EPM570T144I5 - 440 Macrocell CPLD, 5.4ns TQFP-144 | Altera
MPN: EPM570T144I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.29 | $38.29 |
| 10 | $34.46 | $344.60 |
| 100 | $30.63 | $3,063.00 |
| 500 | $26.8 | $13,400.00 |
| 1,000 | $22.97 | $22,970.00 |
EPM570T144I5 Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete glue-logic ICs (74-series gates) and large SRAM FPGAs in the logic-hierarchy. CPLDs use flash or EEPROM configuration cells and a classic AND-OR PLA-style macrocell fabric, delivering deterministic timing, instant-on behavior (typically <1 ms wake-up), and high drive strength. CPLDs are widely used as interface bridges, bus controllers, address decoding, and power-up sequencers, where their deterministic timing and zero-config-latency offer advantages over SRAM FPGAs that require external boot memory and a multi-millisecond configuration phase.
Key features of the EPM570T144I5 include 440 logic elements (macrocells), 8 Kbits of user flash memory (UFM), 116 user I/O, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O support across 1.5 V to 3.3 V standards. The 'I' suffix denotes the industrial temperature range (-40 °C to +100 °C junction), and the '5' speed grade corresponds to the 5.4 ns tPD1 timing specification. MultiCore architecture and Quartus II / Intel Quartus Prime design support enable straightforward design entry, synthesis, and in-system programming via JTAG.
Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in telecom line cards, address decoding and interrupt steering in embedded SBCs, and power-sequencing networks in ATCA/uTCA platforms. The non-volatile, instant-on nature also makes the EPM570T144I5 well suited to safety-critical applications where deterministic post-reset behavior is mandatory, and to low-volume ASIC replacement scenarios where NRE costs of an ASIC are not justified.
When designing with the EPM570T144I5, observe I/O bank grouping rules - all I/O in a bank must share a single VCCIO supply - and budget at least four dedicated GND pins plus one decoupling capacitor pair (0.1 µF + bulk) per bank. The TQFP-144 exposed-pad footprint requires a continuous ground plane beneath the package to meet the 4-layer PCB thermal envelope.
This page synthesizes distributor pricing, parametric drop-in alternatives within the MAX II EPM570 family, JTAG programming guidance, and bank-by-bank PCB layout notes that are not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for EPM570T144I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM570T144I5 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Programming Interface, Package, Maximum User I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570T144I5N
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →EPM570T144C5N
✅ Drop-In✓ In Stock
$9.35 / Unit
View Datasheet →EPM570GT144I5
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPM570T144C5
✅ Drop-In✓ In Stock
$17.3 / Unit
View Datasheet →EPM570T144C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$25.1 / Unit
View Datasheet →EPM570T144I5 Maximum Ratings & Electrical Characteristics
| Product Type | CPLD (Complex Programmable Logic Device) |
| Family | MAX II |
| Macrocells (Logic Elements) | 440 |
| User I/O | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Frequency (fMAX) | 304 MHz |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package / Case | TQFP-144 (144-LQFP, 20 x 20 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (industrial) |
| Process Technology | 0.18 µm flash |
| Programming Interface | JTAG (IEEE 1149.1) |
EPM570T144I5 Pin Configuration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | I/O — User I/O bank 1 |
| Pin 4 | I/O — User I/O bank 1 |
| Pin 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O bank 2 |
| Pin 8 | I/O — User I/O bank 2 |
| Pin 9 | I/O — User I/O bank 2 |
| Pin 10 | I/O — User I/O bank 2 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O bank 2 |
| Pin 13 | I/O — User I/O bank 2 |
| Pin 14 | I/O — User I/O bank 2 |
| Pin 15 | I/O — User I/O bank 2 |
| Pin 16 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 17 | I/O — User I/O bank 2 |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | I/O — User I/O bank 2 |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O bank 2 |
| Pin 23 | I/O — User I/O bank 2 |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | I/O — User I/O bank 2 |
| Pin 26 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | I/O — User I/O bank 2 |
| Pin 29 | I/O — User I/O bank 2 |
| Pin 30 | I/O — User I/O bank 2 |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O bank 3 |
| Pin 33 | I/O — User I/O bank 3 |
| Pin 34 | I/O — User I/O bank 3 |
| Pin 35 | I/O — User I/O bank 3 |
| Pin 36 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 37 | I/O — User I/O bank 3 |
| Pin 38 | TDI — JTAG Test Data In |
| Pin 39 | TCK — JTAG Test Clock |
| Pin 40 | TMS — JTAG Test Mode Select |
| Pin 41 | I/O — User I/O bank 3 |
| Pin 42 | GND — Ground |
| Pin 43 | VCCINT — Core supply voltage 1.8 V |
| Pin 44 | I/O — User I/O bank 3 |
| Pin 45 | I/O — User I/O bank 3 |
| Pin 46 | I/O — User I/O bank 3 |
| Pin 47 | I/O — User I/O bank 3 |
| Pin 48 | I/O — User I/O bank 3 |
| Pin 49 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 50 | I/O — User I/O bank 3 |
| Pin 51 | I/O — User I/O bank 3 |
| Pin 52 | I/O — User I/O bank 3 |
| Pin 53 | I/O — User I/O bank 3 |
| Pin 54 | GND — Ground |
| Pin 55 | I/O — User I/O bank 3 |
| Pin 56 | I/O — User I/O bank 3 |
| Pin 57 | I/O — User I/O bank 3 |
| Pin 58 | I/O — User I/O bank 3 |
| Pin 59 | I/O — User I/O bank 3 |
| Pin 60 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 61 | I/O — User I/O bank 3 |
| Pin 62 | I/O — User I/O bank 3 |
| Pin 63 | I/O — User I/O bank 3 |
| Pin 64 | I/O — User I/O bank 3 |
| Pin 65 | GND — Ground |
| Pin 66 | I/O — User I/O bank 3 |
| Pin 67 | I/O — User I/O bank 3 |
| Pin 68 | I/O — User I/O bank 3 |
| Pin 69 | I/O — User I/O bank 3 |
| Pin 70 | I/O — User I/O bank 3 |
| Pin 71 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 72 | I/O — User I/O bank 4 |
| Pin 73 | I/O — User I/O bank 4 |
| Pin 74 | I/O — User I/O bank 4 |
| Pin 75 | I/O — User I/O bank 4 |
| Pin 76 | GND — Ground |
| Pin 77 | I/O — User I/O bank 4 |
| Pin 78 | I/O — User I/O bank 4 |
| Pin 79 | I/O — User I/O bank 4 |
| Pin 80 | I/O — User I/O bank 4 |
| Pin 81 | I/O — User I/O bank 4 |
| Pin 82 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 83 | I/O — User I/O bank 4 |
| Pin 84 | I/O — User I/O bank 4 |
| Pin 85 | I/O — User I/O bank 4 |
| Pin 86 | I/O — User I/O bank 4 |
| Pin 87 | GND — Ground |
| Pin 88 | I/O — User I/O bank 4 |
| Pin 89 | I/O — User I/O bank 4 |
| Pin 90 | I/O — User I/O bank 4 |
| Pin 91 | I/O — User I/O bank 4 |
| Pin 92 | I/O — User I/O bank 4 |
| Pin 93 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 94 | I/O — User I/O bank 4 |
| Pin 95 | I/O — User I/O bank 4 |
| Pin 96 | I/O — User I/O bank 4 |
| Pin 97 | I/O — User I/O bank 4 |
| Pin 98 | GND — Ground |
| Pin 99 | I/O — User I/O bank 4 |
| Pin 100 | I/O — User I/O bank 4 |
| Pin 101 | TDO — JTAG Test Data Out |
| Pin 102 | I/O — User I/O bank 4 |
| Pin 103 | I/O — User I/O bank 4 |
| Pin 104 | I/O — User I/O bank 4 |
| Pin 105 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 106 | I/O — User I/O bank 4 |
| Pin 107 | I/O — User I/O bank 4 |
| Pin 108 | I/O — User I/O bank 4 |
| Pin 109 | I/O — User I/O bank 4 |
| Pin 110 | I/O — User I/O bank 4 |
| Pin 111 | GND — Ground |
| Pin 112 | I/O — User I/O bank 4 |
| Pin 113 | I/O — User I/O bank 4 |
| Pin 114 | I/O — User I/O bank 4 |
| Pin 115 | I/O — User I/O bank 4 |
| Pin 116 | VCCINT — Core supply voltage 1.8 V |
| Pin 117 | I/O — User I/O bank 1 |
| Pin 118 | I/O — User I/O bank 1 |
| Pin 119 | I/O — User I/O bank 1 |
| Pin 120 | GND — Ground |
| Pin 121 | I/O — User I/O bank 1 |
| Pin 122 | I/O — User I/O bank 1 |
| Pin 123 | I/O — User I/O bank 1 |
| Pin 124 | I/O — User I/O bank 1 |
| Pin 125 | I/O — User I/O bank 1 |
| Pin 126 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 127 | I/O — User I/O bank 1 |
| Pin 128 | I/O — User I/O bank 1 |
| Pin 129 | I/O — User I/O bank 1 |
| Pin 130 | I/O — User I/O bank 1 |
| Pin 131 | I/O — User I/O bank 1 |
| Pin 132 | GND — Ground |
| Pin 133 | I/O — User I/O bank 1 |
| Pin 134 | I/O — User I/O bank 1 |
| Pin 135 | I/O — User I/O bank 1 |
| Pin 136 | I/O — User I/O bank 1 |
| Pin 137 | I/O — User I/O bank 1 |
| Pin 138 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 139 | I/O — User I/O bank 1 |
| Pin 140 | I/O — User I/O bank 1 |
| Pin 141 | I/O — User I/O bank 1 |
| Pin 142 | I/O — User I/O bank 1 |
| Pin 143 | I/O — User I/O bank 1 |
| Pin 144 | I/O — User I/O bank 1 |
Typical Applications
EPM570T144I5 is suitable for 6 applications: Industrial Control I/O Expansion & Bus Bridging, Telecom Line Card Glue Logic, Power-Up Sequencer for Multi-Rail Systems, ASIC/Discrete-Logic Consolidation, Embedded SBC Address Decoding & Interrupt Routing, Test & Measurement Instrumentation Front-End.
Industrial Control I/O Expansion & Bus Bridging
The EPM570T144I5's 116 user I/O and 440 macrocells make it well suited to industrial control designs that need to bridge between legacy parallel buses (ISA, PC/104, address/data demultiplexed buses) and modern microcontrollers. Its 5.4 ns tPD1 supports glue-logic timing paths up to roughly 185 MHz, sufficient for synchronous address decoding and chip-select generation. Instant-on from non-volatile storage avoids bootloader complications when an MCU has crashed, allowing the CPLD to drive deterministic reset vectors. With the industrial -40 °C to +100 °C temperature range, the part is suitable for factory-floor equipment and outdoor controllers.
Recommended
Telecom Line Card Glue Logic
Telecommunications line cards require deterministic, fast response to interrupt, clock, and reset events. The EPM570T144I5's deterministic timing (no SRAM-config latency), 5.4 ns pin-to-pin delay, and JTAG-driven ISP simplify board bring-up and field firmware updates. The multi-voltage I/O banks (1.5 V to 3.3 V) directly interface legacy 3.3 V line-card ASICs alongside newer 1.8 V DSPs and SERDES chips without external level shifters. Use cases include backplane address decoding, TDM bus multiplexing, and clock distribution gating for ATCA/uTCA platforms.
Recommended
Power-Up Sequencer for Multi-Rail Systems
When system boards require strict power-up and power-down sequencing of multiple rails (e.g., 0.9 V core, 1.5 V DDR, 2.5 V analog, 3.3 V I/O), the EPM570T144I5 provides a deterministic sequencing engine. Its non-volatile flash configuration ensures that on every power cycle the same sequence is enforced within microseconds - critical for ASICs, FPGAs, and processors that require core-before-I/O rails. The 116 I/O are sufficient to drive dozens of enable pins and PG signals. Compared with MCU-based sequencers, the CPLD adds no firmware-update risk and boots in <1 ms.
Recommended
ASIC/Discrete-Logic Consolidation
Designs that historically used dozens of 74-series logic gates, multiplexers, and PAL/GAL devices can consolidate the entire logic block into a single EPM570T144I5, reducing PCB area, BOM cost, and assembly time. With 440 macrocells, the device typically replaces 30-60 discrete SSI/MSI packages. The instant-on flash configuration means no boot PROM is needed, and JTAG ISP allows post-assembly logic changes without reworking the board. The TQFP-144 footprint is well suited to 4-layer designs with standard surface-mount assembly lines.
Recommended
Embedded SBC Address Decoding & Interrupt Routing
Single-board computers (SBCs) and ARM/MIPS-based compute modules often need flexible chip-select and interrupt routing between the host CPU and peripheral chips. The EPM570T144I5's 5.4 ns propagation delay supports decoding at 100 MHz+ host bus speeds, and its 116 I/O easily accommodate 8-16 peripheral chip selects plus 16-32 interrupt/gpio lines. The industrial temperature grade and surface-mount TQFP-144 package are well matched to SBC-style designs with passive cooling. Quartus Prime Lite provides a free development environment.
Recommended
Test & Measurement Instrumentation Front-End
Test and measurement equipment (logic analyzers, protocol exercisers, JTAG/boundary-scan controllers) often needs custom stimulus/response logic tightly coupled to an analog front end. The EPM570T144I5 offers 116 user I/O with 5.4 ns timing to drive pattern generators, mux/demux control signals, and trigger logic. Its instant-on behavior eliminates calibration drift after power cycling, and the JTAG interface allows remote in-system firmware updates in deployed test racks. The industrial temperature range covers most lab and field environments.
Recommended
Recommended Products Summary
Engineering reference data for EPM570T144I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570T144I5N | EPM570T144C5N | EPM570GT144I5 | EPM570T144C5 | EPM570T144C4N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | ~7 ns (C4 speed grade) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 116 | 116 | 116 | 116 | 116 | 116 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| Approx. Unit Price @ 1000 | $22.97 | ~$23-30 | ~$22-28 | ~$23-30 | ~$18-24 | ~$20-26 |
Key Differentiators
- 440 macrocells - largest MAX II in TQFP-144 (vs EPM240T144 (same TQFP-144 footprint))
- Industrial temperature grade -40C to +100C (vs EPM570T144C5N (commercial 0C to +85C))
- Non-volatile flash configuration with instant-on (vs MAX 10 10M02 (SRAM-based FPGA-like CPLD))
- Multi-voltage I/O banks 1.5V-3.3V without level shifters (vs Discrete 74-series logic)
Design Notes
The EPM570T144I5 requires a clean 1.8 V supply on VCCINT pins (43 and 116) and separate VCCIO supplies for each of the four I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of every VCC pin, plus a 10 µF bulk capacitor at the regulator output. The device does not require a specific power-up sequence between VCCINT and VCCIO, but all VCC rails must reach their nominal values within 100 ms to ensure proper configuration from flash. Estimated: at fMAX=304 MHz with all 116 I/O switching, dynamic core current can reach ~80 mA.
The TQFP-144 package has a 0.5 mm pitch and a 20 x 20 mm body, requiring a 4-layer PCB with continuous ground and power planes to meet signal-integrity requirements above 100 MHz. Maintain 50-ohm controlled impedance on critical nets (clock, JTAG) and use 8-mil traces with 8-mil spacing. Place the JTAG header (TCK/TMS/TDO/TDI) on the board edge for in-system programming access. Thermal performance is adequate for typical industrial designs without an explicit heatsink, but a 2 x 2 cm copper pour on the top layer beneath the package is recommended.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - tie TDI and TMS high through 10 kohm pull-ups to VCCIO, and pull TCK low through 10 kohm to GND. Floating JTAG pins can cause ISP failure or unpredictable configuration reload on power-up. Also: the MAX II device configures on every power-up from internal flash, so VCCINT must ramp monotonically; use a supervisor IC if your power tree has soft-start edges. I/O banks must not be left unpowered - unused banks should have their VCCIO tied to a valid rail (1.5 V to 3.3 V) to prevent I/O leakage through floating ESD structures.
Estimated: under worst-case industrial conditions (Tj=100 °C) with all 116 I/O driving 8 mA loads at 50 MHz, total power dissipation is approximately 0.5-0.8 W. The TQFP-144 package has a junction-to-ambient thermal resistance of roughly 35 °C/W on a standard 4-layer JEDEC test board, giving a junction-to-ambient temperature rise of 17-28 °C above ambient. The 'I' industrial temperature grade supports -40 °C to +100 °C junction, sufficient for most sealed enclosure designs. Provide an explicit copper pour or thermal via array beneath the exposed pad area (TQFP-144 has no exposed pad, but top-layer copper flood is recommended).
Compliance Information
RoHS and lead-free status not explicitly stated in verified web data for EPM570T144I5 (non-N suffix). The N-suffix variant EPM570T144I5N is documented as RoHS compliant. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not an automotive-qualified part.
