EPM570ZM100C7N - MAX II CPLD, 440 LE, 76 I/O, 100-MBGA | Altera
MPN: EPM570ZM100C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.37 | $22.37 |
| 10 | $19.95 | $199.50 |
| 100 | $17.42 | $1,742.00 |
| 500 | $14.86 | $7,430.00 |
| 1,000 | $12.55 | $12,550.00 |
EPM570ZM100C7N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architectures with the high integration of an FPGA. In the power-management hierarchy, CPLDs sit alongside microcontrollers, FPGAs, and DSPs under the broader Programmable Logic umbrella. Compared to small FPGAs, MAX II CPLDs offer instant-on behavior because the configuration is stored in on-chip flash, eliminating the external boot PROM typically required by SRAM-based FPGAs. This makes them well suited to system control, power-sequencing, and I/O expansion duties in cost-sensitive industrial and consumer designs.
Key features include 440 logic elements, 76 user I/Os, 8 Kbits of on-chip user flash memory (UFM), 1.8 V core / MultiVolt I/O support, and a worst-case pin-to-pin propagation delay of 9 ns (speed grade 7). The non-volatile flash configuration means the device powers up already programmed, with no boot time, and supports in-system programmability (ISP) via JTAG. The 100-MBGA package supports vertical migration with the larger EPM1270 and EPM2210 in the same footprint.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing for multi-rail systems, glue-logic replacement in telecommunications line cards, LED display drivers, and portable/handheld products. The combination of non-volatility, low cost, and instant-on behavior makes the MAX II family a popular choice for designers consolidating discrete 74-series logic.
When designing with the EPM570ZM100C7N, allow a generous keep-out around the BGA and use microvia or via-in-pad technology to fan out the 0.5 mm pitch balls. Provide at least four ground and two VCCINT (1.8 V) balls distributed around the package to ensure stable core power. The I/O banks support MultiVolt operation so 3.3 V, 2.5 V, and 1.8 V peripherals can be interfaced directly without level shifters.
Drop-in alternatives for EPM570ZM100C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM570ZM100C7N (same form factor and footprint) — differing in Operating Temperature, Package, Logic Elements, Process Technology, JTAG Support.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570ZM100C6N
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View Datasheet →EPM570GM100C5N
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View Datasheet →EPM570F100C5N
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View Datasheet →EPM570F100C4N
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View Datasheet →EPM570GT100C5N
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View Datasheet →EPM570ZM100C7N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Series | MAX II Z (Zero Power) |
| Logic Elements | 440 |
| Equivalent Macrocells | 440 |
| User I/Os | 76 |
| User Flash Memory (UFM) | 8 Kbits |
| Propagation Delay (tPD) | 9 ns (speed grade 7) |
| Maximum Frequency | 123.5 MHz |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS |
| Package | 100-ball Micro FineLine BGA (MBGA), 6 mm x 6 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (industrial) |
| RoHS Status | Compliant (lead-free, Micro FBGA-100) |
| In-System Programmability | Yes (JTAG) |
| Non-volatile Configuration | Yes (on-chip flash) |
EPM570ZM100C7N 100-ball micro fineline bga (mbga), 6 mm x 6 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EPM570ZM100C7N (100-ball micro fineline bga (mbga), 6 mm x 6 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570ZM100C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM570ZM100C7N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Power-Up Sequencing for Multi-Rail Systems, Glue-Logic Replacement in Telecom Line Cards, LED Display Driver and Multiplexer, Portable Consumer and Handheld Products, State-Machine and Control Logic in Test Equipment.
Industrial I/O Expansion and Bus Bridging
The EPM570ZM100C7N's 440 logic elements and 76 user I/Os make it well suited for industrial I/O expansion where a microcontroller lacks sufficient pins or voltage domains. The MultiVolt I/O banks accept 1.8 V, 2.5 V, and 3.3 V signals directly, eliminating external level shifters when bridging between legacy 5 V-tolerant peripherals and modern 1.8 V MCUs. Typical use cases include 16-bit parallel bus expansion, SPI-to-parallel conversion, and quadrature decoder consolidation. Designers commonly pair the EPM570ZM100C7N with a microcontroller such as the STM32F407 or NXP LPC1768 to offload pin-intensive glue logic while preserving deterministic 9 ns tPD timing.
Recommended
Power-Up Sequencing for Multi-Rail Systems
The EPM570ZM100C7N is widely used as a power-sequencer in systems with strict rail-ordering requirements such as FPGAs, DSPs, and SoCs that demand core-before-I/O ramp-up. Its non-volatile flash configuration boots instantly on power-up with no external PROM, and the 9 ns tPD plus 123.5 MHz fMAX allow precise delay generation using cascaded counters. The integrated 8 Kbit UFM can store per-board calibration values (rail thresholds, timing constants) without an external EEPROM. Compared to discrete sequencer ICs, the MAX II Z zero-power variant keeps standby current low, important for always-on battery-backed systems.
Recommended
Glue-Logic Replacement in Telecom Line Cards
In telecom line-card designs the EPM570ZM100C7N typically replaces dozens of 74-series discrete logic packages (translators, latches, muxes, bus switches), reducing board area and BOM count while adding design flexibility via in-system programmability. The 76 user I/Os comfortably cover mid-density glue logic, and the JTAG ISP interface allows board-level rework without removing the BGA. The 1.8 V core plus MultiVolt I/O simplifies interfacing to legacy 3.3 V bus switch fabrics common in ATCA and MicroTCA designs. Latency is deterministic because MAX II uses a continuous-route interconnect fabric rather than an SRAM-routed matrix.
Recommended
LED Display Driver and Multiplexer
The EPM570ZM100C7N's 440 LEs and 76 I/Os make it an effective scan-matrix driver for medium-density LED message boards, where row/column multiplexing replaces a large number of discrete shift registers. With 123.5 MHz fMAX it easily drives 8:1 or 16:1 row scanning at refresh rates above 100 Hz to avoid visible flicker. The integrated 8 Kbit UFM can store display fonts, bitmaps, and animation sequences directly on-chip, eliminating an external SPI flash. The MAX II Z zero-power variant is particularly attractive in battery-powered signage applications where standby current dominates total energy consumption.
Recommended
Portable Consumer and Handheld Products
Handheld and battery-powered products benefit from the EPM570ZM100C7N's instant-on behavior (no external boot PROM), zero-power architecture, and small 6 mm x 6 mm MBGA footprint. Typical uses include button-matrix decoding, keypad scanning, LCD segment timing, USB-C role/swap glue, and battery-pack authentication. Designers can hide proprietary interface logic inside the CPLD while exposing only simple register reads/writes to the host MCU. The -40C to +125C industrial temperature range supports outdoor and automotive-cabin deployments as well as consumer handheld enclosures.
Recommended
State-Machine and Control Logic in Test Equipment
Bench-top and production test equipment frequently use the EPM570ZM100C7N to implement deterministic state machines for fixture control, relay sequencing, and stimulus pattern generation. Its 9 ns tPD gives reliable 50 MHz+ operation, and the 76 I/Os comfortably drive multi-channel relay matrices or parallel DAC update buses. The on-chip JTAG allows in-system reprogramming as test programs evolve, eliminating socketed PROMs. Compared to microcontroller-based control, the MAX II CPLD provides hardware-concurrent logic with no firmware interrupt latency, which simplifies timing-sensitive ATE applications.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZM100C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570ZM100C6N | EPM570GM100C5N | EPM570F100C5N | EPM570F100C4N | EPM570GT100C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (MAX II Z) | Altera (MAX II Z) | Altera (MAX II G) | Altera (MAX II F) | Altera (MAX II F) | Altera (MAX II G) |
| Package | 100-MBGA (6x6 mm, 0.5 mm pitch) | 100-MBGA - same | 100-MBGA - same | 100-FBGA - same footprint family | 100-FBGA - same footprint family | 100-TQFP - alternate package |
| Logic Elements | 440 | 440 | 570 | 570 | 570 | 570 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Speed Grade (tPD) | 9 ns (grade 7) | 7 ns (grade 6) | 5 ns (grade 5) | 5 ns (grade 5) | 4 ns (grade 4) | 5 ns (grade 5) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Zero-Power Variant | Yes (MAX II Z) | Yes (MAX II Z) | No (MAX II G) | No (MAX II F) | No (MAX II F) | No (MAX II G) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Key Differentiators
- Zero-power MAX II Z architecture for lowest standby current (vs EPM570F100C5N)
- Slower tPD (9 ns) traded for zero-power operation (vs EPM570GM100C5N)
- Same 100-MBGA footprint as larger MAX II devices (vs EPM570T100C5N)
Design Notes
The 100-MBGA package uses 0.5 mm ball pitch on a 6 mm x 6 mm body. A microvia or via-in-pad PCB process is strongly recommended; standard 0.4 mm drilled vias do not fit between balls. Place at least four GND balls and two VCCINT balls distributed symmetrically around the package and stitch the inner ground layer with a via fence tied to each GND ball to provide a low-impedance return path for the high-speed I/O transitions. Use 1 oz copper on outer layers and 0.5 oz on inner layers for controlled-impedance signal traces.
VCCINT (1.8 V core) and VCCIO (1.8/2.5/3.3 V I/O banks) must each be decoupled with a 0.1 uF ceramic capacitor placed within 2 mm of every supply ball, plus a bulk 10 uF ceramic within 10 mm. The MAX II Z zero-power variant draws low standby current but still requires a clean 1.8 V rail; ripple above 50 mVpp can corrupt configuration reads on power-up. The dedicated VCCIO pins for each I/O bank allow mixed-voltage interfacing, but each bank must be powered even if unused.
Route JTAG signals TDI, TMS, TCK, and TDO as a dedicated chain with stubs under 5 mm and a 10 kohm pull-up on TCK to keep the TAP controller in a defined state at power-up. The TRST pin (if brought out) should be tied to VCCIO through a 10 kohm pull-up and not left floating. Place the JTAG connector at the edge of the board for easy ISP access during production programming.
Do not confuse the Z (zero-power), G (standard), and F (FineLine BGA) variants of the EPM570 - they share the same 100-ball footprint but differ in standby current and feature set. The MAX II Z requires a longer power-on reset time than the standard variants, so designs with strict boot-time budgets must verify timing at cold temperature. Configuring unused I/O pins as inputs with internal pull-ups (not outputs) prevents supply-current surges during programming.
Although the 9 ns tPD is slow by FPGA standards, simultaneous switching of 16+ I/Os can still cause ground bounce and VCCIO droop. Limit SSO groups to no more than 8 outputs switching in the same direction within 5 ns, and stagger critical clocks using the CPLD's internal delay chains. For long off-board traces (>50 mm), add a 22-33 ohm series resistor at the driver to dampen reflections.
Compliance Information
Lead-free Micro FBGA-100 package per Altera product page; RoHS compliant. Industrial temperature grade (-40C to +125C) but not AEC-Q100 qualified - choose a Q-grade MAX II device for automotive.
