K4A8G085WB-BCRC - 8Gb DDR4 SDRAM 2400Mbps 1.2V | Samsung
MPN: K4A8G085WB-BCRC ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for K4A8G085WB-BCRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A8G085WB-BCPB
✅ Drop-In✓ In Stock
$3.28 / Unit
View Datasheet →K4A8G085WB-BITD
✅ Drop-In✓ In Stock
$3.8 / Unit
View Datasheet →K4A8G085WC-BIWE
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$6.29 / Unit
View Datasheet →K4A8G085WG-BCWE
✅ Drop-In📋 Reference alternative (not in catalog)
K4A8G085WB
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →K4A8G085WB-BCRC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM (B-die) |
| Density | 8 Gbit |
| Organization | 1G x 8 |
| Data Rate | 2400 Mbps (DDR4-2400) |
| Supply Voltage | 1.2 V |
| Clock Cycle Time | 0.175 ns (per distributor listing) |
| Refresh Cycles | 8192 |
| Interface | SSTL12 |
| Operating Temperature | 0C to +85C |
| Package | 78-ball FBGA (PBGA78), 9 x 11 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount |
| Termination | On-Die Termination (ODT) |
| Bank Architecture | DDR4 bank-group architecture |
| Data Mask | DM supported (x8 organization) |
K4A8G085WB-BCRC 78-ball fbga (pbga78), 9 x 11 mm, 0.8 mm pitch Pin Configuration Guide
Complete pinout information for K4A8G085WB-BCRC (78-ball fbga (pbga78), 9 x 11 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A8G085WB-BCRC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G085WB-BCRC is suitable for 6 applications: Desktop and Server DIMM Modules, Embedded Industrial Controllers, Networking Equipment Line Cards, Set-Top Boxes and Smart Display Platforms, Test and Measurement Instrumentation, Automotive-Adjacent Infotainment Development.
Desktop and Server DIMM Modules
The K4A8G085WB-BCRC is a primary component for unbuffered and registered DIMM construction. Its 8Gb B-die density allows a single-rank 8 GB UDIMM using only eight x8 chips, reducing component count versus 4Gb alternatives, while the DDR4-2400 speed bin matches mainstream server and desktop memory-controller defaults. The x8 organization supports ECC topologies where a ninth chip supplies check bits across a 72-bit bus, and the 8192-cycle refresh aligns with standard DDR4 controller timing. Because the 1.2V SSTL12 interface consumes roughly 25% less power than DDR3, high-population server platforms gain meaningful thermal headroom. B-die silicon also provides tuning margin for performance modules.
Recommended
Embedded Industrial Controllers
Industrial PCs, PLCs, and machine-vision controllers use the K4A8G085WB-BCRC as main memory where 1 GB per chip suffices for frame buffers and application workloads. The 78-ball FBGA in 9 x 11 mm suits compact solder-down designs on carrier boards, and the 0C to +85C commercial range covers controlled cabinet environments; for wider ambients, the K4A8G085WB-BITD industrial variant drops into the same footprint. Its DDR4-2400 bandwidth feeds multi-gigabit Ethernet and image pipelines without becoming the bottleneck, while the 1.2V rail simplifies power trees derived from 24 V industrial supplies through a single buck stage followed by VTT termination.
Recommended
Networking Equipment Line Cards
Switch, router, and gateway line cards rely on the K4A8G085WB-BCRC for packet buffering and control-plane memory. The DDR4 bank-group architecture sustains interleaved read/write streams typical of packet forwarding, and 2400 Mbps per pin provides multi-GB/s aggregate bandwidth for lookup tables and queue descriptors. The x8 organization allows flexible 64-bit or 72-bit ECC bus widths, and the 78-ball FBGA supports dense two-sided PCB placement beside the network processor. Samsung's DDR4 platform documentation highlights improved bandwidth and reliability at lower energy, which directly benefits always-on telecom hardware with strict thermal budgets.
Recommended
Set-Top Boxes and Smart Display Platforms
Broadcast and display SoCs frequently validate Samsung DDR4 1G x 8 B-die components such as the K4A8G085WB-BCRC in their reference designs. One chip supplies 1 GB, enough for 4K video buffering and application memory in cost-optimized set-top and digital-signage hardware, and multiple chips scale to 2-4 GB. The 1.2V interface reduces standby and playback power versus DDR3L predecessors, extending compliance headroom for energy regulations. Because solder-down FBGA placement avoids SO-DIMM connectors, overall BOM cost drops, and the same footprint accommodates speed-bin variants like the BCPB for supply-chain flexibility across production lots.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators use DDR4 DRAM like the K4A8G085WB-BCRC for deep waveform capture memory, where sustained write bandwidth determines maximum sample streaming rates. The DDR4-2400 bus provides predictable sequential throughput for memory-controller DMA engines, and the 8Gb density per chip enables multi-gigabyte capture depths by paralleling devices across x8 slices. B-die silicon is noted for tight timing distribution, which helps capture-memory subsystems meet calibration margins. The commercial 0C to +85C range suits benchtop environments; use the BITD variant in portable field instruments exposed to wider temperatures.
Recommended
Automotive-Adjacent Infotainment Development
While the -BCRC commercial grade is not AEC-Q100 qualified and must not ship in automotive safety paths, it is widely used in development platforms, aftermarket infotainment, and non-safety display modules where DDR4 main memory of 1-4 GB is required. Its DDR4-2400 bandwidth supports navigation rendering and media decode pipelines, and the 78-ball FBGA layout matches common SoC reference designs from display and cockpit processor vendors. Teams migrating such designs into certified vehicle programs should plan a footprint-compatible transition path and requalification, verifying temperature grades and memory-controller timing against the target grade before release.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G085WB-BCRC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G085WB-BCPB | K4A8G085WB-BITD | K4A8G085WC-BIWE | K4A8G085WG-BCWE |
|---|---|---|---|---|---|
| Package | 78-ball FBGA (PBGA78) | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density / Organization | 8 Gbit, 1G x 8 | 8 Gbit, 1G x 8 | 8 Gbit, 1G x 8 | 8 Gbit, 1G x 8 | 8 Gbit, 1G x 8 |
| Data Rate | 2400 Mbps (DDR4-2400) | DDR4-2400 class | [DATA_NEEDED] | DDR4-2666 class | 3200 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | Industrial grade (wider range) | Industrial grade (wider range) | 0C to +85C (commercial) |
| Refresh Cycles | 8192 | 8192 | 8192 | 8192 | 8192 |
| Die Type | B-die | B-die | B-die | C-die family | [DATA_NEEDED] |
Key Differentiators
- B-die silicon with strong timing headroom (vs K4A8G085WC-BIWE)
- Cost-optimized commercial grade (vs K4A8G085WB-BITD)
- Identical footprint to full speed-bin family (vs K4A8G085WG-BCWE)
Design Notes
Route DDR4 address/command lines in a fly-by topology with length-matched traces per Samsung's DDR4 design guide, terminating at VTT (0.6V) near the last DRAM on the bus. For the x8 organization, keep DQ/DQS/DM length matching within the controller vendor's specified window (typically a few millimeters per 100 mm of trace) and reference these signals to a solid ground plane to preserve the SSTL12 eye at 2400 Mbps.
The 1.2V VDD rail and the VTT termination rail should be generated from separate regulators or one controller with a VTT LDO, since VTT sources and sinks current during bus transitions. Decouple each FBGA with the datasheet-recommended bulk and 0.1 uF ceramic caps placed within a few millimeters of VDD/VDDQ balls. Estimated: a single 8Gb chip at DDR4-2400 draws on the order of a few hundred milliwatts active, so plan the 1.2V converter budget per chip count.
Confirm the memory controller supports DDR4 bank-group architecture and 8192-cycle refresh before substituting bins - the BCPB/BITD suffixes change timing and temperature codes, not the pinout. Do not mix commercial BCRC parts with industrial BITD parts on the same bus without revalidating read margins across temperature. Also, never attempt to cross DDR3 designs with this DDR4 part; the SSTL12 interface and DDR4 protocol are incompatible with DDR3 controllers despite similar footprints.
Compliance Information
Verified web data does not include explicit RoHS/REACH declarations for this exact suffix. Commercial-grade part (0C to +85C); not an automotive AEC-Q100 offering. Obtain formal declarations from Samsung or your distributor for the purchased date code.
