10CL025YU256C8G - Cyclone 10 LP FPGA, 25K LE, 256-BGA | Intel
MPN: 10CL025YU256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $50.89 | $50.89 |
| 10 | $45.8 | $458.00 |
| 100 | $40.71 | $4,071.00 |
| 500 | $36.62 | $18,310.00 |
| 1,000 | $32.54 | $32,540.00 |
Drop-in alternatives for 10CL025YU256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL025YU256C6G
✅ Drop-In✓ In Stock
$25.6 / Unit
View Datasheet →10CL025YU256A7G
✅ Drop-In✓ In Stock
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View Datasheet →10CL016YU256C8G
✅ Drop-In✓ In Stock
$10.87 / Unit
View Datasheet →10CL016YU256C6G
✅ Drop-In✓ In Stock
$23.75 / Unit
View Datasheet →10CL016YU256A7G
✅ Drop-In✓ In Stock
$24.9 / Unit
View Datasheet →10CL025YU256C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone® 10 LP |
| Series | 10CL025 |
| Logic Elements | 24,624 |
| Total RAM Bits | 608,256 |
| User I/O Count | 150 |
| Package | 256-LFBGA / UFBGA (U256) |
| Package Dimensions | 14 mm x 14 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount |
| Lead Shape | Ball |
| Pin Count | 256 |
| Configuration | Serial / Parallel |
| Embedded Multipliers | 66 (18x18) |
| PLLs | 4 |
| Static Power | 25 mW (typical) |
| RoHS Status | Compliant |
10CL025YU256C8G 14 mm x 14 mm Pin Configuration Guide
Complete pinout information for 10CL025YU256C8G (14 mm x 14 mm package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL025YU256C8G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL025YU256C8G is suitable for 7 applications: Industrial I/O Expansion, Motor Control Front-End, Video Bridging and Format Adaptation, Sensor Fusion Hub, Low-Cost PCIe Endpoint Card, Discrete Glue Logic Replacement, Communication Protocol Bridge.
Industrial I/O Expansion
The 10CL025YU256C8G is well suited for industrial I/O expansion modules where 24,624 logic elements can implement multiple communication protocols (Modbus, RS-485, CAN, SPI, I2C) and 150 user I/O pins deliver enough headroom for opto-isolated inputs, relay outputs, and fieldbus transceivers. The 1.2V core voltage reduces thermal dissipation compared to legacy FPGAs, enabling fanless DIN-rail enclosure designs. Pair with the MAX1300 ADC for analog front-end monitoring.
Recommended
Motor Control Front-End
The 10CL025YU256C8G provides deterministic hardware parallelism ideal for Field-Oriented Control (FOC) and stepper motor commutation loops. Its 66 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID loops at sub-microsecond latency, while the 4 general-purpose PLLs synthesize the precise PWM switching frequencies required by IGBT/MOSFET gate drivers. The 150 I/O count supports multi-axis encoder feedback and resolver excitation simultaneously.
Recommended
Video Bridging and Format Adaptation
The 10CL025YU256C8G can implement real-time video bridging between MIPI CSI-2, LVDS, parallel RGB, and HDMI interfaces, leveraging its hardware parallelism for pixel-rate processing without software bottlenecks. The 608 Kbits of embedded RAM supports line buffers and frame synchronization FIFOs, while 150 I/O lanes accommodate multi-channel parallel video buses. This makes the part suitable for industrial cameras, medical imaging, and HMI display controllers.
Recommended
Sensor Fusion Hub
In sensor fusion applications, the 10CL025YU256C8G aggregates IMU, magnetometer, barometric, and GNSS data streams, running Kalman filter algorithms in hardware that would overwhelm a microcontroller. The 24,624 logic elements accommodate full sensor interfaces, while the 66 multipliers accelerate matrix operations required for 9-DoF fusion. Low static power of 25 mW enables battery-powered IoT and wearable designs with always-on sensor processing.
Recommended
Low-Cost PCIe Endpoint Card
The Cyclone 10 LP architecture supports a hard PCIe Gen2 IP core that the 10CL025YU256C8G can implement as a single-lane endpoint, making it ideal for low-cost PCIe add-in cards such as protocol analyzers, data loggers, and custom accelerators. The 24K logic elements fit a Gen2 x1 endpoint plus DMA engine and device-side state machine. Its 1.2V core reduces auxiliary board power compared to larger FPGAs, which is critical for slot-powered cards.
Recommended
Discrete Glue Logic Replacement
For designers consolidating TTL/CMOS glue logic - counters, address decoding, custom state machines, bus arbitration - the 10CL025YU256C8G replaces dozens of discrete packages with a single programmable device. The 24,624 logic elements and 150 I/O count exceed typical glue-logic demands, leaving significant headroom for design evolution. PCB real estate is reclaimed and BOM count drops, while the 1.2V core keeps thermal dissipation low.
Recommended
Communication Protocol Bridge
The 10CL025YU256C8G implements multi-protocol bridging between UART, SPI, I2C, CAN, Ethernet MAC, and PCIe endpoints in a single device. Its 608 Kbits embedded RAM supports packet buffering, while 150 I/O pins accommodate multiple transceiver interfaces simultaneously. The 4 PLLs generate independent clocks for each protocol domain, eliminating external clock buffers and reducing BOM complexity.
Recommended
Recommended Products Summary
Engineering reference data for 10CL025YU256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL025YU256C6G | 10CL025YU256A7G | 10CL016YU256C8G | 10CL016YU256C6G | 10CL016YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA (U256) | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same |
| Logic Elements | 24,624 | 24,624 | 24,624 | 15,408 | 15,408 | 15,408 |
| Total RAM Bits | 608,256 | 608,256 | 608,256 | 303,744 | 303,744 | 303,744 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 | 150 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Key Differentiators
- 25K logic element density at low power (vs 10CL016YU256C8G)
- Speed grade 8 (C8) timing margin (vs 10CL025YU256C6G)
- Drop-in compatibility with full Cyclone 10 LP U256 family (vs 10CL016YU256C8G)
Design Notes
Estimated: At 1.2V core voltage and typical 25 mW static power plus dynamic power (varies with utilization and toggle rate), the 10CL025YU256C8G in a U256 BGA package typically dissipates 1-3W in real designs. The U256 BGA thermal pad must be soldered to a continuous ground plane with thermal vias for proper heat dissipation; without this, junction temperature can exceed 125C in enclosed industrial enclosures. Add 4-9 thermal vias (0.3 mm drill, 1 oz copper) directly under the package thermal pad.
Use microvia-in-pad technology (laser-drilled, 0.1 mm capture pad) on the 0.8 mm BGA balls to ensure reliable assembly yield on standard 6-layer FR-4 stackup. Route all signal escapes on the top layer with dog-bone fanout, and dedicate inner layers to ground/power planes. Decouple each power rail with 100nF X7R capacitors placed within 2 mm of the BGA balls, plus 10uF bulk capacitors on each supply island (1.2V VCCINT, 2.5V VCCA, 3.3V VCCIO).
Do not mix Cyclone 10 LP pin assignments between U256 (256-ball BGA) and E144 (144-pin EQFP) packages - I/O bank assignments and pin names differ entirely. Always re-run Quartus Prime Pin Planner for the U256 package when porting designs from other Cyclone 10 LP packages. Confirm MSL3 moisture sensitivity handling per J-STD-033 before reflow assembly - U256 BGA requires pre-bake if floor life exposure exceeds 168 hours.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product page. Commercial temperature grade (0C to +85C); industrial/automotive variants available in I7G and A7G suffixes.
