10AX115N2F40I1SG - Arria 10 GX FPGA, 1.15M LE, 1517-BGA | Intel
MPN: 10AX115N2F40I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3950 | $1,975,000.00 |
| 1,000 | $3720 | $3,720,000.00 |
Drop-in alternatives for 10AX115N2F40I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115N2F40I2SG
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View Datasheet →10AX115N2F40I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| DSP Blocks | 3,036 |
| Transceivers | Up to 24 channels at up to 17.4 Gbps |
| Hard PCIe Gen3 Controllers | Yes, up to Gen3 x8 |
| Hard 10 Gbps Ethernet MACs | Yes (10GBASE-R/KR) |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDR IV, RLDRAM 3) |
| Fractional PLLs | 6 |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Transceiver Supply Rails | 0.95 V and 1.03 V |
| Package | 1517-ball FC-FBGA, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial |
| Bitstream Encryption | Yes (AES-256) |
| RoHS Status | Compliant |
10AX115N2F40I1SG 1517-ball fc-fbga, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115N2F40I1SG (1517-ball fc-fbga, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N2F40I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N2F40I1SG is suitable for 6 applications: 5G LTE Baseband and Fronthaul, Broadcast Video Processing (4K/8K UHD), High-Performance Data Acquisition, Military Radar Signal Processing, ASIC Prototyping, PCI Express Gen3 Endpoint / Root Port Cards.
5G LTE Baseband and Fronthaul
The 10AX115N2F40I1SG is well suited to 5G LTE and LTE-Advanced baseband processing because of its 3,036 variable-precision DSP blocks, which can be configured for 18x19 or 27x27 multiplication needed for matrix inversion, FFT, and channel estimation. The 24 transceivers at up to 17.4 Gbps support CPRI and the emerging eCPRI fronthaul interfaces at 9.83 Gbps and 24.33 Gbps with oversampling, while hardened 10 Gbps Ethernet MACs reduce soft logic for backhaul. Industrial temperature grade (-40C to +100C) allows deployment in outdoor remote-radio-head enclosures. The 1.15 M LE capacity comfortably fits a 4x4 or 8x8 MIMO layer 1 map plus L2 scheduling, and the two hard memory controllers support DDR4 with ECC for HARQ buffers.
Recommended
Broadcast Video Processing (4K/8K UHD)
For 4K and 8K ultra-high-definition broadcast workflows, the 10AX115N2F40I1SG delivers the DSP density and memory bandwidth required for HEVC/H.265 decoding, HDR tone-mapping, and multi-stream SDI/SMPTE 2110 aggregation. Its 68,857,856 bits of embedded memory buffer frame lines without external SDRAM, while two hard DDR4 controllers sustain multi-stream 12G-SDI input at up to 12 Gbps per link. The industrial temperature grade is critical in OB truck and outdoor broadcast deployments. The PCIe Gen3 x8 hardened controller connects to host CPUs or video-over-IP network interface cards with minimal soft logic overhead.
Recommended
High-Performance Data Acquisition
Data-acquisition systems digitizing radar, lidar, or scientific instruments benefit from the 10AX115N2F40I1SG's 24 transceivers running JESD204B/C at up to 17.4 Gbps, enabling multi-channel ADC and DAC aggregation. The DSP blocks implement FIR filtering, digital down-conversion, and pulse compression at rates unattainable in CPU or GPU hosts. Industrial temperature supports outdoor sensor enclosures and field-deployable instrumentation. Internal M20K SRAM blocks buffer ADC samples between DMA bursts, and Quartus Platform Designer stitches together the JESD204B IP with the transceiver PHY in hours rather than weeks.
Recommended
Military Radar Signal Processing
Phased-array radar signal chains require beamforming across hundreds of elements with deterministic latency, which the 10AX115N2F40I1SG's combination of 3,036 DSP blocks and 24 transceivers addresses. The 17.4 Gbps transceivers carry digitized antenna data from RF front-end ADCs into the FPGA, where DSP blocks implement phase shifting, windowing, and pulse-Doppler FFTs in real time. Industrial temperature grade meets MIL-STD-810G environment envelopes for unconditioned shelters. Bitstream AES-256 encryption and anti-tamper features protect mission-critical waveforms in the field.
Recommended
ASIC Prototyping
The 10AX115N2F40I1SG is widely used for ASIC prototyping because its 1.15 M LE capacity and 3,036 DSP blocks map directly onto RTL blocks of moderate-complexity ASICs. Industrial temperature allows validation in realistic system environments, and the PCIe Gen3 and 10 GbE hard IP let engineers connect real host drivers during bring-up. Quartus Prime's incremental compile and partial reconfiguration cut iteration time when iterating RTL against a stable hardware shell. The 20 nm process power efficiency enables long-running emulation sessions without thermal throttling.
Recommended
PCI Express Gen3 Endpoint / Root Port Cards
PCI Express Gen3 add-in cards for accelerator, storage, or instrumentation applications leverage the 10AX115N2F40I1SG's hard PCIe Gen3 x8 controller to deliver up to 8 Gbps per lane without consuming soft logic. The 24 transceivers provide margin for additional Gen3 x4 links, SATA, or 10 GbE side channels. Industrial temperature supports server-room edge deployments and industrial PCs. Quartus Prime generates a complete PCIe root complex or endpoint reference design with MSI-X, AER, and SR-IOV support out of the box.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F40I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F40I2SG | 10AX115N2F40E1SG | 10AX115N1F40I1SG |
|---|---|---|---|---|
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | 1 (standard) | 2 (faster Fmax) | 1 (standard) | 1 (standard) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| Transceivers | Up to 24 at 17.4 Gbps | Up to 24 at 17.4 Gbps | Up to 24 at 17.4 Gbps | Up to 16 at 17.4 Gbps (-33%) |
| Embedded Memory Bits | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| DSP Blocks | 3,036 | 3,036 | 3,036 | 3,036 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Highest speed grade (1) with industrial temp in F40 package (vs 10AX115N2F40I2SG)
- Industrial temperature grade for outdoor deployments (vs 10AX115N2F40E1SG)
- Full N2 transceiver count for high-density serial aggregation (vs 10AX115N1F40I1SG)
Design Notes
The 10AX115N2F40I1SG requires a multi-rail power supply with at least 0.9 V core, 0.95 V and 1.03 V transceiver rails, and 1.2 V to 3.0 V I/O bank supplies per Intel's Arria 10 device datasheet. Estimated: at typical utilization (60% LE, 50% DSP, 12 transceivers active) the device draws approximately 18-22 W, requiring a switching regulator capable of 25 A continuous on the core rail with output ripple below 20 mVpp to avoid PSRR-induced jitter. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet to refine current budget before committing to a power-tree design.
The 1517-ball FC-FBGA at 1.0 mm pitch requires PCB laminate with low-Dk/Df properties such as Megtron 6 or FR-4 with high Tg (>150C) per Intel packaging guidelines. Microvia stacking in a 1-2-6 or 1-2-6-2 stack-up is recommended for transceiver break-out routing. Estimated: trace lengths from FPGA ball to transceiver connector should be kept under 25 mm with 85-ohm differential impedance; length matching within 5 mil per pair and within 50 mil across the channel to limit intra-pair and inter-pair skew below the transceiver's budget.
The FC-FBGA exposes the die through the top of the package, allowing direct attachment of a heatsink or cold plate using thermal interface material with conductivity above 3 W/mK. Estimated: at 20 W dissipation and 25 C ambient, junction temperature rises roughly 25-30 C with a properly mounted aluminum heatsink of 30 cm^2 surface area, well below the 100 C industrial limit. For chassis-conducted cooling, integrate a thermal pad with 0.5 mm thickness and ensure a mounting clip applies 15-20 lbf pressure to avoid warping the BGA balls.
Do not apply power to the 10AX115N2F40I1SG without first confirming the configuration mode is set; misconfigured MSEL pins can latch the device into a state that only JTAG can recover. Transceiver channels require AC-coupling capacitors on each serial line - omitting them prevents link-up regardless of FPGA bitstream content. I/O bank VCCIO must be applied before VCCPD; reverse sequencing can trigger latch-up and permanent damage. Always use Intel's programming file generator to produce a .pof for Active Serial configuration with the correct compression and encryption options.
Compliance Information
RoHS and REACH compliant per Intel product environmental compliance documentation. Lead-free SAC405 solder balls. AEC-Q100 not applicable (FPGA is not an automotive-grade discrete). Halogen-free per JEDEC JS709B.
