RTAX4000SL-1CG1272V - 4M-Gate Rad-Tolerant FPGA | Microchip
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Drop-in alternatives for RTAX4000SL-1CG1272V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000SL-1CG1272E
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View Datasheet →RTAX4000SL-CG1272E
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View Datasheet →RTAX4000SL-1LG1272V
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View Datasheet →RTAX4000SL-LG1272V
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View Datasheet →RTAX4000S-LG1272V
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View Datasheet →RTAX4000S-1LG1272PROTO
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View Datasheet →RTAX4000SL-1CG1272V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 4,000,000 gates |
| Logic Cells | 40,320 |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Logic Technology | CMOS, antifuse (one-time programmable) |
| Package Type | CGA-1272 ceramic column grid array |
| Pin Count | 1272 |
| Operating Temperature | -55C to +125C |
| SEU Hardening | SEU-hardened registers, no external TMR required |
| SEU Rate | < 10-10 errors/bit-day |
| Configuration | Live at power-up, single-chip (no external config device) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Programmability Type | OTP (one-time programmable) |
| Speed Grade | -1 |
| Qualification Grade | V (space flight / radiation-tolerant) |
| Mounting Type | Surface Mount |
RTAX4000SL-1CG1272V cga-1272 ceramic column grid array Pin Configuration Guide
Complete pinout information for RTAX4000SL-1CG1272V (cga-1272 ceramic column grid array package) with 1272 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000SL-1CG1272V.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1272 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000SL-1CG1272V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Avionics, Scientific Instrument Control, Telemetry and Downlink Baseband, Launch Vehicle and Missile Electronics, Ground Test and Prototyping Systems.
Satellite Payload Data Processing
The RTAX4000SL-1CG1272V fits high-throughput payload data processing chains where 4,000,000 equivalent gates and 40,320 logic cells implement compression, formatting, and channelization pipelines. Its SEU-hardened registers achieve error rates below 10-10 errors/bit-day without external TMR, preserving logic capacity that SRAM FPGAs would consume on redundancy. The SL fabric reduces dynamic power, extending battery and solar budgets in orbit. Embedded SRAM with built-in FIFO control buffers data between high-rate sensors and downlink encoders. Because configuration is antifuse OTP and live at power-up, the payload needs no configuration PROM, removing an SEU-vulnerable external memory from the data path entirely in the 1.5V CMOS core.
Recommended
Spacecraft Bus Control and Avionics
Spacecraft bus controllers require deterministic logic that is alive the instant power is applied. The RTAX4000SL-1CG1272V's antifuse fabric is live at power-up, implementing command decoding, mode control, and power-switching state machines without boot time or configuration readback. The -55C to +125C operating range and hermetic CGA-1272 package withstand eclipse thermal cycling and launch vibration. SEU-hardened registers keep command-and-handling logic immune to upsets, critical for functions such as safe-mode entry that must never misfire. Designers typically pair the FPGA with rad-tolerant interface transceivers and implement MIL-STD-1553, SpaceWire, or CAN-style bus logic within the 1.5V core fabric.
Recommended
Scientific Instrument Control
Deep-space and Earth-observation instruments demand precise, low-noise sequencing of detectors, ADCs, and mechanisms. The RTAX4000SL-1CG1272V provides 4M gates for implementing high-resolution timing generators, co-addition engines, and detector-bias sequencing. The SL fabric's reduced dynamic power limits locally generated electrical noise on sensitive analog rails, and the SEU rate below 10-10 errors/bit-day protects long science integrations from corruption. Embedded SRAM FIFOs absorb detector output bursts before downlink. Hermetic ceramic CGA packaging suits instrument housings that are baked out and operated in vacuum, and the -1 speed grade supplies ample timing margin at the moderate clock rates typical of instrument control logic.
Recommended
Telemetry and Downlink Baseband
Downlink baseband chains implement encoding (for example convolutional or Reed-Solomon style pipelines), framing, and scrambling in programmable logic. The RTAX4000SL-1CG1272V's 40,320 logic cells accommodate encoder/decoder pipelines alongside FIFO management using embedded SRAM blocks. The high column count of CGA-1272 supplies enough user I/O for wide parallel interfaces to DACs, modulators, and memory. SEU-hardened registers protect frame counters and state machines whose corruption would desynchronize the ground link; antifuse configuration means no SEU-vulnerable configuration memory exists to refresh. The 1.5V CMOS core keeps baseband power within typical transmitter payload allocations.
Recommended
Launch Vehicle and Missile Electronics
Flight-control and telemetry electronics on launch vehicles face extreme vibration, wide thermal excursions, and short mission durations where SRAM FPGA configuration upset is unacceptable. The RTAX4000SL-1CG1272V's one-time-programmable antifuse fabric cannot lose its configuration, its registers are SEU-hardened, and the -55C to +125C ceramic-package rating covers boosted/ascent environments. The 4M gate capacity implements guidance-interface glue logic, redundant-voting circuits, and high-rate sensor aggregation on a single chip, satisfying single-chip form-factor requirements that reduce board count and mass. Design flows typically prototype on ProASIC3E adaptors before releasing the netlist to the flight device.
Recommended
Ground Test and Prototyping Systems
Because antifuse RTAX devices are one-time programmable, every flight program needs a reprogrammable prototyping path. Microchip and Aldec offer an RTAX prototyping solution that places a flash-based ProASIC3E FPGA on a footprint-compatible adaptor board; the design is debugged in-system, then converted via EDIF netlist and pinout converter for the RTAX device. Engineering-flow parts such as RTAX4000SL-1CG1272E populate early test benches with the same die and package as the flight article, validating timing, I/O, and thermal behavior. This two-stage flow prevents consuming scarce flight units (V flow) during RTL iterations and de-risks the one-time programming step.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000SL-1CG1272V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-1CG1272E | RTAX4000SL-1LG1272V | RTAX4000S-LG1272V | RTAX4000S-1LG1272PROTO |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | CGA-1272 ceramic | CGA-1272 - same | LGA-1272 (land grid vs column grid) | LGA-1272 | LGA-1272 |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 40,320 | 40,320 | 40,320 | 40,320 | 40,320 |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | -1 | -1 | standard | -1 |
| Power Variant | SL (low power) | SL (low power) | SL (low power) | S (higher dynamic power) | S (higher dynamic power) |
| Qualification Flow | V (space flight) | E (engineering) | V (space flight) | V (space flight) | PROTO (prototyping) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
Key Differentiators
- Low-power SL fabric in the largest RTAX density (vs RTAX4000S-LG1272V)
- Flight-screened V flow on the CGA column package (vs RTAX4000SL-1CG1272E)
- Column-grid mechanical attach for launch environments (vs RTAX4000SL-1LG1272V)
- Trade-off: OTP fabric requires external prototyping path (vs A3PE3000-1FGG896)
Design Notes
RTAX-S/SL antifuse devices are one-time programmable: a design change after programming requires a new device. Follow Microchip's recommended flow of prototyping on a footprint-compatible ProASIC3E-based adaptor board (e.g., Aldec RTAX prototyping platform), verifying the design in-system, then converting the EDIF netlist and pinout for the flight device. Do not use flight (V-flow) units for RTL debugging; use engineering-flow parts such as RTAX4000SL-1CG1272E instead.
Provide a tightly regulated 1.5V core supply within the 1.425V to 1.575V window, with local bulk and high-frequency decoupling at each CGA-1272 power position. The SL fabric reduces dynamic power versus the RTAX4000S, but dynamic current still scales with clock activity; run Microchip's Libero SmartPower estimates early to size the spacecraft DC-DC converters. Never tolerate brownouts near the window, as undervoltage during operation may violate timing on the -1 speed grade.
The CGA-1272 ceramic column grid array requires controlled reflow/solder-column attach processes and accurate land-pattern design per Microchip's package application notes. Plan substrate warpage allowances for the large 1272-position ceramic body, and verify column coplanarity on receipt. If your assembly house cannot process CGA columns, the pin-mapped LGA-1272 variants (RTAX4000SL-1LG1272V) attach via standard land-grid solder processes with the same die and netlist.
Compliance Information
Space-grade (V flow) hermetic ceramic device; AEC-Q100 automotive qualification not applicable. RoHS/REACH/lead-free declarations not stated in verified data - confirm with Microchip for this ceramic package.
