EPF81500ARC304-4 - FLEX 8000 FPGA, 16K Gates, 304-RQFP | Altera
MPN: EPF81500ARC304-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58.17 | $58.17 |
| 10 | $53.2 | $532.00 |
| 100 | $48.75 | $4,875.00 |
| 500 | $44.1 | $22,050.00 |
| 1,000 | $40.5 | $40,500.00 |
EPF81500ARC304-4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs occupy a tier in the digital logic hierarchy above simple PLDs and below fixed-function ASICs, offering high gate density, in-system reconfigurability, and parallel processing capability. The FLEX 8000 architecture sits within this hierarchy as a register-rich, low-cost family optimized for glue logic, bus interfaces, TTL integration, coprocessor functions, and high-speed controllers.
Key features include 1,296 logic cells, an in-circuit reconfigurability (ICR) interface that supports external EPC1, EPC1213, EPC1064, and EPC1441 configuration devices, and a maximum internal operating frequency in the 125 MHz class. The 304-RQFP package exposes 208 user I/Os, enabling integration of multiple 32-bit buses and wide data-path manipulation within a single device - a strong fit for DSP pre/post-processing and data transformation pipelines. The SRAM-based configuration memory allows unlimited reconfiguration cycles, supporting prototyping and field-upgrade scenarios.
The architecture combines four-input look-up tables with fast carry chains for arithmetic, dedicated registers on every logic cell for pipelined designs, and a continuous routing fabric with predictable delay. MultiVolt I/O permits mixed 3.3 V/5.0 V interfacing on supported package variants, simplifying board-level integration with legacy and modern logic families. The device is configured at system power-up via industry-standard parallel EPROM, an Altera serial configuration device, or a microprocessor - giving designers flexibility across manufacturing flows.
Typical applications include high-speed bus interfaces, TTL gate-array replacement, coprocessor and peripheral controller functions, and DSP pre/post-processing in telecommunications, industrial control, and military/aerospace systems. Designers choose the FLEX 8000 family when register density and I/O count matter more than the absolute lowest per-unit cost of a fixed ASIC, particularly in low-to-medium volume production where NRE charges cannot be amortized.
When designing with this part, plan configuration memory storage and clock distribution carefully: the FLEX 8000 architecture requires a clean 5 V rail and proper decoupling near the supply pins, plus a configuration clock source if using a serial configuration device. The 304-RQFP package is large (40x40 mm) and requires a substantial PCB footprint, so mechanical layout and thermal vias under the die-attach pad should be considered for high-utilization designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EPF81500ARC304-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF81500ARC304-4 (same form factor and footprint) — differing in Configuration Method, Process Technology, Usable Gates, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF81500ARC304-3
✅ Drop-In✓ In Stock
$32.5 / Unit
View Datasheet →EPF81500ARC304-2
✅ Drop-In✓ In Stock
$92.5 / Unit
View Datasheet →EPF81500ARC304-2A
✅ Drop-In📋 Reference alternative (not in catalog)
EPF81500ARC304-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF81500ARC304-4N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF81500ARC304-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 16,000 (max) |
| Logic Elements / Cells | 1,296 |
| Registers | 1,500 |
| User I/O Pins | 208 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| I/O Voltage | 5.0 V (MultiVolt on supported packages) |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Internal Frequency (max) | 125 MHz |
| Configuration Method | Serial or parallel EPROM, EPC1/EPC1213/EPC1064/EPC1441, or microcontroller |
| In-Circuit Reconfigurability | Yes (ICR) |
| Package / Case | 304-RQFP (304-BFQFP, 40x40 mm) |
| Supplier Device Package | 304-RQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) |
| RoHS Status | Compliant (per current distributor listings) |
EPF81500ARC304-4 304-rqfp Pin Configuration Guide
Pin configuration for EPF81500ARC304-4 (304-rqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF81500ARC304-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF81500ARC304-4 is suitable for 6 applications: High-Speed Bus Interface Bridging, TTL Gate-Array Replacement, DSP Pre/Post-Processing Pipeline, Peripheral and Coprocessor Controller, Industrial Control Logic Integration, Legacy Avionics and Defense Logic.
High-Speed Bus Interface Bridging
The EPF81500ARC304-4 is well suited to bridge legacy and modern bus architectures - for example, gluing a 32-bit PCI bus to a custom peripheral bus or aggregating multiple 8/16-bit legacy interfaces into a single wider channel. Its 208 user I/Os in the 304-RQFP are sufficient to bring in three full 32-bit buses plus control, while the 16K-gate / 1,500-register capacity absorbs moderate state-machine and FIFO logic without external TTL. Designers typically instantiate async FIFOs and bus-state machines; the FLEX 8000 register-rich fabric helps meet timing at 33 MHz PCI and similar rates. MultiVolt I/O on supported package variants enables 5 V/3.3 V mixing on the same board, easing integration with older peripherals.
Recommended
TTL Gate-Array Replacement
For designs that would otherwise consume a board full of 74LS/74F TTL glue, the EPF81500ARC304-4 collapses random logic, decoders, latches, and simple state machines into a single programmable device. With 1,296 logic cells and 1,500 registers, it can replace dozens of TTL packages, reducing board area, power, and BOM count. In-system SRAM configuration makes prototype iterations fast: a designer can re-spin logic in minutes without board rework. MultiVolt I/O further helps when the TTL mix spans 3.3 V and 5 V, eliminating level-translator chips. This use case is a sweet spot for FLEX 8000 in legacy industrial and aerospace systems.
Recommended
DSP Pre/Post-Processing Pipeline
The register-rich FLEX 8000 fabric makes the EPF81500ARC304-4 effective as a pre- or post-processor ahead of a dedicated DSP or ASIC. Designers implement FIR/IIR filter stages, data-format converters, address generators, and ping-pong buffer control in the FPGA, freeing the DSP for inner-loop math. The 208 user I/Os accommodate wide data paths (16/32-bit) plus parallel memory buses for SRAM or dual-port RAM buffering. At 125 MHz internal fMAX, real-time video or telecom sample rates up to tens of MSPS are realistic. Designers should plan pipelined arithmetic and use the dedicated fast-carry chains for adder trees.
Recommended
Peripheral and Coprocessor Controller
The EPF81500ARC304-4 fits the role of a peripheral controller or coprocessor in larger systems - for example, offloading DMA, scatter-gather list management, interrupt aggregation, or protocol handling from a host CPU. Its 16K-gate capacity absorbs the controller state machine plus small FIFOs and register files, while 208 I/Os are ample for the host interface, multiple peripheral interfaces, and interrupt/control lines. In-circuit reconfigurability (ICR) lets the same board support several controller personalities loaded at boot, useful for field-upgradable industrial platforms and test equipment. Plan configuration memory (EPC1/EPC1441) accordingly.
Recommended
Industrial Control Logic Integration
In industrial automation, the EPF81500ARC304-4 integrates discrete I/O handling, encoder/counter logic, PWM generation, and Modbus/Profibus-style protocol framing in a single device. The 208 user I/Os comfortably serve 24V-to-5V optically-isolated inputs and outputs at typical 8- or 16-bit channel groupings, while 1,500 registers support state machines and timing generators. SRAM-based configuration enables on-line firmware updates for long-life industrial platforms. Designers must respect the 5 V supply requirement, add robust decoupling, and observe ESD handling on field-wired I/O lines. The 304-RQFP is large but proven in industrial layouts.
Recommended
Legacy Avionics and Defense Logic
Because the FLEX 8000 family is mature and still supported by long-term-supply distributors such as Rochester Electronics, the EPF81500ARC304-4 remains a viable option for legacy avionics, defense, and aerospace programs requiring continued production of fielded designs. Its 5 V operation, proven 304-RQFP hermetic-compatible footprint, and known radiation-tolerance characteristics make it familiar to systems that must not be redesigned. The 16K-gate capacity suits mission-specific I/O expansion, MIL-STD-1553 bridging, or discrete-signal consolidation. Always verify the latest long-term-supply roadmap with the manufacturer before committing to new programs.
Recommended
Recommended Products Summary
Engineering reference data for EPF81500ARC304-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81500ARC304-3 | EPF81500ARC304-2 | EPF81500ARC304-2A | EPF81500ARC304-3N | EPF81500ARC304-4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 304-RQFP (40x40 mm) | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same | 304-RQFP (40x40 mm) - same |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 |
| User I/Os | 208 | 208 | 208 | 208 | 208 | 208 |
| Speed Grade | -4 (fastest) | -3 | -2 (slowest) | -2A | -3 (Pb-free) | -4 (Pb-free) |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Configuration Interface | Serial/parallel EPROM, EPC1/EPC1213/EPC1064/EPC1441, MCU | Same | Same | Same | Same | Same |
| Lifecycle Status | Obsolete (per Rochester Electronics listing) | Obsolete / NRND | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest 304-RQFP speed grade in the FLEX 8000 EPF81500 family (vs EPF81500ARC304-3)
- 208 user I/Os - the largest in the FLEX 8000 family (vs EPF81500ARC240-4)
- Mature long-term supply chain via authorized aftermarket (vs EPF10K50VRC240-4)
Design Notes
The EPF81500ARC304-4 requires a tightly regulated 4.75 V to 5.25 V supply on VCCINT; place 100 nF decoupling capacitors within 5 mm of every VCC pin and add bulk 10-47 µF tantalum or polymer caps near the package. I/O banks draw additional current proportional to switching frequency and load - estimate up to several hundred mA per bank at full utilization. MultiVolt I/O lets 3.3 V and 5 V interfaces coexist on supported package variants, but each bank must be configured consistently; mixing within one bank is not allowed.
Configuration failures are the most common bring-up issue. Verify that nCONFIG is driven correctly during power-up, that the configuration clock (DCLK) is clean, and that CONF_DONE goes high before the FPGA enters user mode. Mismatched MSEL/ mode-pin settings between the FPGA and the EPC1/EPC1213/EPC1064/EPC1441 configuration device will prevent configuration. Plan for at least 100 ms of POR delay before driving user I/O. Designers upgrading from EPC1 to EPC1441 must also re-validate configuration timing because data-stream length changes.
The 304-RQFP (40x40 mm) package dissipates heat primarily through its leads and PCB copper, with no exposed thermal pad. Estimated junction-to-ambient thermal resistance (theta_JA) is roughly 20-25 C/W on a 4-layer JEDEC test board with adequate copper pour. Estimated: at 5 V VCCINT and 80% utilization the device can draw 0.5-1 A, so worst-case power dissipation approaches 5 W. For continuous operation above 2-3 W, add thermal vias under the package perimeter and consider airflow. Always measure under worst-case vector patterns because FPGA power is design-dependent.
The 304-RQFP has a 0.5 mm or 0.8 mm pitch (verify against the family datasheet for this specific variant) and requires a substantial PCB footprint. Use controlled-impedance routing for clocks and high-speed buses, and keep configuration signals (DATA, DCLK, nCONFIG, nSTATUS, CONF_DONE) short and away from switching I/O to avoid coupling into the configuration stream. The 208 user I/Os benefit from escaping the package in a star or fly-by topology - plan BGA-like breakout discipline even though the package is peripheral-leaded.
Compliance Information
Lifecycle is obsolete per Rochester Electronics listing. RoHS compliance per current distributor listings. AEC-Q100 not applicable (FPGA). Lead-free and halogen-free status not explicitly stated in the verified web data.
