT — Core supply voltage (2.5 V) |
| Pin 120 | GND — Ground |
| Pin 121 | I/O — User I/O pin (bank 7) |
| Pin 122 | I/O — User I/O pin (bank 7) |
| Pin 123 | I/O — User I/O pin (bank 7) |
| Pin 124 | I/O — User I/O pin (bank 7) |
| Pin 125 | I/O — User I/O pin (bank 7) |
| Pin 126 | I/O — User I/O pin (bank 7) |
| Pin 127 | I/O — User I/O pin (bank 7) |
| Pin 128 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 129 | I/O — User I/O pin (bank 7) |
| Pin 130 | GND — Ground |
| Pin 131 | I/O — User I/O pin (bank 7) |
| Pin 132 | I/O — User I/O pin (bank 7) |
| Pin 133 | I/O — User I/O pin (bank 7) |
| Pin 134 | I/O — User I/O pin (bank 7) |
| Pin 135 | I/O — User I/O pin (bank 7) |
| Pin 136 | I/O — User I/O pin (bank 7) |
| Pin 137 | I/O — User I/O pin (bank 8) |
| Pin 138 | I/O — User I/O pin (bank 8) |
| Pin 139 | I/O — User I/O pin (bank 8) |
| Pin 140 | I/O — User I/O pin (bank 8) |
| Pin 141 | I/O — User I/O pin (bank 8) |
| Pin 142 | VCCINT — Core supply voltage (2.5 V) |
| Pin 143 | GND — Ground |
| Pin 144 | I/O — User I/O pin (bank 8) |
Typical Applications
EP20K100TC144-3 is suitable for 7 applications: Telecom Line-Card Glue Logic, Industrial Control Interface Bridging, Legacy ASIC Replacement, Custom DSP Pipeline Implementation, Custom Peripheral Bus Bridge, Test and Measurement Instrumentation Front-End, Aerospace and Defense Avionics Interface.
Telecom Line-Card Glue Logic
The EP20K100TC144-3 is well suited for telecom line-card glue logic where 101 user I/O and 4,160 logic elements provide enough headroom for protocol converters, TDM framers, and backplane bridges. The 167 MHz internal frequency in the -3 speed grade supports 155 Mbps telecom data paths, while the 53,248 bits of embedded memory absorb small packet buffers and lookup tables without external SRAM. Designers typically place the device between a network processor and PHY/SERDES, configuring LVTTL or LVCMOS I/O standards for direct 3.3 V interfacing. Compared with discrete TTL glue, the FPGA cuts board area and improves timing closure.
Recommended
Industrial Control Interface Bridging
In industrial control systems, the EP20K100TC144-3 bridges legacy parallel buses (ISA, HPI, VME) to modern serial protocols such as SPI, I2C, and UART. Its 101 I/O lines tolerate 5 V inputs and can be configured for LVTTL or PCI signaling, simplifying interfacing to legacy peripherals. The MultiCore interconnect fabric enables deterministic routing for real-time control loops, while 53,248 bits of embedded RAM serve as mailbox FIFOs between master and slave processors. The 0 to 85 °C commercial temperature range covers most factory-floor enclosures without requiring industrial-grade screening.
Recommended
Legacy ASIC Replacement
Designers often use the EP20K100TC144-3 as a drop-in replacement for end-of-life ASICs in long-lifecycle industrial, military, and aerospace programs. The 100K-gate density matches many mid-1990s gate-array ASICs, while in-system JTAG programmability allows field updates without board rework. The TQFP-144 footprint is compatible with many legacy ASIC land patterns, enabling direct PCB swaps. The 53,248-bit on-chip memory replaces small external SRAM/ROM, and the 2.5 V core draws modest power, easing thermal management in sealed enclosures.
Recommended
Custom DSP Pipeline Implementation
The EP20K100TC144-3 supports custom DSP pipelines such as FIR filters, correlators, and CRC engines. At 167 MHz internal frequency, the device delivers up to 167 MIPS on simple multiplier-free datapaths, and the embedded system blocks serve as coefficient RAM or delay-line storage. For higher-throughput designs, designers can pipeline FIR taps across multiple LABs while keeping control logic in surrounding logic elements. The 101 I/O lines stream wide sample buses into external ADC/DAC devices, while JTAG lets engineers debug pipelines in real time.
Recommended
Custom Peripheral Bus Bridge
The EP20K100TC144-3 is commonly used as a peripheral bus bridge that converts one bus standard (PCI, VME, ISA, or proprietary) to another (PCI Express soft-IP, SPI, I2C, or GPIO). The 100K-gate capacity handles full bus-state machines plus DMA controllers, and the embedded memory acts as FIFO storage for data crossing clock domains. The JTAG interface supports in-system firmware updates, which is critical for field-deployed bridges. The TQFP-144 package is hand-solderable for prototype builds, while production runs use standard SMT lines.
Recommended
Test and Measurement Instrumentation Front-End
In bench-top test equipment, the EP20K100TC144-3 implements custom waveform generators, pattern generators, and protocol-analyzer front ends. The 167 MHz internal frequency supports real-time streaming at 100 Msps or higher for parallel-output patterns, while the 53,248-bit embedded RAM stores deep look-up tables for arbitrary waveform synthesis. LVTTL I/O standards can directly drive TTL comparators and 50 Ω terminated lines, simplifying analog front-end design. Designers using Quartus II can incorporate on-chip logic analyzers (SignalTap equivalent) for real-time debug.
Recommended
Aerospace and Defense Avionics Interface
The EP20K100TC144-3 has historically been qualified for aerospace and defense programs where long-lifecycle support and MIL-spec reliability are required. Its 101 user I/O accommodate ARINC 429, MIL-STD-1553, and discrete avionics buses when paired with companion transceivers. The TQFP-144 package is compatible with hermetic and plastic-encapsulated assembly processes, and 4,160 logic elements implement bus monitors, protocol engines, and discrete I/O conditioning. Designers should validate lot-conformance and radiation tolerance per program requirements, since APEX 20K is not formally Rad-hard by design.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100TC144-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100TC144-1 | EP20K100TC144-2 | EP20K200TC144-3 | EP20K100EFC144-3 | EP20K100CT144C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (144-LQFP) | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same | TQFP-144 (144-LQFP) - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE | APEX 20K (C-grade) |
| Logic Elements | 4,160 | 4,160 (same die) | 4,160 (same die) | 8,320 | 4,160 (APEX 20KE) | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum Internal Frequency | 167 MHz | ~120 MHz (-28%) | ~145 MHz (-13%) | 167 MHz (same) | ~150 MHz (-10%) | ~120 MHz (-28%) |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 (with ESB enhancements) | 53,248 |
| Number of User I/O | 101 | 101 | 101 | 101 (max for TQFP-144) | 101 | 101 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -3 | -3 | C7 |
Key Differentiators
- Highest speed grade (-3) within the APEX 20K 100K-gate TQFP-144 family (vs EP20K100TC144-1)
- Pin-to-pin upgrade path to 200K-gate APEX 20K in the same TQFP-144 footprint (vs EP20K200TC144-3)
- Same TQFP-144 footprint as APEX 20KE with richer ESB features (vs EP20K100EFC144-3)
Design Notes
Estimated: at 100% utilization across 4,160 logic elements switching simultaneously at 167 MHz, the EP20K100TC144-3 core current can reach 0.4 A on the 2.5 V rail (roughly 1 W). Use a low-impedance 2.5 V LDO or switching regulator and place a 100 µF bulk plus 0.1 µF and 0.01 µF ceramic decoupling network within 5 mm of every VCCINT pin. VCCIO pins per bank require their own decoupling matched to the I/O standard and toggle rate; bank-powered I/O can add another 0.2 to 0.5 W at full LVCMOS-33 drive.
The 144-pin TQFP package has 0.5 mm lead pitch; follow JEDEC IPC-7351 land-pattern guidelines for TQFP-144 to avoid solder bridging. Use a 4-layer PCB with continuous ground and power planes, and route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance away from clock and switching I/O. Decoupling capacitors should be placed on the same side as the FPGA, between the pin and the nearest via to the power plane, with via count scaled to peak transient current.
Do not assume the bitstream is portable across APEX 20K density or package variants - even pin-compatible parts require recompilation if the die differs (for example EP20K100EFC144-3 vs EP20K100TC144-3). Always confirm that the JTAG chain order, configuration scheme (PS, AS, JTAG), and nCONFIG/nSTATUS pull-up values match the chosen configuration EPC or enhanced device. For multi-rail sequencing, bring up VCCINT first, then VCCIO, then drive nCONFIG high to avoid partial-configuration latch-up.
Estimated: at 1 W total power dissipation and a 144-TQFP theta_JA of approximately 35 °C/W (still air, JEDEC EIA/JESD51-2 4-layer board), junction temperature rise is roughly 35 °C above ambient. Within the 0 to 85 °C commercial range, this provides ~50 °C margin. For sealed enclosures, designers should add a thermal copper pour under the exposed pad area or upgrade to an FBGA package with lower theta_JA for higher-power designs.
Compliance Information
RoHS and REACH compliant per distributor listings. AEC-Q100 not applicable (commercial-grade FPGA; not qualified to automotive stress standards). Lead-free reflow-compatible. Halogen-free status not explicitly disclosed in available distributor data.
