K4A8G165WB-BCRC - 8Gb DDR4 SDRAM 2400Mbps x16 | Samsung
MPN: K4A8G165WB-BCRC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.47 | $15.47 |
| 10 | $14.7 | $147.00 |
| 100 | $13.93 | $1,393.00 |
| 500 | $13.16 | $6,580.00 |
| 1,000 | $12.4 | $12,400.00 |
Drop-in alternatives for K4A8G165WB-BCRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K4A8G165WB-BCPB
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View Datasheet →K4A8G165WC-BCRC
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View Datasheet →K4A4G165WD-BCRC
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View Datasheet →K4A8G165WB-BCRC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM (DRAM, volatile) |
| Memory Size | 8 Gb |
| Memory Organization | 512M x 16 |
| Interface | Parallel (DDR4 SDRAM bus) |
| Supply Voltage (VDD) | 1.2 V |
| Data Rate | 2400 Mbps/pin (DDR4-2400) |
| Technology | CMOS, B-die 8Gb die |
| Package | 96-ball FBGA (PBGA96) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +95C |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| CRC / CA Parity | CRC function supported |
| On-Chip Termination | Dynamic ODT |
| ZQ Calibration | Yes |
| Clock Frequency | 1200 MHz (DDR4-2400) |
K4A8G165WB-BCRC 96-ball fbga (pbga96) Pin Configuration Guide
Complete pinout information for K4A8G165WB-BCRC (96-ball fbga (pbga96) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A8G165WB-BCRC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G165WB-BCRC is suitable for 6 applications: Industrial Control Systems, Network Communication Equipment, Servers and Storage Controllers, Embedded Computing and Single-Board Computers, Test and Measurement Instrumentation, Automotive-adjacent and Rugged Embedded Systems.
Industrial Control Systems
The K4A8G165WB-BCRC fits industrial PLCs, motion controllers, and HMI platforms because its -40C to +95C operating range covers unconditioned cabinet environments, and its CRC and CA parity functions protect command/address integrity against electrical noise from drives and switching loads. As the main working memory for an ARM or FPGA-based controller, one 512M x16 device provides 1 GB of buffering for recipe storage, logging, and real-time control loops at 2400 Mbps. Place the DRAM point-to-point from the processor with length-matched traces and dynamic ODT enabled; the ZQ calibration resistor maintains driver impedance accuracy over the full temperature swing, reducing eye-closure risk in thermally cycling enclosures.
Recommended
Network Communication Equipment
Routers, switches, and baseband cards use the K4A8G165WB-BCRC as packet-buffer and table memory. The 512M x16 organization suits designs that populate one or two DRAMs beside a network processor, and the 2400 Mbps data rate supplies 4.8 GB/s of read/write bandwidth per device for queuing and classification workloads. CRC on the DDR4 bus plus dynamic on-chip termination keeps signaling robust on multi-layer backplane-adjacent PCBs where trace stubs and impedance discontinuities would otherwise close the data eye. Mount the ZQ calibration resistor (240 ohm, 1%) to SGND near the ball, and follow the fly-by or point-to-point topology rules in the Samsung datasheet to preserve timing margin at DDR4-2400 in dense switch fabric layouts.
Recommended
Servers and Storage Controllers
In entry-level servers, RAID cards, and SSD controllers, the K4A8G165WB-BCRC serves as firmware execution memory, cache, and metadata buffer. The 8Gb B-die die maximizes capacity per component, letting a controller board reach multiple gigabytes with a handful of FBGA-96 parts instead of stacked lower-density devices, improving reliability by reducing solder-joint count. The asynchronous reset function enables rapid re-initialization after controller faults, important for high-availability storage. Because server environments stay within 0C to +85C ambient under the component's 95C limit, thermal design should still verify airflow over the package; Estimated: DDR4-2400 activity dissipates on the order of hundreds of milliwatts per device, manageable with standard airflow.
Recommended
Embedded Computing and Single-Board Computers
Embedded ARM boards, gateways, and IoT edge platforms adopt the K4A8G165WB-BCRC because one x16 component provides 1 GB of DDR4 with a minimal footprint: the 96-ball FBGA occupies roughly 10 mm x 14.5 mm of board area, fitting beneath or beside the SoC in compact layouts. At 1.2V VDD the device improves energy efficiency versus DDR3, extending battery-backed and thermally constrained designs. SoC DDR controllers that support DDR4-2400 x16 initialize the device using its asynchronous reset and ZQ calibration sequence. Designers should keep the clock and strobes length-matched within controller skew budgets and reference the Samsung datasheet initialization timing before releasing firmware memory-init code.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and arbitrary waveform generators require deep capture memory with predictable latency, and the K4A8G165WB-BCRC provides 512M x16 words of DDR4 buffer at 2400 Mbps. CRC and CA parity flag bus errors that would otherwise corrupt acquired waveforms silently, an important diagnostic feature in calibration-grade instruments. The -40C to +95C grade accommodates bench instruments transported between environments. Instrument designers typically pair the DRAM with an FPGA memory controller; ensure the write-leveling and read-training routines in the controller handle the BCRC bin's timing parameters from the Samsung datasheet, and budget capture-bandwidth against the 4.8 GB/s per-device streaming limit when architecting multi-DRAM banks.
Recommended
Automotive-adjacent and Rugged Embedded Systems
Telematics units, dash-side recording platforms, and rugged gateways that are not AEC-Q100-certified but face harsh environments use the K4A8G165WB-BCRC for its -40C to +95C rating and CRC-protected bus. The 8Gb x16 device stores event logs, map tiles, and video ring buffers for camera-based systems, with 2400 Mbps bandwidth supporting sustained recorder write streams. Dynamic ODT and ZQ calibration preserve signal integrity across automotive-grade thermal cycling of the enclosure (note: the commercial/industrial grade part itself is not AEC-Q100 qualified; confirm qualification requirements with Samsung for true automotive deployments). Layout should avoid routing DDR4 near ignition-noise sources and use solid reference planes under all data groups.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G165WB-BCRC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G165WB-BCPB | K4A8G165WB-BCTD | K4A8G165WB-BCWE | K4A4G165WD-BCRC |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA family - same footprint class |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 4 Gb (-50%) |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 256M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Bin / Data Rate | BCRC bin (DDR4-2400 class) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | BCRC bin |
| Operating Temperature | -40C to +95C | -40C to +95C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Features | Auto precharge, async reset, CRC, dynamic ODT, ZQ cal | Same feature set (same die) | Same feature set (same die) | Same feature set (same die) | Same DDR4 feature set, lower density |
| Unit Price (qty 1) | $15.47 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest density in the WB x16 family (vs K4A4G165WD-BCRC)
- Industrial temperature grade (vs K4A8G165WB-BCPB)
- Full DDR4 integrity feature set (vs K4A8G165WB-BCTD)
Design Notes
DDR4-2400 on an x16 bus demands length-matched routing: keep DQ/DM/DQS trace skew within the controller specification and match CK to CA within the datasheet flight-time budget. Use dynamic ODT during writes and on-die termination settings per the Samsung datasheet to damp reflections; enable write leveling and read training in the memory controller during initialization. Avoid routing DDR4 signals across plane splits, and keep a continuous reference plane under every data group. Estimated: at 1200 MHz, a 25 mm stub can resonate enough to close the data eye on FR-4, so eliminate all stubs with point-to-point topology.
Supply the K4A8G165WB-BCRC from a clean 1.2V VDD rail plus a separate 2.5V VPP rail for the wordline pump, with VREFCA generated per the datasheet reference circuit. Decouple with bulk capacitance at the regulator and an array of 100 nF ceramics placed directly under the FBGA-96 power balls. Follow the power-up sequence: VDD and VPP ramp before or together with VREFCA while RESET_n is held low, then complete initialization including ZQ calibration (240 ohm, 1% resistor to ground at the ZQ ball). Estimated: per-device average current at DDR4-2400 activity is on the order of hundreds of milliamps - size the regulator with at least 50% margin.
Do not assume all K4A8G165WB suffixes carry identical speed bins - the final letter code (BCRC, BCPB, BCTD, BCWE) encodes JEDEC timing grades, and programming a controller for a faster bin than the installed part violates tCK/CL requirements causing unstable boot. Also verify the die revision letter in the full ordering code: the C-die (K4A8G165WC) may have different timing tables from the B-die (K4A8G165WB). Samsung reserves the right to change specifications without notice, so re-check the latest datasheet revision before a production tape-out and qualify any substitute on your actual board.
Compliance Information
Compliance status not stated in the provided web data; consult the official Samsung product page or environmental datasheet for RoHS/REACH declarations.
