EP4SGX360FH29I3 - Stratix IV GX FPGA | Intel | High-Speed Systems
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EP4SGX360FH29I3 Overview
An FPGA, or field-programmable gate array, is an integrated circuit containing programmable logic elements, routing, memory blocks, and I/O resources. Unlike a fixed-function ASIC, its digital behavior can be defined through a configuration bitstream. Stratix IV GX devices belong to Intel's Stratix family and are designed for systems that need both parallel digital processing and high-speed serial connectivity. The product type hierarchy is FPGA, programmable logic device, semiconductor, and integrated circuit.
The principal verified attributes are 353600 logic cells, 23105536 memory bits, and 289 I/O. The 780-pin FC-HFBGA package supports a high number of connections while using a fine-pitch, surface-mount BGA format. A 0.9 V core supply is consistent with the low-voltage operating point stated in the distributor and directory listings. Embedded memory enables local buffering and state storage, while programmable I/O allows adaptation to multiple digital interfaces.
From an architectural perspective, the device is suited to designs requiring many parallel datapaths and configurable control logic. Stratix IV GX FPGAs are associated with high-speed transceiver-oriented applications, but the supplied data does not state a specific transceiver count, maximum data rate, or transceiver electrical specification. Those values must be obtained from the manufacturer documentation before system-level signal-integrity or bandwidth calculations. Designers should treat configuration, clocking, power integrity, and pin-assignment requirements as architecture-dependent.
Typical applications include communication infrastructure, industrial automation, test and measurement, digital signal processing, and high-speed interface bridging. For a communications system, the 289 I/O and 23105536 embedded memory bits support parallel protocol handling and packet buffering. In industrial equipment, programmable logic can consolidate timing, control, and interface functions. In test systems, the FPGA can coordinate data acquisition, formatting, and transport.
The central design trade-off is package and power planning. The 780-ball FC-HFBGA package requires careful BGA escape routing, controlled-impedance power distribution, and verified assembly capability. The supplied data does not provide package dimensions, transceiver specifications, operating temperature, configuration memory details, or exact I/O standards, so those parameters remain marked as needed. This page synthesizes verified distributor data, package information, application context, and explicit data gaps without inventing specifications.
Drop-in alternatives for EP4SGX360FH29I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360FH29I3 (same form factor and footprint) — differing in Package, Operating Temperature, Family, RoHS Status, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360FH29C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4850 / Unit
View Datasheet →EP4SGX360FH29C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3225 / Unit
View Datasheet →EP4SGX360FH29C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1495 / Unit
View Datasheet →EP4SGX360FH29C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP4SGX360FH29C2XN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2210 / Unit
View Datasheet →EP4SGX360FH29I3 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel / Altera |
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix IV GX |
| Logic Cells | 353600 cells |
| Embedded Memory | 23105536 bits |
| User I/O | 289 I/O |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Package | 780-pin FC-HFBGA |
| Terminal Count | 780 balls |
| Package Form | Ball Grid Array (BGA) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | not_applicable |
EP4SGX360FH29I3 ball grid array (bga) Pin Configuration Guide
Pin configuration for EP4SGX360FH29I3 (ball grid array (bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360FH29I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360FH29I3 is suitable for 6 applications: Communication Infrastructure, Industrial Automation, Test and Measurement Equipment, Digital Signal Processing, High-Speed Interface Bridging, Embedded Data Processing.
Communication Infrastructure
EP4SGX360FH29I3 fits communication infrastructure where programmable datapaths, protocol processing, and parallel I/O are required in one device. Its verified resource set includes 353600 logic cells, 23105536 embedded memory bits, and 289 user I/O, allowing a designer to implement control, framing, buffering, and interface functions. The Stratix IV GX classification supports investigation of high-speed serial architectures, but the verified data does not provide transceiver count, maximum data rate, or channel electrical limits. Confirm those specifications in the manufacturer datasheet. The 780-pin FC-HFBGA package also demands controlled-impedance routing and careful power delivery. In a communication system, use the FPGA between parallel data sources and high-speed serial or external memory interfaces, with the exact interface selected only after timing and signal-integrity review.
Recommended
Industrial Automation
EP4SGX360FH29I3 can serve as a configurable control and processing device in industrial automation equipment. The 289 user I/O provide a substantial interface count for sensors, actuators, control panels, and communication links, while 353600 logic cells support state machines, timing logic, protocol adaptation, and real-time datapaths. The 23105536 bits of embedded memory can support local buffering and intermediate data storage. The device should be paired with carefully selected I/O transceivers, protection circuits, and power conditioning. The supplied data does not specify operating temperature, supported I/O standards, or I/O bank limits, so industrial qualification cannot be completed from the verified facts alone. The 780-pin FC-HFBGA package requires an assembly process capable of fine-pitch BGA soldering and a PCB stackup designed for reliable escape routing.
Recommended
Test and Measurement Equipment
EP4SGX360FH29I3 is suitable for test and measurement platforms that need programmable acquisition control, data formatting, and deterministic processing. Its 353600 logic cells provide capacity for custom timing, trigger, filtering, and interface logic, while the 23105536 embedded memory bits can support intermediate capture and buffering. The 289 I/O allow multiple parallel instruments, sensors, or control channels to be connected under one programmable architecture. Exact analog, sampling, and I/O performance cannot be inferred from the supplied FPGA data, and the part does not replace dedicated signal-conditioning or data-converter circuitry. A practical design would connect the FPGA to ADC/DAC or sensor interfaces through carefully defined I/O banks. Review manufacturer specifications for clocking, configuration, power integrity, and supported standards before committing the PCB layout.
Recommended
Digital Signal Processing
EP4SGX360FH29I3 can implement configurable digital signal-processing functions in systems that need parallel processing and adaptable control. The verified 353600 logic cells provide a large programmable fabric for filters, transforms, encoders, decoders, and custom arithmetic pipelines, while 23105536 embedded memory bits help with local data storage. Its 289 user I/O support multiple data and control paths. Performance depends on the selected architecture, clocking scheme, device configuration, and external memory interface; the supplied data does not state DSP block count, maximum clock frequency, or memory throughput. Designers should use the manufacturer timing and power documentation to estimate pipeline capacity. Place the FPGA between converters or external data sources and the system processor, using deterministic clock domains and verified signal-integrity practices.
Recommended
High-Speed Interface Bridging
EP4SGX360FH29I3 is a candidate for bridging between high-speed serial sources and parallel or custom interfaces because it belongs to the Stratix IV GX FPGA family. The verified 289 I/O can expose parallel data paths, while the 353600 logic cells can perform protocol conversion, buffering, and control. However, the provided data does not specify the number of transceivers, supported serial rates, reference-clock inputs, or electrical compliance, so a high-speed design cannot be qualified from the search snippets alone. Validate the exact Intel ordering-code documentation, channel placement, termination, and power rails. The 780-pin FC-HFBGA package also requires controlled impedance, short escape routes, and a power-delivery network designed for the intended clock and traffic conditions.
Recommended
Embedded Data Processing
EP4SGX360FH29I3 can be used as the programmable processing core in embedded systems requiring custom data handling. The combination of 353600 logic cells and 23105536 embedded memory bits supports datapaths, state machines, local buffers, and protocol-specific logic. Its 289 user I/O offer flexibility for connecting application-specific peripherals, while the 0.9 V core supply listed in the verified data is an important input to power-system design. The available evidence does not include maximum operating frequency, power consumption, configuration method, thermal resistance, or supported I/O standards. Designers should therefore obtain the manufacturer datasheet and power estimator before fixing the clock, thermal design, decoupling network, or external memory topology. Use the FPGA to consolidate functions that would otherwise require several fixed digital devices, while preserving clear timing and interface constraints.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360FH29I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360FH29C4N | EP4SGX360FH29C4 | EP4SGX360FH29C3N | EP4SGX360FH29C3 | EP4SGX360FH29C2XN |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-HFBGA | 780-pin FC-HFBGA | 780-pin FC-HFBGA | 780-pin FC-HFBGA | 780-pin FC-HFBGA | 780-pin FC-HFBGA |
Key Differentiators
- Verified high logic-cell capacity (vs EP4SGX360FH29C3N)
- Large embedded memory resource (vs EP4SGX360FH29C3)
- High verified user-I/O count (vs EP4SGX360FH29C4N)
Design Notes
Plan the 780-pin FC-HFBGA escape strategy before schematic capture. Confirm the manufacturer ball map, layer stackup, via-in-pad or dog-bone strategy, and the location of all power and ground balls. Keep high-speed routes short, maintain a continuous reference plane, and verify impedance and crosstalk with the final stackup. The supplied data confirms the package type but does not provide individual ball assignments, so no pin-level route should be released from search-result information.
Treat the verified 0.9 V core supply as the starting point for power architecture, not as a complete power specification. The available data does not state voltage tolerance, current demand, sequencing, ramp rate, or separate I/O rail requirements. Obtain the manufacturer power-estimation guidance, use local low-impedance decoupling at the appropriate supply pins, and validate rail behavior with the target configuration and clocking scheme. A regulator selected only for nominal voltage may be inadequate for transient FPGA demand.
Define each interface bank and its voltage before assigning I/O. The 289 user I/O are a verified resource count, but supported I/O standards, bank limits, termination values, and direction constraints are not supplied. For parallel buses, control skew and establish a known timing relationship at the FPGA pins. For high-speed serial links, verify transceiver count, maximum rate, channel placement, reference clocks, and loss budget from the exact manufacturer datasheet. Prototype or simulate the selected interface rather than relying on family-level assumptions.
Do not treat similarly named EP4SGX360 ordering codes as automatic substitutes. The I3, C4N, C4, C3N, C3, and C2XN suffixes may correspond to different speed, temperature, or ordering characteristics, while the supplied data does not provide a complete equivalence table. A true drop-in decision requires package-ball comparison, configuration compatibility, speed-grade review, temperature-range review, power comparison, and verification of all I/O and transceiver requirements.
Compliance Information
The verified search data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declarations. AEC-Q100 is not applicable to the supplied product data, but this does not establish a formal qualification claim.
