EPF8820ARQ208-3N - FLEX 8000 FPGA 8K Gates 672 Cells 5V RQFP-208
MPN: EPF8820ARQ208-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.75 | $427.50 |
| 100 | $36.2 | $3,620.00 |
| 500 | $30.8 | $15,400.00 |
| 1,000 | $26.4 | $26,400.00 |
EPF8820ARQ208-3N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells, all of which are defined by SRAM configuration bits loaded at power-up. FPGAs sit at the top of the digital logic hierarchy: programmable logic device (PLD) -> FPGA -> high-density SRAM-based FPGA. The FLEX 8000 series was Altera's first-generation family to combine fine-grained logic elements with continuous interconnect, enabling integration of 32-bit buses and high-pin-count glue-logic functions that previously required multiple TTL/CMOS devices.
Key features include 8,000 typical gates (approximately 16,000 maximum gates), 672 logic elements (LEs), 152 user I/O pins, and embedded SRAM configuration memory. The device operates from a single 5 V supply with 3.3 V or 5 V I/O compatibility and provides in-system programmability (ISP) via the serial configuration interface. Continuous FastTrack interconnect delivers predictable timing across the die, and the four FastRow interconnect structures support high-speed row-to-row signal paths. The architecture is supported by the MAX+PLUS II and Quartus design environments for schematic, VHDL, and Verilog entry.
Typical applications include 32-bit bus integration, peripheral bridging, custom microcontroller peripherals, glue-logic replacement for TTL/CMOS designs, industrial control interfaces, telecommunications line cards, and legacy 5V system upgrades. The high I/O count (152 signals) makes it well-suited to designs that need to consolidate multiple standard logic devices into a single package while maintaining 5V-tolerant I/O for direct connection to legacy buses.
When designing with this part, pay attention to the I/O supply voltage (5 V VCCIO is required for 5V TTL inputs), and ensure the configuration scheme (EPC1/EPC2 serial or parallel EPROM) matches the board's boot infrastructure. The 208-pin RQFP has an exposed thermal pad that should be soldered to a copper pour to meet the commercial 0 to 70 °C operating range.
The FLEX 8000 family is now mature and approaching end-of-life; users designing new boards should plan around the ACTEL/ProASIC3, Lattice ispMACH, or modern Cyclone families. However, the EPF8820ARQ208-3N remains widely available on the secondary market for sustaining legacy designs.
This page synthesises distributor stock, same-package drop-in alternatives within the FLEX 8000 family, and practical design notes not found in the original datasheet, giving engineers a single reference for procurement, replacement, and obsolescence planning.
Drop-in alternatives for EPF8820ARQ208-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF8820ARQ208-3N (same form factor and footprint) — differing in Package, Process Technology, Configuration Method, Device Type, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8820ARQ208-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8820ARQ208-4N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8820ARI208-3N
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →EPF8820ARI208-3
✅ Drop-In✓ In Stock
$55.4 / Unit
View Datasheet →EPF8820ARC208-3N
✅ Drop-In✓ In Stock
$85 / Unit
View Datasheet →EPF8820ARQ208-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Typical Gates | 8,000 |
| Maximum Gates | 16,000 |
| Logic Cells / Logic Elements | 672 |
| User I/O Pins | 152 |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| I/O Voltage | 5 V TTL compatible |
| Package | 208-pin RQFP (Power QFP) |
| Configuration Method | Serial (EPC1/EPC1064/EPC1213/EPC1441) or parallel EPROM |
| Speed Grade | -3 |
| Temperature Range | 0 °C to +70 °C (commercial, N suffix) |
| Lead Finish | Lead-free NiPdAu (N suffix) |
| Mounting Type | Surface Mount |
EPF8820ARQ208-3N 208-pin rqfp (power qfp) Pin Configuration Guide
Pin configuration for EPF8820ARQ208-3N (208-pin rqfp (power qfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ARQ208-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF8820ARQ208-3N is suitable for 6 applications: 32-bit Bus Integration and Peripheral Bridging, Industrial Control and Factory Automation, Telecommunications Line Cards and Channel Banks, Legacy 5V System Glue Logic Consolidation, Custom Microcontroller Peripheral Expansion, Test Equipment and Instrumentation Backplanes.
32-bit Bus Integration and Peripheral Bridging
The EPF8820ARQ208-3N's 152 user I/O pins and 8,000-gate capacity make it ideal for integrating 32-bit microprocessor buses, PCI bridge glue logic, and custom peripheral controllers in a single device. With 672 logic elements and continuous FastTrack interconnect, designers can implement wide datapath registers, address decoders, and wait-state generators on one die. Typical designs place the FPGA between an embedded CPU (such as an 80386, MPC860, or i960) and external peripherals, replacing 8 to 15 standard logic devices. The 5 V I/O tolerance directly interfaces with legacy 5 V TTL buses without level shifters.
Recommended
Industrial Control and Factory Automation
Industrial controllers often require combining high-voltage I/O, encoder interfaces, motor-control timers, and protocol bridges in a single rugged package. The EPF8820ARQ208-3N (commercial) or its industrial sibling EPF8820ARI208-3N handles quadrature decoder logic, PWM generators, and CAN/RS-485 glue logic at 5 V logic levels. The 208-pin RQFP footprint provides enough I/O for 8 to 16 axis of motion control with 5V-tolerant inputs. Designers value the SRAM-based architecture for field firmware updates via the JTAG port, which is critical for deployed industrial systems that cannot be returned for reprogramming.
Recommended
Telecommunications Line Cards and Channel Banks
Telecom line cards of the late 1990s and 2000s used FLEX 8000 devices for T1/E1 framer glue logic, HDLC controllers, and time-slot interchangers. The EPF8820ARQ208-3N delivers 8,000 gates with up to 125 MHz Fmax, sufficient for 8-channel HDLC aggregation at 2.048 MHz per channel. Its 152 I/Os interface directly to 5 V framers, LIU ICs, and backplane transceivers without external buffers. The SRAM configuration also supports in-system field upgrades as telecom protocols evolved.
Recommended
Legacy 5V System Glue Logic Consolidation
Older 5V designs filled with PALs, GALs, 74FCT logic, and discrete TTL can be consolidated onto a single EPF8820ARQ208-3N. The device replaces 10 to 20 small logic ICs, reducing board area and improving reliability. Engineers port the original Boolean equations to VHDL or Verilog and use MAX+PLUS II to fit the design. The 5 V I/O directly drives legacy 74LS/74AS/74FCT peripherals, eliminating level translation. This application is particularly attractive for defence and aerospace sustainment programmes that must keep 20-year-old systems operational.
Recommended
Custom Microcontroller Peripheral Expansion
When off-the-shelf microcontrollers lack a specific peripheral (USB 1.1 controller, IrDA encoder, smartcard interface, or graphics LCD controller), designers often turn to an FPGA companion. The EPF8820ARQ208-3N serves as a flexible peripheral coprocessor for 8051, PIC, and ARM7-class hosts. With 672 LEs and 152 I/Os, the device implements the missing peripheral and exposes it via memory-mapped registers or an 8/16-bit parallel bus. The 5 V tolerance matches the host MCU supply and removes level-shifters from the design.
Recommended
Test Equipment and Instrumentation Backplanes
Test and measurement instruments - oscilloscopes, logic analysers, protocol testers - often require custom backplane logic for routing measurement channels. The EPF8820ARQ208-3N's 152 I/Os and 125 MHz Fmax enable cross-point switching matrices, channel multiplexers, and trigger logic for instruments with 32 to 64 input channels. Designers can reconfigure the FPGA in the field as new test modes are added, providing a future-proof upgrade path for capital equipment sold into R&D laboratories.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARQ208-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARQ208-3 | EPF8820ARQ208-4N | EPF8820ARI208-3N | EPF8820ARI208-3 | EPF8820ARC208-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 208-pin RQFP (Power QFP) | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin BFQFP - DIFFERENT footprint |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| Typical Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O Pins | 152 | 152 | 152 | 152 | 152 | 152 |
| Speed Grade | -3 | -3 (same speed bin) | -4 (slower, ~15%) | -3 (same speed bin) | -3 (same speed bin) | -3 (same speed bin) |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) |
| Lead Finish | Lead-free NiPdAu (N suffix) | SnPb (matte tin) | Lead-free NiPdAu | Lead-free NiPdAu | SnPb | Lead-free NiPdAu |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Lead-free NiPdAu lead finish on the -3N variant (vs EPF8820ARQ208-3)
- Commercial temperature range specifically (vs EPF8820ARI208-3N)
- RQFP-208 package is mechanically compatible across the speed grades (vs EPF8820ARQ208-4N)
Design Notes
The EPF8820ARQ208-3N requires a stable 5 V VCC and a 5 V VCCIO supply for 5 V TTL I/O. Add 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC/VCCIO pin, plus a single 47 µF tantalum bulk capacitor near the package. Power-on ramp time should be monotonic and slower than 50 ms to ensure the configuration PROM (EPC1/EPC1064/EPC1213/EPC1441) is ready before the FPGA enters configuration mode. Estimated: ICC at 125 MHz with 100% I/O toggling is approximately 250 mA per Altera application note AN-74 - budget for 300 mA worst case.
The 208-pin RQFP package has a junction-to-ambient thermal resistance of approximately 28 °C/W with the exposed thermal pad soldered to 4 square inches of 2 oz copper on a 4-layer PCB. Estimated: at 250 mA × 5 V = 1.25 W dissipation, junction temperature rises 35 °C above ambient - well within the commercial 0 °C to +70 °C range. For industrial EPF8820ARI208-3N operation at 85 °C ambient, ensure at least 6 square inches of top-side copper and consider a small clip-on heatsink if the device sits in an enclosed chassis.
The 208-pin RQFP has 0.5 mm pitch leads - use NSMD (non-solder-mask-defined) pads with a pad width of 0.30 mm and a length of 1.5 mm to improve solder joint reliability. Route all 152 user I/Os on inner layers with 0.15 mm trace/space; only critical clock and global signals should use microstrip on the top layer. The exposed thermal pad MUST be soldered to a continuous copper pour with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to meet the package's thermal and mechanical specifications.
Do NOT confuse the ARQ208 package (Power QFP) with the ARC208 package (BFQFP with exposed pad). Although both have 208 pins and the same FLEX 8000 die, the pin assignments differ and they require different PCB land patterns. Always double-check the package suffix in the part number before layout. A common mistake is treating the -3 and -3N variants as different packages - they share the same RQFP-208 footprint and the only difference is lead finish (SnPb vs NiPdAu), so they are drop-in compatible for footprint purposes.
Dedicate one inner ground plane and one inner 5 V power plane. Place the configuration PROM within 50 mm of the FPGA's DATA0/DCLK/nCONFIG pins to avoid signal-integrity issues on the serial configuration bus. Add 4.7 kΩ pull-ups on nCONFIG, nSTATUS, and CONF_DONE lines as recommended in Altera application note AN-39. For JTAG programming via ByteBlasterMV, route TMS, TDI, TDO, TCK as a 4-wire bus with no stubs and place 10 kΩ pull-ups on TMS and TCK.
Compliance Information
RoHS compliance inferred from the -N (NiPdAu lead-free) suffix per Altera/Intel product marking convention. AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free status not stated in the legacy datasheet, set to unknown.
