Micron Technology

M29W800FT70ZA3SE - 8Mbit 70ns NOR Flash | Micron | Embedded

MPN: M29W800FT70ZA3SE βœ“ Active
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2.7 V to 3.6 V Vdss 48-TFBGA (6x8 mm) Package NOR Flash (Parallel) Memory
From $1.38 USD / Unit
MOQ: 1 |
Price updated: 2026-09-04
Volume Pricing
Qty Unit Price Extended
1 $1.9 $1.90
10 $1.71 $17.10
100 $1.53 $153.00
500 $1.45 $725.00
1,000 $1.38 $1,380.00
ℹ️ All prices are in USD

Drop-in alternatives for M29W800FT70ZA3SE β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

M29W800FT70ZA3E

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6x8)
same die, density (8Mbit), speed (70 ns) and ZA3 package; differs in temperature/packing suffix digit (E vs SE grade)

πŸ“‹ Reference alternative (not in catalog)

M29W800FT70ZS3E

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6x8)
same 8Mbit/70 ns/48-TFBGA core specs; alternative tape/reel packing and grade suffix, pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

M29W800FB70ZA3E

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6x8)
bottom boot block (FB) vs top boot block (FT); identical package, density, speed, voltage and ball map

πŸ“‹ Reference alternative (not in catalog)

M29W800FT70ZA3SE Maximum Ratings & Electrical Characteristics

Memory Type NOR Flash (Parallel)
Memory Size 8 Mbit
Organization 512K x 16
Technology SLC
Access Time 70 ns
Interface Parallel
Supply Voltage 2.7 V to 3.6 V
Operating Temperature -40C to +125C
Package 48-TFBGA (6x8 mm)
Mounting Type Surface Mount
Programming Interface CFI command set
Boot Block Architecture Top boot (FT = top boot block)
Density 8 Mb
Chipset Validation N/A

M29W800FT70ZA3SE 48-tfbga (6x8 mm) Pin Configuration Guide

Complete pinout information for M29W800FT70ZA3SE (48-tfbga (6x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

48-tfbga (6x8 mm) package pinout diagram for M29W800FT70ZA3SE

No detailed pinout data available for M29W800FT70ZA3SE.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for M29W800FT70ZA3SE Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

M29W800FT70ZA3SE is suitable for 6 applications: Embedded Boot Code Storage, Industrial Control Modules, Telecom and Networking Equipment, Automotive-Adjacent Modules, Legacy System Repair and Sustainment, Set-Top Box and Printer Firmware.

πŸ–₯️

Embedded Boot Code Storage

The M29W800FT70ZA3SE is a natural fit for boot firmware storage because its 70 ns parallel random access allows the CPU to fetch the reset vector and execute in place (XIP) without first copying code into RAM. Organized as 512K x 16, the 16-bit bus halves the address pin count versus x8 configurations while sustaining zero-wait-state reads on typical embedded buses. Placed directly on the processor's memory controller with standard CFI command programming, it supports in-system firmware updates using program/erase suspend commands, keeping the system responsive during updates. Its 8Mbit density comfortably holds a bootloader plus a compressed OS image for industrial controllers and telecom line cards.

🏭

Industrial Control Modules

Industrial PLCs, motor drives, and factory automation controllers need nonvolatile code storage that survives wide temperature swings and years of field service. The M29W800FT70ZA3SE's -40C to +125C operating range exceeds typical industrial requirements, and its SLC NOR architecture provides deterministic read timing with no wear-leveling complexity for code that is rarely rewritten. The 2.7V to 3.6V single supply integrates cleanly with 3.3V logic rails, and the 48-TFBGA (6x8 mm) footprint saves board area versus legacy TSOP parallel flash. Its 70 ns access time supports direct memory-bus execution without wait states on most industrial microcontroller bus clocks.

🌐

Telecom and Networking Equipment

Line cards, routers, and base-station control boards traditionally store firmware in parallel NOR for reliable boot and in-place execution. The M29W800FT70ZA3SE fits this role with a 70 ns access time, a 512K x 16 organization that maps directly onto 16-bit processor buses, and CFI-standard command programming that simplifies driver portability across firmware versions. The extended -40C to +125C temperature range covers unconditioned outdoor telecom cabinets, while the compact 6x8 mm TFBGA suits high-density blade designs. Distributed stock (DigiKey ships same day; Octatronics lists 852 units) supports both new builds and field-repair spares as of 2026-09-04.

πŸš—

Automotive-Adjacent Modules

Body-control adjacent modules, sensors hubs, and telematics units benefit from the M29W800FT70ZA3SE's -40C to +125C rating, which spans the temperature envelope of many automotive cabin and engine-bay-adjacent locations. Its parallel bus XIP capability provides deterministic boot timing required by functional-safety-conscious startup sequences, and SLC NOR endurance handles the modest firmware-update frequency of automotive ECUs. Designers should confirm formal AEC-Q100 qualification status with Micron before safety-relevant deployment, as available listings describe a standard-grade part. The 48-TFBGA package's short bond wires also improve signal integrity on vibration-prone platforms compared with leaded TSOP packages.

πŸ”§

Legacy System Repair and Sustainment

Many installed industrial, medical, and telecom platforms were designed around 8Mbit parallel NOR and remain in service for decades. The M29W800FT70ZA3SE provides a currently-stocked, same-form-factor source for board repairs and spare manufacturing of these systems: the 512K x 16 organization, 70 ns timing, 2.7V to 3.6V supply, and 48-ball TFBGA (6x8) footprint match the original M29W800 design-in parameters exactly. With in-stock availability at LCSC ($1.5250 as of 2026-09-04) and DigiKey (ships today), maintainers can avoid costly redesigns, and same-family FT/FB variants cover both top- and bottom-boot reset-vector conventions across legacy CPU families.

πŸ“Ί

Set-Top Box and Printer Firmware

Set-top boxes, printers, and imaging equipment execute firmware from NOR flash at power-up before any mass storage is available. The M29W800FT70ZA3SE supports this with 70 ns XIP reads on a 16-bit bus, an 8Mbit capacity sized for bootloader plus compressed application images, and a CFI command set that shortens software bring-up across SoC vendors. Its 3.3V-compatible single supply simplifies the power tree, and the 6x8 mm TFBGA keeps the memory footprint small on cost-sensitive consumer boards. Firmware-update routines can use program/erase suspend so the device remains readable while background updates proceed, preventing UI stalls during over-the-network upgrades.

What is the M29W800FT70ZA3SE and what are its key specifications?
The M29W800FT70ZA3SE is a Micron 8Mbit parallel NOR flash memory organized as 512K x 16 with a 70 ns access time, 2.7V to 3.6V single supply, and -40C to +125C operating range in a 48-ball TFBGA (6x8 mm) package. According to distributor listings (DigiKey, Mouser, LCSC), it is an SLC NOR device supporting in-place code execution via a standard CFI command set, making it suitable for boot-code storage in embedded systems.
What is the access time of M29W800FT70ZA3SE?
The access time is 70 ns, which is the meaning of the '70' digit in the part number M29W800FT70ZA3SE. This speed allows zero-wait-state reads from most embedded processors running at moderate bus frequencies. Per DigiKey's product listing, the device is cataloged as 'FLASH - NOR Memory IC 8Mbit Parallel 70 ns 48-TFBGA (6x8)'. Systems running faster bus clocks should insert one wait state or verify timing against the manufacturer datasheet.
What supply voltage does the M29W800FT70ZA3SE require?
The M29W800FT70ZA3SE operates from a single 2.7V to 3.6V supply, consistent with the '3V' designation of the M29W400/800 parallel NOR family. According to the digchip datasheet index for the M29W800 family, the device is a 3V parallel NOR flash with the same supply used for read, program, and erase operations. This single-rail operation simplifies power-supply design compared to older dual-rail 12V-programmed flash devices.
What is the temperature range of M29W800FT70ZA3SE?
The M29W800FT70ZA3SE operates from -40C to +125C, as stated in the digchip datasheet summary for the part ('Op. Temp. : -40C to +125C'). This extended industrial-to-automotive-like range makes it suitable for under-hood-adjacent automotive modules, industrial drives, and outdoor telecom equipment. Designers should still verify solder-reflow compatibility and board-level reliability for the 48-TFBGA package at the temperature extremes.
What is the difference between M29W800FT and M29W800FB?
The 'FT' suffix indicates a top-boot-block architecture while 'FB' indicates a bottom-boot-block architecture; both are otherwise identical 8Mbit 3V parallel NOR devices. Boot block placement matters because many CPUs fetch their reset vector from the top or bottom of the address map. According to the family datasheet title '4Mb, 8Mb 3V Parallel NOR Flash: M29W400FB/FT, M29W800FB/FT', both variants share the same package, speed, and voltage ratings, so select the boot orientation that matches your processor's reset vector location.
What is the best drop-in replacement for M29W800FT70ZA3SE?
The closest drop-in replacements are same-family Micron variants such as the M29W800FT70ZA3E and other M29W800FT 70 ns 48-TFBGA temperature/packaging suffix variants, which share the same die, package, and pinout. According to web listings, no verified cross-brand pin-compatible equivalent in the same 48-TFBGA footprint was found in cross-reference searches, so second-source alternatives generally require layout or suffix verification. Always confirm the temperature grade and FBGA package code suffix before ordering a substitute.
Is M29W800FT70ZA3SE suitable for automotive applications?
The device supports -40C to +125C operation, which covers the temperature range of many automotive cabin and under-hood-adjacent modules. However, the M29W800FT70ZA3SE is cataloged as a standard industrial-grade part; whether it is formally AEC-Q100 qualified is not stated in the available data and should be confirmed with Micron before use in safety-relevant automotive designs. For applications requiring documented automotive qualification, request the PPAP file or qualification report directly from Micron or an authorized distributor.
Where to download M29W800FT70ZA3SE datasheet PDF?
The M29W800FT70ZA3SE datasheet PDF is available from Micron's official part-detail page at micron.com/products/storage/nor-flash/parallel-nor/part-catalog/part-detail/m29w800ft70za3se, and free mirror copies are listed on datasheets.com and digchip.com. The governing document is the '4Mb, 8Mb 3V Parallel NOR Flash: M29W400FB/FT, M29W800FB/FT' family datasheet, which covers all M29W800 speed and package variants. Always download from Micron's official site to ensure you have the latest revision.
What is the price of M29W800FT70ZA3SE?
As of 2026-09-04, LCSC lists the M29W800FT70ZA3SE from approximately $1.5250 per unit for in-stock quantity purchases. Octopart reports pricing from 4 distributors, allowing bulk-discount comparison. XAIPART pricing on this page starts at $1.90 for quantity 1, dropping to about $1.38 at 1000 pieces. Prices fluctuate with stock conditions, so use the Octopart comparison page or request a quote for current volume pricing before committing a BOM.
Where to buy M29W800FT70ZA3SE online?
The M29W800FT70ZA3SE can be purchased from DigiKey (in-stock, ships same day per their listing), Mouser, LCSC (in stock, from $1.5250 as of 2026-09-04), and secondary sources such as Win Source, Xecor, Octatronics (852 units listed), Jotrin, Veswin, and Avaq. Octopart aggregates 4 to 13 distributor listings for price comparison. For production quantities, request quotes from multiple distributors, as secondary-market stock may vary in date codes and packaging.
Is M29W800FT70ZA3SE in stock?
Yes, the part is widely in stock as of 2026-09-04: DigiKey advertises 'Buy now, ships today', LCSC lists it in stock from $1.5250, and Octatronics shows 852 units listed. Octopart reports 4 distributors carrying stock with price comparison available. Availability at secondary distributors (Win Source, Xecor, Avaq) is typically quoted via RFQ. For large production volumes, verify lot-date-code requirements with each distributor before ordering.
What is the package and pinout of M29W800FT70ZA3SE?
The M29W800FT70ZA3SE comes in a 48-ball TFBGA package measuring 6x8 mm, per DigiKey's and Mouser's product listings. The 'ZA3' suffix in the part number identifies this FBGA package option. The detailed ball-map pinout (address, data, control signal ball assignments) is provided in the Micron M29W800FT family datasheet downloadable from Micron's official part-detail page. Note that the '70' digit denotes speed and 'S/E' digits denote temperature/packing grades, not package changes, so all ZA3 variants share the same ball map.
M29W800FT70ZA3SE vs MT25QL128ABB1EW7 - which should I choose for boot code?
Choose the M29W800FT70ZA3SE when your processor has a parallel NOR bus and you need in-place execution (XIP) with 70 ns random access; choose the MT25QL128ABB1EW7 (Micron 128Mbit SPI NOR) when board space and pin count dominate, since SPI NOR uses only ~8 signal pins versus the parallel bus's dozens. The M29W800FT offers 8Mbit with no serial-protocol read latency, while the MT25QL offers 16x the density in a smaller footprint but requires copying code to RAM or XIP via the SPI quad protocol with higher effective access latency.
What Micron equivalent should I use in place of M29W800FT70ZA3SE if stock runs out?
For a same-footprint replacement, use another M29W800FT 70 ns 48-TFBGA (ZA3) suffix variant from Micron, such as the M29W800FT70ZA3E, which matches density, speed, organization, package, and ball map. Cross-brand equivalents pin-compatible in the 48-TFBGA (6x8 mm) footprint were not identified in the cross-reference web data reviewed as of 2026-09-04. If a redesign is acceptable, higher-density M29W256G parallel NOR (e.g., M29W256GH70ZS3F) offers more capacity but requires layout changes.
When should I choose M29W800FT70ZA3SE over a serial (SPI) NOR flash?
Choose the M29W800FT70ZA3SE when your embedded processor boots directly from a parallel memory bus and requires deterministic 70 ns random access for execute-in-place code, or when you are doing a repair/maintenance drop-in on an existing parallel-bus PCB. Choose SPI NOR for new designs where pin count, board area, or migration to larger densities matters more than access latency. The parallel part's -40C to +125C range and SLC endurance favor long-lifetime industrial and telecom equipment over consumer designs built around cost-optimized SPI flash.

Engineering reference data for M29W800FT70ZA3SE β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the M29W800FT70ZA3SE when you need an 8Mbit parallel NOR with 70 ns XIP access, a 512K x 16 bus organization, and -40C to +125C operation in a compact 6x8 mm 48-TFBGA footprint - typical for embedded boot code, telecom line cards, and legacy-board sustainment. Choose M29W800FB70ZA3E if your processor's reset vector sits at the bottom of the address map (boot orientation is the only functional difference). Choose other ZA3 suffix variants of the same die for grade or packing differences. Choose SPI NOR such as MT25QL128ABB1EW7 for new designs where pin count and density matter more than access latency. For safety-relevant automotive use, confirm AEC-Q100 status with Micron first, since listings describe a standard-grade part. Trade-offs: parallel NOR costs more board area than SPI but delivers deterministic zero-wait-state execution.

Comparison with Alternatives

Parameter This Product M29W800FT70ZA3E M29W800FT70ZS3E M29W800FB70ZA3E
Package 48-TFBGA (6x8 mm) 48-TFBGA (6x8 mm) - same 48-TFBGA (6x8 mm) - same 48-TFBGA (6x8 mm) - same
Brand Micron Technology Micron Technology Micron Technology Micron Technology
Density 8 Mbit 8 Mbit 8 Mbit 8 Mbit
Organization 512K x 16 512K x 16 512K x 16 512K x 16
Access Time 70 ns 70 ns 70 ns 70 ns
Supply Voltage 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V
Operating Temperature -40C to +125C [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Boot Block Orientation Top boot (FT) Top boot (FT) Top boot (FT) Bottom boot (FB)

Key Differentiators

  • Top-boot block architecture with extended -40C to +125C range (vs M29W800FB70ZA3E)
  • Parallel bus XIP at 70 ns (vs MT25QL128ABB1EW7)
  • Currently stocked legacy-sustainment part (vs M29W800FT70ZS3E)

Design Notes

The 70 ns access time is the fastest M29W800 grade, so bus timing margin matters. Keep address/data trace lengths matched within ~10 mm on the parallel bus and series-terminate (~22 to 33 ohm) long address lines to control ringing at fast edges. Verify the processor's external bus timing at worst-case temperature (-40C/+125C shifts output-driver strength) and confirm CE#-to-output-valid timing against the 70 ns figure from the manufacturer datasheet rather than assuming zero wait states across the full clock range.

Power the device from a clean 2.7V to 3.6V rail with 0.1 uF ceramic decoupling at each supply ball plus a 10 uF bulk capacitor, since program and erase operations draw transient current pulses on top of the read-baseline supply current. If the same 3.3V rail also feeds switching regulators or RF circuitry, add a ferrite bead isolation stage to prevent supply droop during erase bursts from resetting the memory controller. Confirm exact ICC read/program/erase figures from the Micron M29W800FT family datasheet before finalizing the power budget.

Do not confuse FT (top boot) and FB (bottom boot) suffixes: they are electrically identical in the same 48-TFBGA package but place the protected boot sectors at opposite ends of the address map, so an FB part in an FT-designed socket will locate the reset-vector code at the wrong address. Also verify the temperature/packing suffix digit (SE vs E vs S3) when ordering, as the same die ships in multiple grades. Erase operations take far longer than program operations - implement suspend/resume in your firmware-update driver so the CPU can keep servicing interrupts during bulk erase.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status not stated in the provided verified web data; confirm RoHS/REACH and AEC-Q100 status on Micron's official part-detail page.

Data verified on: 2026-09-04 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Micron Technology M29W800FT70ZA3SE M29W800FT M29W800FB M29W256GH70ZS3F MT25QL128ABB1EW7 N25Q032A13EV7A0 parallel NOR flash NOR memory nonvolatile memory SLC execute in place XIP CFI Common Flash Interface 48-TFBGA TFBGA ball grid array BGA family surface mount RoHS boot block architecture access time embedded boot code storage telecom line card
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