10AX090R2F40E2SG - Arria 10 GX FPGA 900K LE | Intel
MPN: 10AX090R2F40E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6226.02 | $6,226.02 |
| 10 | $5800 | $58,000.00 |
| 50 | $5400 | $270,000.00 |
| 100 | $5050 | $505,000.00 |
| 500 | $4750 | $2,375,000.00 |
Drop-in alternatives for 10AX090R2F40E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090R2F40E1SG
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View Datasheet →10AX090R1F40I1SG
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View Datasheet →10AX090R2F40E2LG
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View Datasheet →10AX066N2F40E1SG
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View Datasheet →10AX090R2F40E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| LABs/CLBs | 339620 |
| Total RAM Bits | 59234304 |
| User I/O Count | 342 |
| Package Type | 1517-BBGA, FCBGA |
| Package Code | F40 (approx. 40mm FCBGA) |
| Speed Grade | 2 (R2 -2 transceiver rating) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) |
| Lead-Free / RoHS | Yes (SG suffix) |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) |
| DSP Blocks | Variable-precision, hardened floating-point capable |
| Process Node | TSMC 20nm |
| Mounting Type | Surface Mount (FCBGA ball grid) |
| MSL Level | 3 (168 Hours) |
| Packaging | Tray |
10AX090R2F40E2SG f40 (approx. 40mm fcbga) Pin Configuration Guide
Complete pinout information for 10AX090R2F40E2SG (f40 (approx. 40mm fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090R2F40E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090R2F40E2SG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, 4K Video Format Conversion and Bridging, Radar Signal Preprocessing, High-Speed Serial Protocol Bridging, ASIC Prototyping for Mid-Complexity Designs, Medical Imaging Reconstruction Pipeline.
Software-Defined Radio (SDR) Baseband
The 10AX090R2F40E2SG is a strong fit for SDR baseband processing because its 900K logic elements and hardened variable-precision DSP blocks deliver 1.5 TMACs of compute for FFT, channelization, and modulation/demodulation. With transceivers up to 14.1 Gbps and 342 I/Os, the device interfaces to multi-antenna RF front-ends and high-bandwidth ADC/DAC sample streams. In typical deployments the FPGA sits between a wideband ADC and a host CPU/GPU, performing real-time OFDM demodulation or beamforming. The 1517-ball FCBGA provides the I/O density needed for parallel LVDS ADC data capture plus multiple 10GbE links back to the host processor.
Recommended
4K Video Format Conversion and Bridging
Arria 10 GX devices like the 10AX090R2F40E2SG are widely deployed in broadcast video infrastructure for 4K/UHD format conversion, scaling, and protocol bridging (HDMI 2.0, DisplayPort 1.4, SDI). The 900K logic elements support multi-stream scaling engines, color-space conversion, and frame-buffer management in external DDR4. Transceivers handle SDI (up to 12G-SDI) and HDMI/DP serialized streams while 342 I/Os interface to parallel video buses and external memory controllers. The E2 temperature grade supports the operating ranges of broadcast studio and outdoor LED-wall environments.
Recommended
Radar Signal Preprocessing
The 10AX090R2F40E2SG serves as a real-time radar preprocessing engine in phased-array and SAR systems, where its 900K logic elements and floating-point-capable DSP blocks perform pulse compression, MTI filtering, and CFAR detection. The -2 transceiver rating supports digital IF sampling links from ADC ASICs at rates up to 14.1 Gbps, while 342 user I/Os provide antenna-element digital control interfaces. The extended E2 temperature range allows deployment in outdoor radar installations and military/aerospace platforms where junction temperatures can exceed commercial-grade limits during high-utilization DSP workloads.
Recommended
High-Speed Serial Protocol Bridging
In datacenter and telecom equipment, the 10AX090R2F40E2SG bridges between PCIe Gen3, 10/40 Gigabit Ethernet, Serial RapidIO, and proprietary serial protocols. Hardened PCIe Gen3 IP cores and 14.1 Gbps transceivers eliminate soft-IP timing closure risk, while 342 I/Os handle parallel side-channels and management interfaces. The device typically sits on a carrier card as a fan-out bridge between a host CPU and multiple line-card ASICs, providing protocol conversion, packet buffering, and clock-domain crossing in a single chip.
Recommended
ASIC Prototyping for Mid-Complexity Designs
The 10AX090R2F40E2SG is a popular ASIC prototyping platform for designs in the 5M-15M ASIC-gate range. Its 900K logic elements, abundant block RAM, and 342 I/Os map well to mid-complexity SoCs and can host multiple ASIC partitions in parallel with FPGA-to-FPGA child-card expansion via serial transceivers. Quartus Prime TimeQuest timing analysis and the Arria 10 partial reconfiguration flow allow designers to swap in RTL revisions quickly during bring-up, while the 1517-ball FCBGA exposes enough user I/O to bring out most ASIC peripheral interfaces for system-level validation.
Recommended
Medical Imaging Reconstruction Pipeline
In CT, MRI, and ultrasound systems, the 10AX090R2F40E2SG accelerates image reconstruction algorithms such as filtered backprojection and iterative reconstruction. Its 900K logic elements and floating-point DSP blocks deliver the parallel compute needed for real-time 3D volume reconstruction at clinical frame rates. Transceivers accept raw data streams from multi-element detector arrays at up to 14.1 Gbps per lane, while 342 user I/Os interface to LVDS data acquisition ADCs and external DDR4 memory buffers. The E2 temperature range supports operation in the controlled environment of medical imaging carts and stationary scanners.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090R2F40E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090R2F40E1SG | 10AX090R1F40I1SG | 10AX090R1F40E1SG | 10AX090R2F40E2LG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FCBGA (F40) | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same | 1517-BBGA FCBGA (F40) - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 660000 |
| User I/O Count | 342 | 342 | 342 | 342 | 342 | [DATA_NEEDED] |
| Total RAM Bits | 59234304 | 59234304 | 59234304 | 59234304 | 59234304 | [DATA_NEEDED] |
| Speed Grade | -2 (R2) | -1 (slower) | -1 (slower) | -1 (slower) | -2 (same) | -2 (same) |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | E2 (same) | I1 (Industrial) | E1 (Commercial) | E2 (same) | E1 (Commercial) |
| Transceiver Rate | Up to 14.1 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 14.1 Gbps | Up to 12.5 Gbps |
| RoHS / Lead-Free Suffix | SG (lead-free RoHS) | SG (same) | SG (same) | SG (same) | LG (alternate finish) | SG (same) |
Key Differentiators
- 900K logic elements in same F40 footprint as 660K tier (vs 10AX066N2F40E1SG)
- -2 speed grade with 14.1 Gbps transceivers (vs 10AX090R2F40E1SG)
- E2 extended temperature for ruggedized applications (vs 10AX090R1F40E1SG)
Design Notes
The 1517-ball FCBGA package requires a high-layer-count PCB (typically 12+ layers) with microvia or stacked-via technology for breakout routing. Transceiver channels demand 85-100 ohm differential impedance control with matched trace lengths within 5 mils. Reference the Altera Arria 10 GX PCB Design Guidelines for via pattern, antipad geometry, and decoupling capacitor placement recommendations specific to the F40 package.
Estimated: At typical utilization (80% logic, 70% DSP, all transceivers active at 10 Gbps), the 10AX090R2F40E2SG consumes 15-25W from 0.9V SmartVID core plus transceiver supplies. SmartVID dynamically adjusts core voltage from 0.85V to 0.95V based on silicon speed bin. Provide at least 4 voltage rails (VCC, VCCPT, VCCA_FPLL, VCCIO_x) with bulk decoupling and a power-sequencing controller to meet Arria 10 power-up requirements.
The E2 temperature grade allows junction temperature up to 100C, but most designs should target Tj <= 85C for long-term reliability. With FCBGA packages, thermal management depends heavily on PCB copper area and airflow. A 4x4 BGA footprint with full ground via array beneath the exposed die gives theta_J-A of approximately 10-15 C/W with adequate airflow; without airflow or with limited copper, junction can exceed safe limits at high utilization.
Common pitfalls when designing with the 10AX090R2F40E2SG include: (1) failing to assign transceiver reference clock pins correctly - refer to the pinout file for your exact OPN; (2) exceeding the maximum of 24 transceiver channels per bank; (3) ignoring MSL3 moisture sensitivity and skipping bake-out before reflow; (4) using the wrong Quartus Prime device library revision for the -2 speed grade. Always validate the pinout against the Quartus Prime Pin Planner before PCB fab.
Compliance Information
RoHS compliant per SG suffix in OPN. Not AEC-Q100 qualified (automotive qualification not typically pursued for high-end FPGAs; consult Intel automotive-grade roadmap if required). Halogen-free status not explicitly stated in verified data.
