EP4CE6E22I8LN - Cyclone IV E FPGA, 6K LEs, 91 I/O | Intel
MPN: EP4CE6E22I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.03 | $26.03 |
| 10 | $23.42 | $234.20 |
| 100 | $20.82 | $2,082.00 |
| 500 | $18.22 | $9,110.00 |
| 1,000 | $15.62 | $15,620.00 |
EP4CE6E22I8LN Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined by the user after manufacture through a configuration bitstream. In the broader taxonomy, an FPGA sits within programmable logic devices (PLD) -> digital logic ICs -> integrated circuits (ICs) -> semiconductors. Cyclone IV E is positioned as a low-cost, low-power family within Intel's FPGA portfolio, intended to compete with mid-range ASICs and ASSPs in volume applications while preserving the design flexibility and time-to-market advantage of programmable hardware.
Key differentiating features of the EP4CE6E22I8LN include 6,272 logic elements arranged in 392 logic array blocks (LABs), 270 Kbits of embedded RAM, 15 embedded 18x18 multipliers for DSP operations, two general-purpose PLLs, and 91 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also supports external memory interfaces including DDR, DDR2, and QDRII SRAM, and includes a hard PCI Express (PIPE) interface block. Industrial-grade temperature range (-40C to +100C) is indicated by the 'I' designator, while the 'N' suffix denotes lead-free (Pb-free) RoHS compliance.
Typical applications for the EP4CE6E22I8LN span industrial control and factory automation, motor and servo drive control loops, low-cost video processing and display bridges, I/O expansion and protocol bridging for embedded processors, and glue-logic consolidation in medical, test and measurement, and consumer products. The combination of moderate logic capacity, embedded multipliers, and LVDS support makes it a strong fit for cost-driven designs that still require moderate DSP and parallel I/O bandwidth.
When designing with this device, pay close attention to decoupling strategy: place 100 nF ceramic capacitors adjacent to every VCCINT and VCCIO pin pair, and use bulk capacitors at the regulator outputs. The exposed thermal pad (EP) must be soldered to a properly sized copper pour to meet thermal and electrical performance; failure to connect the EP will degrade I/O performance and may compromise reliability.
Drop-in alternatives for EP4CE6E22I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6E22I8LN (same form factor and footprint) — differing in Package, Process Technology, RoHS Status, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE6E22I8L
✅ Drop-In✓ In Stock
$11.5 / Unit
View Datasheet →EP4CE6E22C9LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.95 / Unit
View Datasheet →EP4CE10E22I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.95 / Unit
View Datasheet →EP4CE15E22C8N
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →EP4CE22E22C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE6E22I8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 6,272 |
| Logic Array Blocks (LABs) | 392 LABs |
| Total RAM Bits | 276,480 bits |
| Embedded 18x18 Multipliers | 15 |
| General Purpose PLLs | 2 |
| Maximum User I/Os | 91 |
| Process Technology | 60 nm (low power) |
| Core Voltage (VCCINT) | 1.2 V |
| Package | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch |
| Operating Temperature | -40C to +100C (Industrial grade, 'I' designator) |
| Lead-Free (Pb-Free) | Yes ('N' suffix per industry convention) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| Maximum Internal Frequency | 200 MHz (typical application reference) |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), JTAG |
EP4CE6E22I8LN 144-lqfp exposed pad (eqfp-144), 22x22 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EP4CE6E22I8LN (144-lqfp exposed pad (eqfp-144), 22x22 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE6E22I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE6E22I8LN is suitable for 6 applications: Industrial Motor and Servo Drive Control, Industrial Protocol Bridging and I/O Expansion, Low-Cost Video Processing and Display Bridging, Test and Measurement Instrumentation, Automotive Aftermarket and Telematics, Medical Monitoring and Diagnostic Equipment.
Industrial Motor and Servo Drive Control
The EP4CE6E22I8LN is a strong fit for industrial motor and servo drive control loops thanks to its 6,272 logic elements for state machines, PID computation, and fault handling, plus 15 embedded 18x18 multipliers capable of running field-oriented control (FOC) math for three-phase permanent-magnet and induction motors. The two general-purpose PLLs generate the precise PWM carrier frequencies (typically 8-20 kHz) and the high-resolution edge placement demanded by modern SiC and IGBT gate drivers. With 91 user I/Os, the FPGA can interface to resolver-to-digital converters (RDC), encoder QEP channels, gate-driver fault pins, and isolated SPI links to host MCUs. The -40C to +100C industrial temperature grade handles the harsh thermal and vibration environment of factory floors. Compared with discrete DSPs, the FPGA gives design engineers far more flexibility to evolve the control algorithm in firmware without re-spinning hardware.
Recommended
Industrial Protocol Bridging and I/O Expansion
For embedded systems that need to bridge between Ethernet/IP, PROFINET, EtherCAT, Modbus TCP, RS-485, and CAN, the EP4CE6E22I8LN delivers 6,272 logic elements, 270 Kbits of embedded RAM, and 91 user I/Os in a cost-effective LQFP package. The FPGA's embedded transceivers, soft IP cores (Triple-Speed Ethernet MAC, CAN controllers), and reconfigurable I/O structure let engineers build a single-chip multi-protocol gateway that consolidates several discrete protocol stacks. Industrial temperature rating (-40C to +100C) and 1.2 V low-power operation make it suitable for DIN-rail-mounted PLCs and remote I/O blocks where power budget and ambient temperature are constrained. The exposed-pad package also improves thermal dissipation in sealed IP67 enclosures. Compared to ASIC solutions, this part gives OEMs flexibility to add new protocol revisions with firmware-only changes.
Recommended
Low-Cost Video Processing and Display Bridging
The EP4CE6E22I8LN supports LVDS, LVCMOS, RGB, and TTL display interfaces, plus external DDR/DDR2 memory controllers, making it suitable for low-cost video format conversion, image scaling, and display-bridging applications. The 6,272 logic elements handle horizontal/vertical scalers and color-space conversion (RGB to YCbCr, HDMI to LVDS) at 720p and modest 1080p resolutions. The 15 embedded 18x18 multipliers accelerate convolution kernels for sharpening or de-interlacing. Industrial temperature grade and 91 I/Os let designers connect to multiple simultaneous panels, touch controllers, and backlight drivers in industrial HMI panels, medical imaging preview screens, and digital signage players. The 144-pin EQFP package also gives board designers abundant GPIO for keypads, rotary encoders, and indicator LEDs.
Recommended
Test and Measurement Instrumentation
For entry-level oscilloscopes, logic analyzers, protocol analyzers, and bench-top data-acquisition systems, the EP4CE6E22I8LN provides ample logic, abundant LVDS I/Os for parallel ADCs, and reconfigurable DSP blocks for custom triggering and filtering. The 15 embedded 18x18 multipliers support real-time FIR filtering and FFT pre-processing for spectrum analysis, while the 91 I/Os drive 16-bit parallel ADCs and high-speed LVDS data capture. Industrial temperature rating makes it usable in production-floor ATE environments, and the EQFP-144 exposed-pad package is easy to probe and rework during prototype development. Compared to fixed-function DSPs, the FPGA enables vendors to ship the same hardware platform with multiple firmware personalities for oscilloscope, logic-analyzer, and protocol-analyzer SKUs.
Recommended
Automotive Aftermarket and Telematics
The EP4CE6E22I8LN is used in automotive aftermarket products such as fleet telematics units, dash-cam controllers, OBD-II gateways, and CAN bus bridges that demand industrial temperature range (-40C to +100C) and rugged mechanical packaging. The 6,272 LEs and 15 embedded multipliers can run CAN-FD decoding, sensor fusion, and basic image preprocessing, while the 91 user I/Os connect to multiple CAN transceivers, GPS modules, accelerometers, and LTE modems. Although the part is not AEC-Q100 qualified (unlike the -Q suffix variants), it is widely used in non-safety-critical in-cabin telematics and aftermarket infotainment where industrial temperature grade is sufficient. The low-power 60 nm process keeps battery drain low in always-on fleet-tracking devices.
Recommended
Medical Monitoring and Diagnostic Equipment
For medical monitoring devices such as portable patient monitors, blood-pressure modules, pulse oximetry front-ends, and point-of-care diagnostic instruments, the EP4CE6E22I8LN offers the right balance of low power, moderate DSP, and rich I/O. The 15 embedded 18x18 multipliers accelerate digital filtering and SpO2 plethysmographic waveform analysis, while the 6,272 LEs handle sensor-signal conditioning glue logic and display driving. Industrial temperature range supports disinfection-friendly sealed enclosures and warm-up environments. The lead-free RoHS-compliant finish supports modern medical manufacturing processes, and the 144-pin LQFP Exposed Pad is straightforward to assemble and rework during medical-device prototyping. Compared to fixed-function microcontrollers, the FPGA enables one platform to support multiple product variants via firmware.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6E22I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6E22I8L | EP4CE6E22C9LN | EP4CE10E22I8N | EP4CE15E22C8N | EP4CE22E22C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-144 (22x22 mm, 0.5 mm pitch) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Logic Elements | 6,272 | 6,272 | 6,272 | 10,320 (+65%) | 15,408 (+146%) | 22,320 (+256%) |
| Embedded RAM (bits) | 276,480 | 276,480 | 276,480 | 423,936 | 516,096 | 608,256 |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 23 | 56 | 66 |
| User I/Os | 91 | 91 | 91 | 91 | 91 | 91 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free Finish | Yes ('N' suffix) | No (legacy lead-bearing) | Yes | Yes | Yes | Yes |
| Process / Core Voltage | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V |
Key Differentiators
- Lowest-cost Cyclone IV E in EQFP-144 with industrial temperature grade (vs EP4CE6E22C9LN)
- Lead-free RoHS-compliant finish on industrial-grade Cyclone IV E (vs EP4CE6E22I8L)
- Drop-in upward-compatible Cyclone IV E family with 91 I/O preserved (vs EP4CE10E22I8N)
Design Notes
The Cyclone IV E VCCINT core supply requires a tightly regulated 1.2 V rail capable of delivering up to approximately 500 mA for EP4CE6E22I8LN at full utilization. Place 100 nF ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin pair, plus 4.7 uF and 10 uF bulk capacitors at the regulator output. Per the Cyclone IV Handbook Power section, use a ferrite bead on each VCCIO bank if multiple I/O voltages are mixed. A 2.5 V or 3.3 V VCCAUX supply is also required for PLL analog blocks; decouple VCCAUX with 1 uF and 100 nF in parallel. Estimated: IIDLE core current of 50-80 mA plus I/O bank current scales with toggle rate; budget at least 1.5 W peak for regulator headroom.
The 144-pin EQFP package relies on the exposed thermal pad (EP) for heat dissipation; failure to solder the EP to a continuous ground copper pour will result in elevated junction temperature and degraded I/O performance. Intel recommends a minimum 1 oz copper pour covering at least 80% of the EP area, with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the EP to internal ground planes. For designs operating above 70C ambient with sustained high toggle rates, add a small heatsink or copper-spreader plate. Estimated: theta-JA of EQFP-144 with 4-layer 2 oz copper is approximately 22 C/W; at 1 W dissipation the junction rises about 22C above ambient.
Route all configuration, clock, and JTAG signals with 50-ohm controlled impedance and keep them away from switching I/O traces. Place the configuration EEPROM (e.g., EPCS4 or EPCQ4) within 100 mm of the FPGA's MSEL[3..0] and DATA/DCLK pins to ensure reliable AS-mode configuration. The nCONFIG, nSTATUS, and CONF_DONE pins require 10 kohm pull-ups to VCCIO of their bank. Differential clock inputs (CLK0-CLK9) should be routed with matched-length pairs and terminated near the FPGA. Per Intel's Cyclone IV Hardware Reference, route LVDS pairs with 100-ohm differential impedance and 2x the spacing of single-ended traces to minimize crosstalk.
Avoid these common pitfalls with the EP4CE6E22I8LN: (1) Don't forget to solder the exposed pad - it is required for thermal and electrical reasons, not optional. (2) Don't route LVDS pairs without impedance control; you will see severe signal-integrity issues. (3) Don't omit the JTAG pull-ups on TCK, TMS, TDI, and TDO; some debug tools won't recognize the device. (4) Don't configure VCCIO banks above their rated voltage - each bank supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on the standard. (5) Don't assume the MSL level - check the moisture sensitivity level before opening the package and reflowing. (6) Don't forget to specify lead-free profile (peak 245-260C) for the 'N' suffix variant.
Compliance Information
RoHS and REACH compliant per Intel Cyclone IV E family documentation and Avaq cross-reference data. The 'N' suffix designates lead-free (Pb-free) finish. AEC-Q100 is not applicable for FPGAs in the standard Cyclone IV E family - the automotive-qualified variants carry a separate -Q suffix and are listed under different part numbers. Halogen-free status and conflict-minerals compliance are unknown because Intel's public Cyclone IV documentation does not explicitly state either attribute.
