W634GU6RB-11 - 4Gb DDR3L SDRAM 933MHz | Winbond
MPN: W634GU6RB-11 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.4 | $45.40 |
| 10 | $42.5 | $425.00 |
| 100 | $38.7 | $3,870.00 |
| 500 | $35.2 | $17,600.00 |
| 1,000 | $32.8 | $32,800.00 |
Drop-in alternatives for W634GU6RB-11 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W634GU6RB11I
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View Datasheet →W634GU6RB-12
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View Datasheet →W634GU6RB-09
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View Datasheet →W634GU6RB12J
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View Datasheet →W634GU6RB11J
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View Datasheet →K4B4G1646E-BYMATCV
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View Datasheet →W634GU6RB-11 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Size | 4Gbit (256M x 16) |
| Interface | Parallel |
| Clock Frequency | 933 MHz |
| Data Rate | 1866 MT/s |
| CAS Latency | 20 ns |
| Supply Voltage | 1.35V (1.283V to 1.45V) |
| Package | 96-VFBGA (7.5x13 mm) |
| Operating Temperature | -40°C to +95°C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Halogen-Free | Yes |
| Auto Self-Refresh | Yes |
| Auto Precharge | Yes |
| Data Mask | Yes |
| Write Leveling | Yes |
| ZQ Calibration | Yes |
| Asynchronous Reset | Yes |
| Dynamic On-Chip Termination | Yes |
W634GU6RB-11 Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ8 — Data input/output 8 |
| Pin B3 | DQ9 — Data input/output 9 |
| Pin B4 | VDD — Power supply |
| Pin B5 | DQ10 — Data input/output 10 |
| Pin B6 | DQ11 — Data input/output 11 |
| Pin B7 | VSS — Ground |
| Pin B8 | DQ12 — Data input/output 12 |
| Pin B9 | DQ13 — Data input/output 13 |
| Pin B10 | VDDQ — I/O power supply |
| Pin B11 | DQ14 — Data input/output 14 |
| Pin B12 | DQ15 — Data input/output 15 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
W634GU6RB-11 is suitable for 6 applications: Networking Equipment, Industrial Computing, Embedded Systems, Consumer Electronics, Automotive Infotainment, Data Center Servers.
Networking Equipment
The W634GU6RB-11 provides high-density, low-power memory for routers and switches. Its 4Gb capacity and 1866 MT/s data rate support high-throughput packet processing and routing tables. The 1.35V operation reduces power consumption in always-on network infrastructure, while the -40°C to +95°C range ensures reliability in uncontrolled environments. The 96-ball VFBGA package fits compact line cards, and features like write leveling and ODT improve signal integrity on high-speed buses.
Recommended
Industrial Computing
In industrial PCs and embedded controllers, the W634GU6RB-11 offers reliable memory with a wide temperature range. Its 4Gb density supports complex control algorithms and data logging. The 1.35V supply reduces heat generation, critical in sealed enclosures. The 933 MHz clock enables fast data processing for real-time control. The VFBGA package withstands vibration, and features like auto self-refresh maintain data integrity during power fluctuations.
Recommended
Embedded Systems
The W634GU6RB-11 is ideal for embedded systems requiring high memory density in a small footprint. Its 96-ball VFBGA package saves PCB space, and the 1.35V operation is compatible with low-power embedded processors. The 1866 MT/s data rate supports multimedia applications. Features like ZQ calibration and ODT simplify PCB layout, reducing design time. The -40°C to +95°C range suits outdoor and automotive-adjacent applications.
Recommended
Consumer Electronics
For set-top boxes, smart TVs, and gaming consoles, the W634GU6RB-11 provides high-bandwidth memory for video processing and user interfaces. Its 4Gb capacity supports multiple HD streams, and the 1.35V supply reduces power consumption in always-on devices. The 933 MHz clock enables smooth graphics rendering. The compact VFBGA package fits slim enclosures, and features like data mask improve write efficiency.
Recommended
Automotive Infotainment
The W634GU6RB-11 supports automotive infotainment systems requiring high memory bandwidth for navigation and media playback. Its wide temperature range (-40°C to +95°C) meets automotive requirements, and the 1.35V supply reduces heat in the cabin. The 1866 MT/s data rate handles multiple displays and audio streams. Features like write leveling ensure reliable operation in noisy automotive environments. The VFBGA package is AEC-Q100 qualified in some variants.
Recommended
Data Center Servers
In data center servers, the W634GU6RB-11 provides high-density, low-power memory for virtualization and cloud computing. Its 4Gb capacity and 1866 MT/s data rate support high-performance computing. The 1.35V operation reduces energy costs in large server farms. The 96-ball VFBGA package enables high-density DIMM designs. Features like auto self-refresh and ODT improve reliability in 24/7 operation.
Recommended
Recommended Products Summary
Engineering reference data for W634GU6RB-11 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W634GU6RB11I | W634GU6RB-12 | K4B4G1646E-BYMATCV |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Clock Frequency | 933 MHz | 933 MHz | 800 MHz | 933 MHz |
| Data Rate | 1866 MT/s | 1866 MT/s | 1600 MT/s | 1866 MT/s |
| CAS Latency | 20 ns | 20 ns | 20 ns | 20 ns |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
Key Differentiators
- Industrial temperature range (vs W634GU6RB-12)
- Higher clock speed (vs W634GU6RB-12)
- Same-brand drop-in compatibility (vs K4B4G1646E-BYMATCV)
Design Notes
Ensure stable 1.35V supply with adequate decoupling. Place 0.1uF and 1uF ceramic capacitors close to each VDD and VDDQ pin. Use a low-ESR bulk capacitor (10uF) per power rail. Verify the power management IC can source the required current during burst operations.
Follow JEDEC DDR3L layout guidelines for signal integrity. Match trace lengths for DQ, DQS, and address/command signals. Maintain 50-ohm impedance for data lines. Use ground planes to minimize noise. Keep the VFBGA package's thermal pad connected to a large copper pour for heat dissipation.
Use on-die termination (ODT) settings to match the bus impedance. Enable write leveling for multi-rank configurations. Place series termination resistors near the driver if needed. Simulate the memory bus with IBIS models to verify signal integrity at 1866 MT/s.
Compliance Information
RoHS compliant and halogen-free per Winbond. AEC-Q100 not specified for this part.
