H5TC4G63AFR-PBR - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63AFR-PBR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9091 | $5,909.10 |
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View Datasheet →H5TC4G63AFR-PBR Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Organization | 256M x 16 |
| Total Capacity | 4Gb |
| Supply Voltage | 1.35V (1.5V compatible) |
| Data Rate | 1600 Mbps (PC3L-12800) |
| CAS Latency | 11 |
| tRCD/tRP | 11 |
| Clock Frequency | 800 MHz |
| tCK | 1.25 ns |
| tRCD | 13.125 ns |
| Burst Length | 8 (BL8) with burst chop (BC4) |
| Number of Banks | 8 |
| Refresh Interval | 7.8us at 85C, 3.9us at 95C |
| Package | 96-ball FBGA (PBGA96) |
| Package Dimensions | 13.5mm x 9.0mm |
| Ball Pitch | 0.8mm |
| I/O Interface | SSTL-15 |
| Operating Temperature | 0C to +95C |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
H5TC4G63AFR-PBR Pin Configuration
| Pin A1 | VDD — Power supply for core logic |
| Pin A2 | VSS — Ground |
| Pin A3 | DQ0 — Data input/output 0 |
| Pin A4 | DQ1 — Data input/output 1 |
| Pin A5 | VDDQ — Power supply for I/O |
| Pin A6 | VSSQ — Ground for I/O |
| Pin A7 | DQ2 — Data input/output 2 |
| Pin A8 | DQ3 — Data input/output 3 |
| Pin A9 | VDD — Power supply |
| Pin A10 | VSS — Ground |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ4 — Data input/output 4 |
| Pin B3 | DQ5 — Data input/output 5 |
| Pin B4 | VDDQ — Power supply for I/O |
| Pin B5 | VSSQ — Ground for I/O |
| Pin B6 | DQ6 — Data input/output 6 |
| Pin B7 | DQ7 — Data input/output 7 |
| Pin B8 | VDD — Power supply |
| Pin B9 | VSS — Ground |
| Pin B10 | DQS0 — Data strobe 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63AFR-PBR is suitable for 6 applications: Embedded Systems, Networking Equipment, Industrial PCs, Consumer Electronics, Automotive Infotainment, Medical Devices.
Embedded Systems
The H5TC4G63AFR-PBR is ideal for embedded systems requiring high-density, low-power memory. Its 4Gb capacity and 1.35V operation reduce power consumption by up to 20% compared to standard DDR3, making it suitable for battery-powered devices. The 256M x 16 organization simplifies board layout with fewer chips, and the 1600 Mbps data rate supports demanding real-time processing. The 96-ball FBGA package with 0.8mm pitch enables compact designs, while the JEDEC DDR3L compliance ensures compatibility with a wide range of embedded controllers.
Recommended
Networking Equipment
In networking equipment such as routers and switches, the H5TC4G63AFR-PBR provides high-bandwidth packet buffering and routing table storage. Its 1600 Mbps data rate and 8 internal banks enable efficient burst transfers, while the low 1.35V supply reduces thermal load in dense chassis. The on-die termination and programmable output driver impedance improve signal integrity on high-speed traces, critical for reliable operation in noisy environments. The device's support for write leveling and read leveling simplifies PCB design for multi-rank configurations.
Recommended
Industrial PCs
The H5TC4G63AFR-PBR is well-suited for industrial PCs that require reliable operation over extended temperature ranges. With an operating temperature of 0C to +95C, it meets the demands of factory automation and process control. The 4Gb capacity supports multitasking and data logging, while the 1.35V operation reduces power consumption in always-on systems. The device's temperature-compensated self-refresh (TCSR) and partial array self-refresh (PASR) features further enhance power efficiency, making it ideal for fanless industrial designs.
Recommended
Consumer Electronics
In consumer electronics like set-top boxes and smart TVs, the H5TC4G63AFR-PBR delivers high-speed memory for smooth video playback and responsive user interfaces. Its 1600 Mbps data rate ensures sufficient bandwidth for HD video streams, while the low 1.35V supply helps meet energy efficiency standards. The 96-ball FBGA package allows for slim device designs, and the device's support for burst length 8 with burst chop optimizes memory access patterns for multimedia workloads. The JEDEC DDR3L compliance ensures interoperability with mainstream SoCs.
Recommended
Automotive Infotainment
The H5TC4G63AFR-PBR is used in automotive infotainment systems for navigation, media playback, and connectivity. Its 4Gb capacity supports complex user interfaces and map data, while the 1.35V operation reduces power draw from the vehicle's electrical system. The device's wide operating temperature range (0C to +95C) covers typical cabin environments, and its robust signal integrity features ensure reliable operation in electrically noisy automotive environments. The JEDEC DDR3L compliance guarantees compatibility with automotive-grade SoCs.
Recommended
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the H5TC4G63AFR-PBR provides reliable high-speed memory for data acquisition and processing. Its 4Gb capacity supports large data buffers for imaging and waveform analysis, while the low 1.35V supply reduces heat generation in compact enclosures. The device's high reliability and long lifecycle make it suitable for medical applications where downtime is unacceptable. The 96-ball FBGA package with 0.8mm pitch enables dense PCB layouts, and the JEDEC DDR3L compliance ensures compatibility with medical-grade processors.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63AFR-PBR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63AFR-PBA | H5TC4G63AFR-PBI | H5TC4G63MFR-PBA | K4B4G1646E-BMK0 | MT41K256M16HA-125 | NT5CC256M16DP-DI |
|---|---|---|---|---|---|---|---|
| Package | 96-ball FBGA (PBGA96) | 96-ball FBGA (PBGA96) | 96-ball FBGA (PBGA96) | 96-ball FBGA (PBGA96) | 96-ball FBGA (PBGA96) | E: 96-ball FBGA (PBGA96) | 96-ball FBGA (PBGA96) |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung | E: Micron | Nanya |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM | DDR3L SDRAM | DDR3L SDRAM | DDR3L SDRAM | E: DDR3L SDRAM | DDR3L SDRAM |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | E: 256M x 16 | 256M x 16 |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | E: 1600 Mbps | 1600 Mbps |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | E: 1.35V | 1.35V |
| CAS Latency | 11 | 11 | 11 | 11 | 11 | E: 11 | 11 |
| Operating Temperature | 0C to +95C | 0C to +95C | -40C to +95C | 0C to +95C | 0C to +95C | E: 0C to +95C | 0C to +95C |
Key Differentiators
- Low-voltage operation (1.35V) reduces power consumption by 15-20% compared to standard DDR3 (vs K4B4G1646E-BMK0)
- Wide operating temperature range (0C to +95C) supports industrial applications (vs H5TC4G63AFR-PBI)
- JEDEC DDR3L compliance ensures broad compatibility (vs MT41K256M16HA-125:E)
Design Notes
The H5TC4G63AFR-PBR requires a stable 1.35V VDD and VDDQ supply. Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each VDD and VDDQ pin to minimize noise. A bulk capacitor (10uF) on the board is recommended. Ensure the power supply can handle peak current during refresh and burst operations.
Route DQ, DQS, and address lines with matched trace lengths to maintain signal integrity. Use controlled impedance of 50 ohms single-ended and 100 ohms differential for DQS. Keep trace lengths within 100 mils of each other to minimize skew. Place VREFCA and VREFDQ bypass capacitors (0.1uF) close to the pins.
The H5TC4G63AFR-PBR dissipates minimal power due to 1.35V operation, but in high-density systems, ensure adequate airflow or thermal vias under the FBGA package. The maximum operating temperature is 95C; keep the junction temperature below this limit by providing proper heat spreading on the PCB.
Compliance Information
RoHS compliant per internal database. Lead-free and halogen-free package. AEC-Q100 not specified for this part.
