10AX090R3F40E2LG - Arria 10 GX 900K LE FPGA | Intel | 1517-FCBGA
MPN: 10AX090R3F40E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7250 | $7,250.00 |
| 10 | $6980 | $69,800.00 |
| 100 | $6550 | $655,000.00 |
| 500 | $6100 | $3,050,000.00 |
| 1,000 | $5750 | $5,750,000.00 |
Drop-in alternatives for 10AX090R3F40E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090R2F40E2LG
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✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AX090R3F40I2LG
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View Datasheet →10AX090N3F40E2LG
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View Datasheet →10AX090R3F40E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/O Count | 342 |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Package | 1517-Ball FCBGA |
| Package Type | Flip-Chip Ball Grid Array |
| Mounting Type | Surface Mount |
| Number of Terminals | 1517 |
| Transceivers | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Hardened fixed/floating-point DSP blocks (on-die) |
| Memory Interfaces | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | Partial reconfiguration supported |
| RoHS Status | Compliant |
10AX090R3F40E2LG flip-chip ball grid array Pin Configuration Guide
Complete pinout information for 10AX090R3F40E2LG (flip-chip ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090R3F40E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090R3F40E2LG is suitable for 6 applications: 4G/5G Wireless Baseband Processing, Radar and Electronic Warfare (EW), Broadcast Video Encoder/Decoder, PCI Express Gen3 Accelerator Card, High-Speed Serial Interface Bridging, Test & Measurement Instrumentation.
4G/5G Wireless Baseband Processing
The 10AX090R3F40E2LG is well suited for 4G and 5G wireless baseband processing where 900K logic elements, 7.4 Mbytes of embedded M20K SRAM, and 342 user I/O provide the headroom for CPRI/eCPRI fronthaul, FFT/IFFT engines, and channel-codec acceleration. Its hard PCI Express Gen3 blocks pair naturally with baseband cards plugged into AdvancedTCA or ATX backplanes, while hardened DDR3/DDR4 controllers feed the multi-gigabit sample buffers required for LTE-A carrier aggregation and 5G NR sub-6 GHz signal chains. Compared with microcontrollers or DSP-only SoCs, the FPGA's massive parallelism delivers 10x-100x throughput per watt for baseband PHY-layer functions. Designers should size the PCB power tree to handle the multi-rail sequencing of 0.9 V core, 1.0/1.2 V transceiver, and 1.5/2.5/3.3 V auxiliary supplies.
Recommended
Radar and Electronic Warfare (EW)
The 10AX090R3F40E2LG's combination of 900K LEs, hardened floating-point capable DSP blocks, and multi-gigabit transceivers makes it a strong choice for radar and EW front-end processing. The fabric can implement thousands of FIR filters, beamforming weights, and pulse-compression correlators in parallel, while 59 Mbits of embedded SRAM buffer radar returns for moving-target indication (MTI) and SAR processing. The 1517-FCBGA package supports the high pin-count required to interface directly with wideband ADC/DAC front-ends over LVDS or JESD204B/C links, and Arria 10's hardened 10/40/100 GbE Ethernet IP enables direct-to-switch radar data distribution. Extended-industrial temperature grades and partial reconfiguration enable runtime mode-switching between surveillance and jamming waveforms on a single board.
Recommended
Broadcast Video Encoder/Decoder
The 10AX090R3F40E2LG is deployed in broadcast video encoder and decoder platforms that handle SD/HD/3G/6G/12G-SDI streams plus emerging IP-based SMPTE ST 2110 workflows. The 900K-LE fabric supports multiple simultaneous HEVC/H.264 encode or decode channels at 4K60 resolution, while 342 user I/O accommodate dozens of SDI inputs/outputs and redundant control interfaces. On-chip M20K memory blocks provide line-store buffers for deinterlacing and motion-estimation search windows, eliminating external SRAM and reducing BOM cost. Hardened 10/40 GbE Ethernet IP enables direct IP-network integration for IP-based broadcast studios, and partial reconfiguration allows hardware-accelerated codec switching on the fly without system downtime, a critical feature for live-production broadcast equipment.
Recommended
PCI Express Gen3 Accelerator Card
The 10AX090R3F40E2LG's hard PCI Express Gen3 IP blocks enable drop-in deployment on PCIe Gen3 x8 accelerator cards for data-center workloads such as machine-learning inference, computational storage, and database acceleration. Hard IP delivers lower latency and lower power than soft PCIe cores, freeing fabric resources for the actual application logic - critical when only 900K LEs are available. The 59 Mbits of embedded SRAM accelerate key-value caches and intermediate tensor data without round-tripping through external DRAM, while 342 user I/O accommodate HBM2 or DDR4 expansion memory and high-speed network interfaces. The 1517-FCBGA package's flip-chip construction maintains signal integrity on 8 GT/s PCIe lanes and multi-gigabit backplane links, making this FPGA a workhorse for production accelerator deployments in 2024-2026 hyperscaler fleets.
Recommended
High-Speed Serial Interface Bridging
The 10AX090R3F40E2LG serves as a multi-protocol serial bridge IC, simultaneously translating between PCIe Gen3, 10/40/100 GbE Ethernet, Interlaken, SATA, and legacy protocols such as Fibre Channel and SONET/SDH. The Arria 10 GX architecture provides hardened PCS and PMA layers for these protocols, so designers consume far fewer LEs for transceiver management and more for application-level bridging logic. With 900K LEs and 7.4 Mbytes of embedded SRAM, the device can implement deep packet buffers for cut-through switching and store-and-forward applications, eliminating external packet-memory chips. The 1517-FCBGA F40 footprint is shared with the Arria 10 GT family, allowing OEMs to migrate between GX and GT variants on the same PCB for cost-engineered product tiers.
Recommended
Test & Measurement Instrumentation
The 10AX090R3F40E2LG is used in test and measurement instrumentation including protocol analyzers, BERT (Bit Error Rate Testers), oscilloscopes with deep digital channels, and protocol-aware logic analyzers. Its 342 user I/O and high-speed transceivers enable simultaneous capture of multi-lane protocols such as 100 GbE, PCIe Gen3, USB 3.x, and SATA, while 900K LEs implement trigger logic, pattern generators, and protocol decoders. The 59 Mbits of embedded SRAM provide deep capture buffers at sample rates that exceed external memory bandwidth, and the FPGA's partial reconfiguration supports runtime protocol decode upgrades in the field without instrument recalibration. Designers targeting bench-top instruments value the Arria 10 GX family's robust design maturity and the mature Quartus Prime tool flow that minimizes time-to-market for new protocol decoder IP.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090R3F40E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090R2F40E2LG | 10AX090N3F40E2LG | 10AX090R3F40I2LG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GT | Arria 10 GX |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| User I/O | 342 | 342 | 342 | 342 |
| Speed Grade | -3 (fastest) | -2 (slower) | -3 (fastest) | -2 (slower) |
| Temperature Grade | E (extended industrial) | E (extended industrial) | E (extended industrial) | I (industrial) |
| Hard PCIe Gen3 IP | Yes | Yes | Yes | Yes |
| Approximate Unit Price (USD, qty-1) | 7250.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in Arria 10 GX family for this density (vs 10AX090R2F40E2LG)
- GX family member optimized for transceiver density (vs 10AX090N3F40E2LG)
- Extended industrial temperature grade with F40 package (vs 10AX090R3F40I2LG)
Design Notes
The Arria 10 GX family requires a multi-rail power tree: 0.9 V core, 1.0/1.2 V transceiver analog, 1.5/2.5/3.3 V auxiliary I/O, plus auxiliary supplies for HPS if used. Per the Intel Arria 10 GX datasheet, core current at 900K-LE utilization can exceed 20 A at full toggle rates - use a synchronous buck controller with at least 25 A peak capability and place input/output bulk capacitors within 100 mils of the FCBGA balls. Implement power-rail sequencing per Intel's Power Management Design Guidelines; failure to sequence can trigger latch-up. Estimated: at VIN=12 V, VOUT=0.9 V, and 20 A core load, regulator power dissipation is (12-0.9)*20 = 222 W - so the regulator's cooling solution must be sized accordingly.
The 1517-FCBGA package requires an 8-12 layer PCB with via-in-pad construction, laser-drilled microvias, and matched-length trace impedance (typically 50 ohm single-ended, 100 ohm differential). Per Arria 10 GX PCB design guidelines, every FCBGA ball should have a fanout via to inner layers, and the FPGA's ball-pitch dictates a 1.0 mm BGA pitch with 0.5 mm drill microvias. Solid ground and power planes must be continuous beneath the BGA to control return-current paths for the multi-gigabit transceivers, which operate at data rates up to 17.4 Gbps (PMA) per channel.
Do not assume all 342 user I/O are simultaneously available - the device's I/O count is allocated across LVDS pairs, regular I/O, and dedicated transceiver/clock pin functions per the device pin connection guidelines. Forgetting to constrain I/O standards in Quartus Prime can result in Quartus silently downgrading LVDS to LVCMOS and losing high-speed interface functionality. Also note that Arria 10 configuration via fast passive parallel (FPP) x32 mode requires a dedicated external flash, and the configuration scheme selected in the Quartus Prime pin planner must match the board schematic.
Compliance Information
RoHS and lead-free compliance per Altera/Intel FPGA product environmental documentation. AEC-Q100 is automotive-grade qualification - Arria 10 GX is not AEC-Q100 qualified; for automotive designs use Cyclone V or specific automotive-grade Cyclone 10 GX parts instead.
