K4A8G085WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps | Samsung
MPN: K4A8G085WC-BCRC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.54 | $5.54 |
| 10 | $5.2 | $52.00 |
| 100 | $4.9 | $490.00 |
| 500 | $4.6 | $2,300.00 |
| 1,000 | $4.3 | $4,300.00 |
Drop-in alternatives for K4A8G085WC-BCRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A8G085WC-BCPB
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View Datasheet →K4A8G085WC-BCTD
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View Datasheet →K4A8G085WC-BIWE
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View Datasheet →K4A8G085WB-BCRC
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View Datasheet →K4A8G165WB-BCRC
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View Datasheet →K4A8G085WC-BCRC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gbit |
| Organization | 1G x 8 |
| Supply Voltage | 1.2 V |
| Data Rate | 2400 Mbps (DDR4-2400) |
| Package | 78-ball FBGA (TFBGA) |
| Terminal Pitch | 0.8 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +95C |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| CRC Function | Yes |
| ZQ Calibration | Yes |
| Dynamic On-Die Termination | Yes |
| Data Mask Function | Yes |
| RoHS Status | Compliant |
| Refresh | Auto/Self refresh |
K4A8G085WC-BCRC 78-ball fbga (tfbga) Pin Configuration Guide
Complete pinout information for K4A8G085WC-BCRC (78-ball fbga (tfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A8G085WC-BCRC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G085WC-BCRC is suitable for 6 applications: Embedded Processor Main Memory, Desktop and Server DDR4 DIMM Modules, FPGA and ASIC Memory Subsystems, Networking and Communication Equipment, Set-Top Box and Smart Home Media Hubs, Test and Measurement Instrumentation.
Embedded Processor Main Memory
The K4A8G085WC-BCRC is a natural fit as soldered-down main memory for industrial SoCs and embedded x86/ARM processors that expose a DDR4-2400 memory controller. Its 8Gb density in a single 1G x 8 component lets designers build 1GB to 4GB systems with a handful of chips, while the 1.2V supply cuts DRAM power roughly 25% versus DDR3 - critical for fanless industrial PCs. Mounted as a single component on the PCB, it supports auto precharge, asynchronous reset, and ZQ calibration that simplify controller bring-up. Performance consideration: at 2400 Mbps the address/command bus should follow fly-by routing with dynamic ODT configured in the controller; the 0C to +95C rating covers typical commercial-industrial enclosures, but use the BIWE variant for -40C ambient designs.
Recommended
Desktop and Server DDR4 DIMM Modules
Samsung's WC-die 8Gb x8 DDR4 components are foundational building blocks for UDIMM, RDIMM, and SODIMM module assembly. With eight or nine K4A8G085WC-BCRC chips a module maker produces an 8GB DDR4-2400 unbuffered DIMM; the CRC and CA parity features align with server-class error-management expectations when paired with appropriate controllers. The 78-ball FBGA provides the short ball bonds and controlled impedance needed for reliable 2400 Mbps signaling along the module's multi-drop data lines. Performance consideration: module-level timing derives from the slowest component, so mixing bins is not permitted - all chips on a module must share the BCRC 2400 Mbps grade, and registered modules additionally require a register clock driver (e.g., PLL reference) between controller and DRAM address/command bus.
Recommended
FPGA and ASIC Memory Subsystems
The K4A8G085WC-BCRC integrates cleanly with FPGA hard DDR4 memory controllers rated at 2400 MT/s. The x8 organization with a single DQS/DQS# strobe pair and DM data mask per byte simplifies read/write leveling compared with x16 parts that carry two strobe pairs, and the 8Gb density provides buffer depth for packet processing, video frame storage, or ML inference workloads on a single chip. ZQ calibration and dynamic on-die termination maintain signal integrity across the SSTL12/Pseudo-open-drain style interface. Performance consideration: budget the controller's calibration time for ZQ and read-leveling at startup, and route DQ/DQS as length-matched groups; the 0.8 mm ball pitch supports escape routing on 6+ layer boards typical of FPGA designs.
Recommended
Networking and Communication Equipment
Routers, switches, and network appliances use 8Gb DDR4 components for packet buffering, routing tables, and control-plane software. The K4A8G085WC-BCRC's 2400 Mbps rate provides 19.2 GB/s peak bandwidth per chip at DDR4-2400 (single x8 channel), sufficient for control-plane memory in enterprise networking hardware, while the 1.2V operation keeps continuous-power budgets manageable in always-on equipment. CRC support aids data integrity in electrically noisy backplane environments, and the asynchronous reset ball allows quick recovery logic without full power cycling. Performance consideration: sustained throughput depends on bank-group interleaving; configure the memory scheduler to exploit DDR4's bank-group structure, and verify the 0C to +95C rating against telecom equipment ambient specifications.
Recommended
Set-Top Box and Smart Home Media Hubs
Media-hub SoCs require 1GB-2GB of DDR4 for OS, decode buffers, and graphics memory, making the K4A8G085WC-BCRC's 8Gb x8 single-chip density a compact choice. Its 2400 Mbps operation supports multiple simultaneous 1080p video streams with headroom, and the 1.2V rail integrates with typical PMIC-integrated SoC power trees that generate DDR4 core and VPP voltages. The FBGA-78 package keeps the memory footprint small for slim STB form factors, and soldered mounting improves reliability versus sockets in consumer devices subject to thermal cycling. Performance consideration: coordinate the SoC's DDR PHY training at 2400 MT/s with proper ODT settings, and place the DRAM within the maximum trace-length budget specified by the SoC layout guide for fly-by address routing.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators require deep capture memory with high sustained bandwidth. The K4A8G085WC-BCRC's 8Gb capacity allows long record lengths (for example, 8 gigabytes of samples organized across eight chips), while 2400 Mbps transfer rate and DDR4's bank-group architecture sustain the streaming rates needed for continuous acquisition. The CRC feature and on-die termination contribute to data integrity in instruments where measurement accuracy is paramount, and ZQ calibration ensures stable output impedance across temperature. Performance consideration: instrument firmware should validate JEDEC timing when selecting the 2400 Mbps bin versus faster alternatives; for extended-temperature bench environments within 0C to +95C the BCRC is appropriate, while portable field instruments benefit from the BIWE industrial-grade variant.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G085WC-BCRC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G085WC-BCPB | K4A8G085WC-BCTD | K4A8G085WC-BIWE | K4A8G165WB-BCRC |
|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 | 512M x 16 |
| Data Rate | 2400 Mbps | 2400 Mbps | 2666 Mbps | 3200 Mbps | 2400 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | -40C to +95C | 0C to +95C |
| Controller Compatibility | DDR4-2400 native | DDR4-2400 native - none needed | JEDEC timing re-validation if down-clocked | JEDEC timing re-validation if down-clocked | Firmware/organization rework required (x16) |
| RoHS | Compliant | [DATA_NEEDED] | Compliant | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest-cost same-die option in the WC family (vs K4A8G085WC-BCTD)
- Cost-optimized versus industrial temperature grade (vs K4A8G085WC-BIWE)
- Single-strobe x8 interface simplifies PHY bring-up (vs K4A8G165WB-BCRC)
Design Notes
At 2400 Mbps, route DQ/DQS/DM traces as length-matched groups (intra-byte-lane skew typically under 10 mil per datasheet routing rules of the memory controller vendor) and use fly-by routing for address/command with dynamic ODT enabled. The K4A8G085WC-BCRC's ZQ calibration ball requires an external precision resistor (RZQ, typically 240 ohm 1%) to ground - place it close to the ball with a low-inductance ground return. Refer to Samsung's DDR4 component datasheet and your controller vendor's layout guide (e.g., TI/Hardware Design Guide for DDR4) for topology specifics.
The K4A8G085WC-BCRC uses a 1.2V core (VDD/VDDQ) supply; some Samsung DDR4 generations also specify a 2.5V VPP rail for cell-charge pumping - confirm both rails from the datasheet power table and decouple each with bulk ceramic capacitance plus 0.1uF high-frequency caps at every second VDD ball. Estimated: an 8Gb x8 DDR4-2400 component drawing roughly 300-500 mA average under active read/write bursts dissipates about 0.4-0.6 W - budget your 1.2V regulator (e.g., a buck such as TPS54218) accordingly with margin for write-charge transients.
Speed-bin and ordering-code mismatches are the top DDR4 substitution failure mode. The K4A8G085WC family spans 2400/2666/3200 MT/s bins (BCRC/BCTD/BIWE): physically identical 78-ball FBGA parts are not firmware drop-ins. Down-clocking a faster bin to a slower controller requires strict JEDEC timing validation in U-Boot or BIOS, per Samsung migration guidance. Additionally, never substitute an x16 organization (K4A8G165W) for an x8 part without controller rework - the DQ, DM, and DQS ball functions differ even though the mechanical package is identical.
The BCRC is rated 0C to +95C. DDR4 components rely on the ambient and self-refresh temperature (SRT) extended operating range flags configured by the controller; if your design operates above 85C ambient, verify the allowable refresh behavior and consider thermal vias under the FBGA package to spread heat into inner copper planes. Estimated: with ~0.5 W dissipation in a sealed enclosure, expect a 5-10C package-to-ambient rise depending on airflow; confirm your worst-case ambient keeps the die within the 95C rating.
Compliance Information
RoHS compliant per JLCPCB and LCSC product listings. REACH, halogen-free, and conflict minerals status not stated in provided data.
