10CL016YF484C8G - Cyclone 10 LP FPGA, 15K LEs, 484-FBGA | Intel
MPN: 10CL016YF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.75 | $20,750.00 |
Drop-in alternatives for 10CL016YF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YF484C6G
✅ Drop-In✓ In Stock
$40.15 / Unit
View Datasheet →10CL016YF484I7G
✅ Drop-In✓ In Stock
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View Datasheet →10CL016YF484C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory Bits | 516,096 |
| Embedded Memory (Kb) | 504 Kb |
| Embedded Multipliers (18x18) | 56 |
| General Purpose I/Os | 340 |
| User I/O Banks | 8 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Package | 484-ball FBGA (UBGA, F484) |
| Ball Pitch | 1.0 mm |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration Modes | JTAG, AS, PS |
| Bitstream Encryption | AES-256 (optional) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
10CL016YF484C8G 484-ball fbga (ubga, f484) Pin Configuration Guide
Complete pinout information for 10CL016YF484C8G (484-ball fbga (ubga, f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YF484C8G is suitable for 6 applications: Industrial Machine Vision Gateways, Video Format Conversion Bridges, Factory Automation I/O Expansion, Low-Power IoT Edge Gateways, Motor Control DSP Front-Ends, Consumer Display Controllers.
Industrial Machine Vision Gateways
The 10CL016YF484C8G fits industrial machine vision gateways by aggregating multiple MIPI CSI-2 or parallel camera streams and pre-processing them in hardware before forwarding to a host CPU. Its 15,408 logic elements and 56 embedded 18x18 multipliers support real-time Bayer demosaicing, lens-shading correction, and object detection preprocessing at 30-60 fps. The 340 user I/Os provide ample GPIO for trigger inputs, lighting strobes, encoder feedback, and gigabit Ethernet PHYs. Compared to running equivalent pipelines on a Cortex-A CPU, the FPGA offload reduces latency to under 5 ms per frame. Designers pair it with an external DDR3 memory on the hard memory controller for line-buffer storage, and program the bitstream via JTAG or Active Serial flash on production boards.
Recommended
Video Format Conversion Bridges
For video format conversion between HDMI, MIPI DSI, LVDS, and parallel RGB interfaces, the 10CL016YF484C8G provides the I/O count, programmable logic density, and DSP blocks needed in a single chip. Its 8 I/O banks with selectable 1.2 V to 3.3 V VCCIO allow direct connection to HDMI level shifters, MIPI PHYs, and TTL displays without external translation. The 56 multipliers handle chroma upscaling, color-space conversion (RGB to YCrCb), and scaling factor interpolation. Compared to a fixed-function bridge IC, the FPGA-based approach supports multiple input/output combinations via firmware updates, reducing SKUs. Designers use Quartus Prime Lite with the Video and Image Processing Suite IP to accelerate design entry.
Recommended
Factory Automation I/O Expansion
The 10CL016YF484C8G serves as a flexible industrial I/O expander for PLC and PAC systems, offering 340 GPIO distributed across 8 banks to interface 24 V field wiring via opto-isolators and bidirectional logic. With 4 PLLs and 20 global clock networks, the device supports multiple PROFIBUS, EtherCAT, or CAN-FD protocol stacks simultaneously on independent clock domains. The 1.2 V core plus selectable VCCIO reduces power budget by ~30% versus older Cyclone IV designs of similar density, which is critical for DIN-rail mounted equipment with limited thermal headroom. The commercial 0C to +85C rating covers most indoor factory environments; for outdoor or unheated cabinets, the pin-compatible 10CL016YF484I7G industrial variant extends operation to -40C to +100C.
Recommended
Low-Power IoT Edge Gateways
Battery- and PoE-powered IoT edge gateways benefit from the 10CL016YF484C8G's low static power (~25-75 mW typical) combined with programmable logic that can wake, process sensor bursts, and return to sleep on schedule. The 15,408 LEs accommodate LoRaWAN packet handling, BLE baseband pre-processing, and SD card file-system management in a single FPGA fabric. Compared to a microcontroller + companion radio approach, the FPGA consolidates peripherals and reduces BOM by 4-6 ICs. The 484-FBGA package is overkill for very small form factors but fits well in Pi-HAT-sized gateways with PoE+ power budgets. Designers use Quartus Prime power optimization settings and clock-gating to push quiescent power below 50 mW.
Recommended
Motor Control DSP Front-Ends
The 10CL016YF484C8G implements field-oriented control (FOC) and space-vector PWM for multi-axis motor drives, using its 56 embedded 18x18 multipliers for fast Clarke and Park transforms at switching frequencies up to 50 kHz. The 340 I/Os support multiple encoder inputs (QEP, SSI, BiSS-C), PWM outputs, and current-sense ADCs per axis, while the 4 PLLs synthesize independent clock domains for each motor control loop. Compared to a software-only solution on a Cortex-M4, the FPGA reduces loop latency by 5-10x, enabling higher switching frequency and reduced torque ripple. The hard memory controller offloads current-loop sample storage to external DDR3, freeing logic for additional axes.
Recommended
Consumer Display Controllers
The 10CL016YF484C8G serves as a flexible LED video-wall controller and digital-signage timing generator, providing enough logic density for 4K-to-8K scaling engines and enough I/O to drive multiple LVDS or eDP output channels. The 56 hardware multipliers accelerate scaling and sharpening filters, while the 8 selectable VCCIO banks allow direct connection to LVDS panels, eDP TCONs, and TTL/LVCMOS displays. Designers prefer the FPGA over fixed-function TCONs because the same hardware can be repurposed across product SKUs with firmware-only changes. Quartus Prime Lite's free licensing supports this commercial temperature device, keeping NRE costs low for consumer applications.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YF484C6G | 10CL016YF484I7G | 10CL010YU256C8G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 256-ball UBGA - different |
| Logic Elements | 15,408 | 15,408 | 15,408 | 10,320 |
| User I/Os | 340 | 340 | 340 | 176 |
| Embedded Memory (Kb) | 504 | 504 | 504 | 414 |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 46 |
| Speed Grade | 8 | 6 (faster) | 7 | 8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Key Differentiators
- Lowest static power in its density class within the Cyclone family (vs EP4CE15F23C8N (Cyclone IV E))
- Industrial temperature drop-in available without PCB redesign (vs 10CL016YF484C8G vs 10CL016YF484I7G)
- Free Quartus Prime Lite software support (vs Xilinx XC6SLX16 (Spartan-6))
Design Notes
Estimated: At typical utilization (50% LE, 25% toggle rate, 60C ambient), the 10CL016YF484C8G dissipates approximately 0.6-0.9 W. The F484 FBGA package theta_JA is approximately 18 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 11-16C above ambient. Ensure PCB has continuous GND planes under the BGA and at least 4 thermal vias in a 3x3 array beneath the die for adequate heat spreading.
The 484-ball FBGA package uses a 1.0 mm ball pitch. Use 0.4 mm via-in-pad with filled-and-capped plating for break-out on top layers; route signals on internal layers with micro-via stack-ups. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs. Add at least 8 decoupling capacitors (4 x 100 nF, 2 x 10 uF, 2 x 100 uF) distributed around the package periphery, placed within 2 mm of the supply balls.
Power sequencing: VCCINT (1.2 V) must reach 70% of nominal before VCCIO banks are driven, and VCCPD must be present before or simultaneously with the slowest VCCIO bank. Reverse sequencing can cause latch-up. Use a dedicated power sequencer IC such as the LM3880 or TI TPS3808 to enforce correct order. The PowerPlay Early Power Estimator in Quartus Prime Lite provides accurate rail sizing during design entry.
Do not assume the C8 (speed grade 8) timing bin meets timing for designs that close at C6. Always run fitter with 'Slow 1100 mV 85C' corner for commercial temperature. Also note: the JTAG TCK pin is not 5 V tolerant on Cyclone 10 LP - use a 3.3 V JTAG programmer such as the USB-Blaster II or FT232HL-based clone. Mismatched VREF for SSTL I/O standards will cause read errors on DDR3 interfaces.
Compliance Information
RoHS6 compliant per DigiKey product listing. Commercial temperature grade only; AEC-Q100 not applicable. Intel/Altera publishes CMADS Conflict Minerals declaration.
