EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel
MPN: EP3C40F324C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.42 | $78.42 |
| 10 | $72.1 | $721.00 |
| 100 | $65.88 | $6,588.00 |
| 500 | $60.55 | $30,275.00 |
| 1,000 | $56.2 | $56,200.00 |
EP3C40F324C8N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic circuits through a configuration bitstream stored in SRAM. FPGAs sit in the broader taxonomy of programmable logic device -> programmable logic IC -> semiconductor. They are widely used to implement glue logic, high-speed parallel DSP, custom bus interfaces, and hardware-accelerated functions that would otherwise require multiple discrete logic ICs or an ASIC. The Cyclone III family specifically targets cost-sensitive, low-power applications that still need the parallel processing and DSP density of an FPGA.
Key features of the EP3C40F324C8N include up to 215 user I/O pins (the 324-FBGA variant exposes the largest I/O count in the EP3C40 group), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic. Configuration is volatile (SRAM-based) so the bitstream must be reloaded from a flash or microcontroller on every power-up.
Architecturally, the Cyclone III device uses a 60 nm TSMC low-power process with a 1.2 V core. The Logic Array Block (LAB) is composed of 16 LEs, and columns of embedded memory and DSP blocks are interleaved across the fabric to provide local high-bandwidth connectivity. The four PLLs support programmable frequency synthesis, phase shifting, and spread-spectrum clocking. This combination enables the EP3C40 to drive high-throughput parallel DSP pipelines, video processing, and protocol bridging at low static and dynamic power.
Typical applications for the EP3C40F324C8N include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance prototypes, telecommunications line-card glue logic, low-cost software-defined radio front ends, and portable medical instrumentation. The 324-FBGA package makes the device suitable for board designs where maximum I/O count is required but a fine-pitch BGA assembly process is acceptable.
When designing with this part, note that the 1.2 V core and the PLL analog supply both require decoupling - place 0.1 uF and 10 uF capacitors close to each supply pin and use a power-plane cutout beneath the BGA to control return-current paths. The BGA also requires a multi-layer PCB with microvia or via-in-pad technology to reliably route all 324 balls. Finally, because the configuration memory is SRAM-based, a boot source (EPCS flash, parallel flash, or microcontroller) must be present at every power-up.
This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III EP3C family, and practical design notes not found in the manufacturer datasheet alone, giving a single reference for sourcing and engineering the EP3C40F324C8N.
Drop-in alternatives for EP3C40F324C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F324C8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Total Memory Bits, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F324C7N
✅ Drop-In✓ In Stock
$38.65 / Unit
View Datasheet →EP3C25F324C8N
✅ Drop-In✓ In Stock
$27.1 / Unit
View Datasheet →EP3C40F324C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | Cyclone III (EP3C40) |
| Logic Elements (LE) | 39,600 |
| Embedded Memory (bits) | 1,161,216 (~1.16 Mbit) |
| Embedded 18x18 Multipliers | 126 |
| Maximum User I/O | 215 |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS (TSMC) |
| Maximum Core Frequency | 402 MHz (speed grade 8) |
| Operating Temperature | 0C to +85C (commercial, C8 suffix) |
| Configuration Method | SRAM (volatile), requires external boot device |
| Package | FBGA-324 (324-ball FineLine BGA) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3C40F324C8N fbga-324 (324-ball fineline bga) Pin Configuration Guide
Pin configuration for EP3C40F324C8N (fbga-324 (324-ball fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40F324C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40F324C8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Infotainment and ADAS Prototyping, Telecom Line-Card Glue Logic, Software-Defined Radio Front End, Portable Medical Instrumentation.
Industrial Motor Control
The EP3C40F324C8N is a strong fit for industrial motor drives where Field-Oriented Control (FOC), Space Vector PWM, and encoder feedback must be computed in real time without round-trip latency to a host processor. The 126 embedded 18x18 multipliers accelerate the Park/Clarke transforms and PI controllers used in FOC, while the four PLLs synchronize the PWM switching frequency with the encoder quadrature clock. Its 39,600 logic elements are enough to host the entire control loop plus a Modbus or EtherCAT slave, removing the need for a companion DSP. Compared with a microcontroller-only solution, the FPGA delivers deterministic loop times down to a few microseconds and runs all three phases in parallel. The FBGA-324 footprint suits industrial control boards that already use BGA assembly for the gate drivers and power stage.
Recommended
Video Surveillance and Image Processing
The EP3C40F324C8N's 39,600 logic elements and 1.16 Mbit of embedded memory make it a natural choice for mid-resolution video surveillance pipelines. The on-chip M9K memory blocks act as line buffers for de-interlacing and Sobel-edge filters, while the 126 hardware multipliers handle 2D convolution in real time at common VGA and 720p frame rates. Pairing the FPGA with an external HDMI or LVDS camera sensor, the design can perform motion detection, color-space conversion, and H.264 preprocessing on-chip before forwarding compressed streams over Ethernet. The four PLLs generate independent pixel clocks for the camera input, the DDR2 frame buffer, and the network PHY. Compared with a CPU-based solution, the FPGA eliminates the frame-drop artifacts seen under heavy load and keeps latency bounded by line-buffer depth rather than by OS scheduling jitter.
Recommended
Automotive Infotainment and ADAS Prototyping
Automotive infotainment and early-stage Advanced Driver Assistance Systems (ADAS) prototypes frequently use the EP3C40F324C8N as a fast, flexible image-processing and sensor-fusion node. Its 126 embedded multipliers accelerate surround-view camera stitching and lane-detection kernels, while the four PLLs synchronize multiple LVDS camera inputs. Designers can iterate on lane-keeping, pedestrian-detection, or driver-monitoring algorithms in HDL and re-spin them in hours rather than weeks. The 1.2 V core keeps the part within automotive thermal envelopes, and the FBGA-324 package fits behind a small head-unit PCB. For production, the EP3C40F324A7N automotive-temperature variant is pin-compatible, enabling a single PCB layout to support both prototype and qualified builds.
Recommended
Telecom Line-Card Glue Logic
Telecommunications line cards often need custom glue logic between a network processor, framer ICs, and backplane SERDES links - exactly the role the EP3C40F324C8N was designed to fill. Its 215 user I/O pins (in the FBGA-324 footprint) provide enough LVTTL/LVDS pairs to bridge a TDM bus, an SPI management bus, and a backplane UART link without external mux ICs. The four PLLs synthesize the various clock domains required by E1/T1 framers and the backplane link. Because the Cyclone III device supports LVDS and SSTL I/O standards, it can also condition high-speed SERDES control signals. The result is a single low-power FPGA replacing several discrete logic ICs, simplifying the BOM and reducing board area on dense line-card designs.
Recommended
Software-Defined Radio Front End
Software-defined radio (SDR) platforms rely on an FPGA to perform channelization, digital down-conversion, and baseband preprocessing before samples are streamed to a host CPU or DSP. The EP3C40F324C8N's 126 embedded 18x18 multipliers are enough to host a 4-channel DDC chain at modest IF bandwidths, while the four PLLs generate the LO and sample clocks from a single TCXO reference. The 1.16 Mbit of embedded memory stores FIR filter coefficients and per-channel buffers without external SRAM. Pair the FPGA with an external ADC and the host processor; the FPGA's flexibility allows the same hardware to be repurposed for LTE, Wi-Fi, or proprietary waveforms simply by reloading the bitstream. Compared with a dedicated ASIC, the Cyclone III cuts prototype cost and lets radio researchers iterate in a single afternoon.
Recommended
Portable Medical Instrumentation
Portable medical instruments such as handheld ultrasound probes, pulse-oximetry front ends, and patient-monitoring wearables benefit from the EP3C40F324C8N's combination of DSP density and low 1.2 V core power. The 126 multipliers accelerate beamforming in single-element ultrasound probes, while the 1.16 Mbit of embedded memory buffers pre-beamformed RF lines. The four PLLs synchronize the transducer pulser, the ADC sample clock, and the USB 2.0 link to the host tablet. Because the Cyclone III device is fabricated on a 60 nm low-power process, total core power stays within the thermal budget of a battery-powered enclosure. The FBGA-324 footprint is appropriate for compact handheld boards where a fine-pitch BGA assembly line is available.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F324C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F324C7N | EP3C25F324C8N |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | FBGA-324 (1.0 mm pitch) | FBGA-324 (1.0 mm pitch) - same | FBGA-324 (1.0 mm pitch) - same |
| Logic Elements | 39,600 | 39,600 | 24,050 |
| Embedded Memory | 1,161,216 bits (1.16 Mbit) | 1,161,216 bits (1.16 Mbit) | 594,432 bits (~0.58 Mbit) |
| Embedded 18x18 Multipliers | 126 | 126 | 66 |
| User I/O (max) | 215 | 215 | 215 |
| PLLs | 4 | 4 | 4 |
| Speed Grade | C8 (commercial, 402 MHz core) | C7 (commercial, ~402 MHz core, +5-10% fMAX) | C8 (commercial, 402 MHz core) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest density in the Cyclone III FBGA-324 pinout group (vs EP3C25F324C8N)
- Same package footprint, faster speed grade available (vs EP3C40F324C7N)
- Pin-compatible commercial and automotive variants (vs EP3C40F324A7N)
Design Notes
Estimated: The EP3C40F324C8N core operates at 1.2 V; with a typical I/O bank mix at 3.3 V LVTTL, the total static current draw at room temperature is in the 300-500 mA range per the Cyclone III Device Handbook power estimator. Place one 0.1 uF MLCC within 3 mm of every VCCINT and VCCA pin, plus one 10 uF bulk capacitor near the package. Use a star-ground topology for the PLL analog supply (VCCA_PLL) and isolate it from digital ground with a ferrite bead to keep reference jitter under 50 ps RMS.
The FBGA-324 package has 1.0 mm ball pitch and requires a multilayer PCB (at least 6 layers recommended) with microvia or via-in-pad technology to fan out all 324 balls. Route signal traces on the top layer with the BGA escape pattern, dedicate inner layers to ground and power planes, and place all decoupling capacitors on the opposite side of the BGA within 3 mm of their respective supply balls. A continuous ground plane beneath the BGA improves thermal dissipation and reduces return-current loop area for high-speed LVDS pairs.
Configuration memory in the EP3C40F324C8N is SRAM-based and volatile - the bitstream is lost on every power-down. An external boot source (EPCS serial flash, parallel flash, or a microcontroller via Passive Serial) MUST be present at every power-up. Without a valid configuration, the device keeps all I/O tri-stated and does not respond to JTAG. Plan for a 50-200 ms boot window in your power-up timing budget and route MSEL[2:0] correctly to select the desired configuration scheme. Failing to do so is the single most common reason for a 'dead' board on first power-up.
Matched-length routing is required for any LVDS or DDR external memory interface. Use the Quartus II TimeQuest timing analyzer to extract length targets, then route pairs with a tolerance of +/- 25 mil for LVDS and +/- 50 mil for DDR2. Keep PLL analog supply traces short and isolated, and route the reference clock to the PLL clock input pin with a 50 ohm controlled-impedance trace and a 100 ohm differential termination at the receiver. Avoid crossing reference clock traces with high-speed SERDES lines to minimize crosstalk.
Compliance Information
RoHS-compliant per distributor listings. AEC-Q100 qualification not stated for the C8N suffix; use the EP3C40F324A7N automotive variant for AEC-Q100-style projects. Halogen-free and conflict-minerals status not stated in the verified distributor snippets.
