10CL016YF484C6G - Cyclone 10 LP FPGA 16K LE | Intel | BGA-484
MPN: 10CL016YF484C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $56.4 | $56.40 |
| 10 | $52.1 | $521.00 |
| 100 | $47.85 | $4,785.00 |
| 500 | $43.6 | $21,800.00 |
| 1,000 | $40.15 | $40,150.00 |
Drop-in alternatives for 10CL016YF484C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YF484C8G
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →10CL016YF484I7G
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →10CL016YF484I6G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL016YF484C6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory (bits) | 516,096 |
| Embedded 18x18 Multipliers | 56 |
| Maximum User I/Os | 340 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Package | 484-ball FBGA (F484) |
| Process Node | 60 nm low-power |
| Core Voltage (VCCINT) | 1.0 V (typical) |
| I/O Voltage Standards | LVDS, LVCMOS, SSTL, HSTL (1.2 V to 3.3 V) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | 6 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10CL016YF484C6G 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10CL016YF484C6G (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YF484C6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YF484C6G is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, LED Display Controller, Machine Vision Preprocessor, IoT Edge Aggregation Gateway, Software-Defined Radio Front-End.
Industrial Motor Control
The 10CL016YF484C6G fits industrial motor control with its 56 embedded 18x18 multipliers handling field-oriented control (FOC) math, four PLLs generating the multi-phase PWM clocks, and 340 user I/Os accommodating simultaneous encoder, Hall-sensor, and gate-driver interfaces. Its 60 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures where heatsinking is impractical. The -6 commercial speed grade delivers deterministic Fmax across vector-rotation loops and ADC-synchronized current-sampling windows. Estimated: at 100 MHz logic clock with typical FOC utilization (~70% LE), the device draws under 0.5 W dynamic power.
Recommended
Video Processing Pipeline
The 10CL016YF484C6G serves as a cost-optimized video bridge, converting parallel ITU-R BT.656 or MIPI-CSI streams into processed output for LCD controllers. The 15,408 LEs handle line buffers in distributed RAM plus a scaling engine in DSP blocks, while 516 Kbits of embedded SRAM absorb scan-line data without external SDRAM. The F484 BGA's 340 I/Os provide ample headroom for 24-bit parallel RGB plus control signaling. Designers can scale density down to 10CL010 for lower-resolution targets.
Recommended
LED Display Controller
The 10CL016YF484C6G drives large RGB-LED matrices by combining its 56 multipliers for gamma correction and color-space conversion with 340 I/Os split across chained HUB75 connectors. The 60 nm low-power silicon enables fanless outdoor cabinet operation across commercial temperature ranges. On-die SRAM stores lookup tables for brightness curves, eliminating external memory. Per-bank VCCIO simplifies mixing 5 V HUB75 drivers with 3.3 V processor-side links on the same board.
Recommended
Machine Vision Preprocessor
The 10CL016YF484C6G acts as a front-end preprocessor in line-scan or area-scan machine vision, performing Bayer demosaicing, thresholding, and ROI extraction before forwarding compressed results to a host CPU. Its 15,408 LEs support Sobel or Laplacian edge-detection kernels, while embedded 18x18 multipliers accelerate convolution at line rate. Eight I/O banks accept mixed 1.8 V LVCMOS sensor data and 3.3 V GPIO camera trigger signals without level shifters. Cyclone 10 LP's low static current suits PoE-powered camera enclosures.
Recommended
IoT Edge Aggregation Gateway
The 10CL016YF484C6G aggregates multiple industrial protocols (Modbus RTU, CAN, RS-485, I2C, SPI) into a unified uplink stream, using its 56 multipliers for CRC and encryption offload and 340 I/Os for high-port-count concentrator designs. The low-power 60 nm process keeps thermal envelope small for DIN-rail mounted gateways, while the commercial temperature grade suits indoor enclosures. Quartus Prime Lite's free licensing makes this build economically viable for sub-USD 50 BOM gates.
Recommended
Software-Defined Radio Front-End
The 10CL016YF484C6G implements the digital downconversion and channelization stage in narrow-band SDR receivers, leveraging 56 multipliers for FIR filtering and FFT butterfly operations. Its four PLLs generate independent sample clocks for ADC and DAC interfaces. The 340 I/Os interface to high-speed LVDS ADC pairs while also providing GPIO for tuner control. Designers targeting lower IF bandwidth can migrate to the 10CL006 family to reduce BOM cost while preserving the F484 footprint.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YF484C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YF484C8G | 10CL016YF484I7G | 10CL016YF484I6G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 |
| Speed Grade | -6 | -8 (faster) | -7 | -6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 516,096 | 516,096 | 516,096 | 516,096 |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 |
| Maximum User I/Os | 340 | 340 | 340 | 340 |
| Configuration Flash (typical) | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 | EPCS16 / EPCQ16 |
Key Differentiators
- Higher density than the 10CL010 family (vs 10CL010YU256C8G)
- F484 BGA maximizes I/O density within the Cyclone 10 LP family (vs 10CL016YE144I7G (E144 EQFP))
- Commercial-temperature -6 speed grade balances cost and performance (vs 10CL016YF484C8G)
Design Notes
The F484 FineLine BGA uses 1.0 mm ball pitch, which mandates microvia (laser-drilled) PCB technology with at least a 4-2-4 or 4-4-4 stack-up for clean breakout. Estimated: each signal via consumes roughly 0.5 mm of routing channel, so power and ground islands must be planned before signal fan-out. Reference Intel AN 583 (Designing with FineLine BGA packages) for via-in-pad and dog-bone fan-out trade-offs. A solid GND plane on layer 2 directly beneath the BGA is critical for return-path integrity.
Decouple the 1.0 V VCCINT rail with one 100 uF bulk capacitor plus ten 10 uF X5R ceramics distributed around the BGA perimeter. Estimated: at typical toggle rates (~30% of LEs active) the core draws roughly 200-400 mA, so the regulator headroom (dropout) must be sized accordingly. Sequence VCCINT before VCCPD and VCCIO to avoid POR latch-up; Intel's Power Sequencing chapter shows the supported ordering. Use ferrite beads on each VCCIO bank to isolate switching noise.
A common pitfall is omitting the MSL3 moisture-sensitive pre-bake before reflow, which causes internal delamination during solder attachment. Another is configuring VCCIO of an unused bank to 0 V while neighboring banks drive 3.3 V outputs through the shared ESD structure - this can back-power the inactive bank and cause POR failures. Finally, never tie JTAG TCK to a free-running clock; Intel recommends a 10 kohm pull-down to keep the TAP controller in bypass during free run.
Compliance Information
RoHS and REACH compliance per Intel material declaration. AEC-Q100 not offered for the commercial C6G OPN - select an automotive-qualified Cyclone 10 LP variant for vehicle applications. MSL3 moisture sensitivity per JEDEC J-STD-020.
