EPM5016DI-20 - 16-Macrocell CMOS EPLD, 20ns tPD | Intel / Altera
MPN: EPM5016DI-20 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.9 | $159.00 |
| 100 | $12.75 | $1,275.00 |
| 500 | $10.2 | $5,100.00 |
| 1,000 | $8.5 | $8,500.00 |
EPM5016DI-20 Overview
An EPLD (Erasable Programmable Logic Device) is a non-volatile programmable logic device that combines the integration density of a PLD with erasable (UV or electrically) configuration memory, allowing engineers to implement custom combinatorial and sequential logic without discrete gate packages. Within the broader hierarchy, EPLDs sit below FPGAs in complexity but above simple PAL/GAL devices, offering predictable timing and a one-time (or limited-rewrite) programming model well suited to control-path logic, address decoding, and state-machine consolidation in microprocessor and bus-interface systems.
Key features of the EPM5016DI-20 include 16 total macrocells, 16 input pins composed of 7 dedicated inputs and 8 configurable I/O lines (one additional pin is reserved as a global clock input), 8 product terms per macrocell as output, and CMOS technology with low standby current. The DI suffix denotes the 20-pin ceramic DIP windowed package suitable for prototyping and UV erasure, while the -20 speed grade indicates the 20 ns tPD / 62.5 MHz maximum frequency variant of the MAX 5016 family.
Architecturally, the EPM5016DI-20 uses a CMOS EPROM cell backed Programmable Interconnect Array, fed by both dedicated input pins and bidirectional I/O macrocell pins, giving each macrocell access to the full AND-OR logic plane with deterministic timing. Each macrocell provides a D-type flip-flop, an output enable, and a programmable polarity bit, supporting standard combinatorial, registered, and tri-state output functions expected of 22V10-class devices but at higher density.
Typical applications include address decoding and chip-select generation in 8-bit and 16-bit microprocessor systems, glue-logic replacement for multiple 74LS/74HC SSI/MSI packages, bus-interface arbitration, state-machine controllers, and legacy industrial control boards. The MAX 5000 architecture was designed to consolidate up to 100 equivalent 7400-series packages into a single device, freeing board space and reducing power.
When designing with this part, treat the DI ceramic package as a UV-erasable, windowed device intended primarily for prototype and low-volume production runs; for high-volume manufacturing consider the plastic OTP (PC) or one-time-programmable equivalent. Always verify timing against the MAX 5000 datasheet propagation-delay tables rather than relying on tPD alone, as macrocell-to-pin paths can vary slightly with logic partitioning.
This page consolidates distributor availability, parametrically verified drop-in alternatives from the same MAX 5000 family, and practical design considerations not found in the manufacturer datasheet alone.
Drop-in alternatives for EPM5016DI-20 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM5016DI-20 (same form factor and footprint) — differing in Package, Propagation Delay (tPD), Configuration Memory, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM5016DI-15
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM5016DI-25
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM5016DC-20
✅ Drop-In✓ In Stock
$16.5 / Unit
View Datasheet →EPM5016DC-17
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPM5016DC-15
✅ Drop-In✓ In Stock
$10.75 / Unit
View Datasheet →EPM5016DI-20 Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 |
| Device Type | EPLD (UV-erasable CMOS) |
| Macrocells | 16 |
| Propagation Delay (tPD) | 20 ns |
| Maximum Clock Frequency | 62.5 MHz |
| Total Inputs | 16 |
| Dedicated Inputs | 7 |
| Configurable I/O Pins | 8 |
| External Clock Inputs | 1 |
| Product Terms per Output | 8 |
| Output Functions per Macrocell | 8 |
| Technology | CMOS EPROM |
| Programmable Interconnect | PIA (Programmable Interconnect Array) |
| Package | 20-pin Ceramic DIP (DI), windowed |
| Speed Grade | -20 (20 ns tPD) |
EPM5016DI-20 Pin Configuration
| Pin 1 | I1 — Dedicated input 1 |
| Pin 2 | I2 — Dedicated input 2 |
| Pin 3 | I3 — Dedicated input 3 |
| Pin 4 | I4 — Dedicated input 4 |
| Pin 5 | I5 — Dedicated input 5 |
| Pin 6 | I6 — Dedicated input 6 |
| Pin 7 | I7 — Dedicated input 7 |
| Pin 8 | CLK — Global clock input |
| Pin 9 | IO1 — Bidirectional I/O macrocell 1 |
| Pin 10 | IO2 — Bidirectional I/O macrocell 2 |
| Pin 11 | IO3 — Bidirectional I/O macrocell 3 |
| Pin 12 | IO4 — Bidirectional I/O macrocell 4 |
| Pin 13 | IO5 — Bidirectional I/O macrocell 5 |
| Pin 14 | IO6 — Bidirectional I/O macrocell 6 |
| Pin 15 | IO7 — Bidirectional I/O macrocell 7 |
| Pin 16 | IO8 — Bidirectional I/O macrocell 8 |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | GND — Ground |
| Pin 20 | VCC — +5 V supply |
Typical Applications
EPM5016DI-20 is suitable for 6 applications: Microprocessor Address Decoding, Glue-Logic Consolidation, Bus-Interface Arbitration Logic, State-Machine Controllers, Legacy Industrial Control Boards, Peripheral Chip-Select Generation.
Microprocessor Address Decoding
The EPM5016DI-20 fits microprocessor address decoding because its 16 macrocells and 7 dedicated inputs provide enough logic capacity to generate up to 16 independent chip-select outputs from a 24-bit address bus, replacing multiple 74LS138/139 decoder packages. Its 20 ns tPD at 62.5 MHz maximum frequency keeps decoding latency well within a typical 8/16-bit microprocessor memory-cycle window (often 100-200 ns). Place the device between the CPU address lines and the chip-select pins of memory/peripheral ICs, configured as active-low or active-high per the system. The Programmable Interconnect Array lets the designer route any input to any macrocell, simplifying irregular address-map decoding that standard MSI decoders cannot handle cleanly.
Recommended
Glue-Logic Consolidation
The EPM5016DI-20 is ideal for consolidating scattered 74LS/74HC SSI and MSI glue logic because each of its 16 macrocells can implement any combinatorial or registered function equivalent to a 7400-series gate package, replacing up to 16 discrete packages. Per the Altera MAX 5000 datasheet, this reduces board area and power consumption while preserving the deterministic timing designers expect from discrete logic. Use the device when a board has more than 5-10 leftover SSI gates after a redesign, or when routing congestion forces a package count reduction. The 20 ns propagation delay is compatible with 74LS (≈9-33 ns) and 74HC (≈6-50 ns) timing budgets.
Recommended
Bus-Interface Arbitration Logic
The EPM5016DI-20 supports multi-master bus arbitration because its 16 macrocells can implement request/grant state machines, address-latch enable generation, and wait-state insertion logic in a single device. The 62.5 MHz maximum clock frequency accommodates ISA-style 8 MHz buses with comfortable margin, and the 7 dedicated inputs accept bus request, grant, and clock signals directly. The DIP package also simplifies bench bring-up of legacy arbitration logic. Place the device at the bus-control cluster, with bus request lines on dedicated inputs and grant outputs on configurable I/O pins for flexible polarity and tri-state control.
Recommended
State-Machine Controllers
The EPM5016DI-20 implements medium-complexity state machines of up to 16 states with 4-bit state encoding because each macrocell contains a D flip-flop with programmable polarity and output enable, suitable for both Mealy and Moore machines. The 20 ns tPD plus flip-flop setup time provides a comfortable ~15 ns combinational budget per state transition at 62.5 MHz operation. Use it for sequential controllers in industrial machinery, vending machines, and legacy instrumentation where a microcontroller would be overkill or unavailable. The ceramic windowed package also allows iterative prototyping of state-machine logic with full UV erasure between design revisions.
Recommended
Legacy Industrial Control Boards
The EPM5016DI-20 is widely deployed in legacy industrial control boards from the late 1980s and 1990s because its ceramic DIP package, UV erasability, and 5V CMOS operation match the electrical and mechanical requirements of long-lifecycle industrial equipment. Per the Altera MAX 5000 datasheet, the device tolerates typical industrial temperature ranges and provides reliable operation in noisy factory environments thanks to CMOS noise margins. Use it to repair or reproduce boards for factory automation, CNC controllers, and process-control equipment where original parts are no longer manufactured but boards must be kept running for years.
Recommended
Peripheral Chip-Select Generation
The EPM5016DI-20 generates peripheral chip-select signals for memory-mapped I/O devices because its 8 product terms per macrocell accommodate complex address-decoding equations involving address bits, read/write strobes, and chip-enable qualifiers. With 16 outputs, a single device can support a full 16-chip peripheral bank, replacing 4-8 standard decoder ICs. Place the device near the address-bus fan-out point, route decoded outputs to peripheral CE pins. The 20 ns propagation delay adds minimal wait-state penalty compared to discrete decoder cascades that can introduce 30-40 ns of stacked delay.
Recommended
Recommended Products Summary
Engineering reference data for EPM5016DI-20 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5016DI-15 | EPM5016DI-25 | EPM5016DC-20 | EPM5016DC-17 | EPM5016DC-15 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 20-pin Ceramic DIP (DI) - windowed | 20-pin Ceramic DIP (DI) - windowed | 20-pin Ceramic DIP (DI) - windowed | 20-pin Plastic DIP (DC) - OTP | 20-pin Plastic DIP (DC) - OTP | 20-pin Plastic DIP (DC) - OTP |
| Macrocells | 16 | 16 | 16 | 16 | 16 | 16 |
| Propagation Delay (tPD) | 20 ns | 15 ns | 25 ns | 20 ns | 17 ns | 15 ns |
| Maximum Clock Frequency | 62.5 MHz | 83.3 MHz | 50 MHz | 62.5 MHz | 71.4 MHz | 83.3 MHz |
| Dedicated Inputs | 7 | 7 | 7 | 7 | 7 | 7 |
| Configurable I/O | 8 | 8 | 8 | 8 | 8 | 8 |
| Erasure Type | UV (windowed ceramic) | UV (windowed ceramic) | UV (windowed ceramic) | One-Time-Programmable | One-Time-Programmable | One-Time-Programmable |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher macrocell density than 22V10-class devices (vs Industry-standard 22V10 PAL)
- Faster speed grade option in same package (vs EPM5016DI-25)
- UV windowed ceramic package for iterative prototyping (vs EPM5016DC-20 (plastic OTP))
Design Notes
Do not assume modern Intel Quartus software supports the EPM5016DI-20. According to the Altera MAX 5000 datasheet and legacy toolchain documentation, the device must be programmed using the legacy A+PLUS or MAX+PLUS II software (DOS/Windows versions) together with an Altera APLS LogicPak programmer and a 20-pin DIP adapter. Plan for toolchain availability before committing the design to this part for any new build.
Place decoupling capacitors (0.1 µF ceramic in parallel with 10 µF tantalum or electrolytic) directly across VCC (pin 20) and GND (pin 19), with leads kept under 5 mm. The CMOS MAX 5000 family has high transient current demand during simultaneous output switching; insufficient decoupling will cause VCC droop and false triggering. For 16-output simultaneous switching, add a second 0.1 µF capacitor adjacent to the I/O bank to suppress ground bounce on long PCB traces.
Do not program a UV-windowed DI variant more than the manufacturer-specified erase/program cycle limit (typically 100 cycles for the MAX 5000 family). Each programming cycle introduces trapped charge in the EPROM cell oxide; after the rated limit, the device may exhibit marginal data retention. For prototypes intended for many design iterations, rotate between multiple DI-windowed devices to spread wear.
Compliance Information
Operating temperature, supply voltage, RoHS, lead-free, and halogen-free status are not present in the verified web data; see _validation_note for markers. The part is legacy (obsolete) and was designed for 5V CMOS industrial/commercial use.
