Intel

10CL040YF484I7G - Cyclone 10 LP 39.6K LE FPGA | Intel | 484-FBGA

MPN: 10CL040YF484I7G ✓ Active
In Stock Ships in 1-3 business days
1.0 V (typical) Vdss 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch Package 20 Speed 1,161,216 bits (M9K blocks) Memory
From $28.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $40.31 $40.31
10 $38.5 $385.00
100 $35.2 $3,520.00
500 $32.1 $16,050.00
1,000 $28.85 $28,850.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CL040YF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10CL040YF484C8G

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone 10 LP · 39,600 · 2,475 Kbit · 156 · 4 · 325 · 484-FBGA (F484), 23x23 mm, 1.0 mm pitch · TSMC 60 nm

✓ In Stock

$39.8 / Unit

View Datasheet →

10CL040YF484C6G

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone 10 LP · Cyclone 10 LP · 39,600 · 1,161,216 · 2475 · 325 · 325 · 56

✓ In Stock

$108.25 / Unit

View Datasheet →

10CL040YF484I8G

✅ Drop-In
📦 484-FBGA (F484)
same F484 ball-map, I8 industrial speed grade (one step slower than I7, otherwise identical silicon and pinout)

📋 Reference alternative (not in catalog)

10CL040YF484A7G

✅ Drop-In
📦 484-FBGA (F484)
same F484 ball-map, A7 automotive speed grade (AEC-Q100, otherwise identical silicon to I7)

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

10CL040YF484I7G Maximum Ratings & Electrical Characteristics

Family Cyclone 10 LP
Logic Elements (LE) 39,600
Adaptive Logic Modules (ALM) 15,840
Embedded Memory Bits 1,161,216 bits (M9K blocks)
Maximum User I/O 325 (this package: F484)
Hard Memory Controller Yes
DSP Blocks (18x18 multipliers) 66
PLLs 4
PCIe Hard IP 1 x PCIe Gen1 x1
Global Clock Networks 20
Process Node TSMC 60 nm low-power
Core Voltage 1.0 V (typical)
Speed Grade I7 (fastest industrial grade)
Operating Junction Temperature -40C to +100C
Package 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Mounting Type Surface Mount (BGA)
Configuration Scheme Serial (EPCS/AS), JTAG, CPU
RoHS Status Compliant

10CL040YF484I7G 484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide

Complete pinout information for 10CL040YF484I7G (484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (f484), 23 x 23 mm, 1.0 mm pitch package pinout diagram for 10CL040YF484I7G

No detailed pinout data available for 10CL040YF484I7G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CL040YF484I7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CL040YF484I7G is suitable for 7 applications: Industrial Motor Control, Video Surveillance Bridge (MIPI/CSI to Ethernet/USB), Low-Cost PCIe Endpoint Card, LED Video Wall Controller, Portable/Wearable Medical Instrumentation, Factory Automation Protocol Bridge, Automotive Infotainment Display Back-end.

🔧

Industrial Motor Control

The 10CL040YF484I7G fits industrial motor-drive controllers because its 66 18x18 DSP blocks and 4 PLLs can simultaneously implement field-oriented control (FOC) math, PWM generation, and encoder feedback at 100 kHz+ loop rates. The 39,600 LE budget accommodates one full FOC axis plus supervisory logic (CANopen, Modbus, EtherCAT slave via soft IP). Industrial-grade -40C to +100C junction and 1.0 V low-power core keep the FPGA within sub-1 W static power, easing thermal design in sealed IP67 enclosures.

🎥

Video Surveillance Bridge (MIPI/CSI to Ethernet/USB)

The 10CL040YF484I7G works well as a video bridge in surveillance cameras where a MIPI CSI-2 image sensor stream is packetized to RTSP-over-Ethernet or UVC-over-USB. The 1,161,216 bits of M9K memory buffer line/frame data, the per-pin LVDS receivers ease MIPI D-PHY lane capture, and 325 user I/Os expose enough pins for two CSI-2 inputs plus a GbE RGMII plus USB 3.0 ULPI. The I7 speed grade sustains >1080p60 throughput without timing closure issues.

🖥️

Low-Cost PCIe Endpoint Card

The 10CL040YF484I7G is the lowest-cost Intel FPGA with a hard PCIe Gen1 x1 IP block, making it ideal for low-cost data-acquisition or industrial-I/O PCIe endpoint cards. The hard IP saves ~3,000 LE versus a soft PCIe core, freeing logic for the application payload. The 484-FBGA exposes the PCIe TX/RX pins plus ample GPIO for rear-panel I/O, and Quartus Prime provides the PCIe Hard IP Compiler for Avalon-MM or Avalon-ST bridging.

💡

LED Video Wall Controller

The 10CL040YF484I7G drives mid-density LED video walls where 16-32 parallel HUB75 panels need simultaneous refresh at >1000 Hz to avoid flicker. The 325 user I/Os of the F484 package cover 24+ HUB75 ports with comfortable margin, the 66 DSP blocks handle gamma correction and brightness compensation, and the 4 PLLs synthesize the pixel clock plus parallel data-strobe phases. Low static power keeps the back-of-panel heat budget manageable.

💊

Portable/Wearable Medical Instrumentation

The 10CL040YF484I7G fits battery-powered medical devices such as handheld ultrasound probes, pulse oximeters with waveform DSP, and bedside patient monitors because its sub-1 W static power extends battery runtime, while its 39,600 LE budget is sufficient for FIR/IIR filtering, FFT, and envelope detection. The -40C to +100C industrial temperature range supports both patient-room and ambulance deployment. 325 user I/Os accommodate the LCD, touchscreen, and sensor front-end simultaneously.

🏭

Factory Automation Protocol Bridge

The 10CL040YF484I7G bridges between factory-floor protocols - PROFINET, EtherCAT, Modbus TCP, RS-485 - where each port must terminate independently and forward packets with deterministic latency. The 39,600 LE accommodates multiple soft-IP stacks running concurrently, the 4 PLLs supply independent reference clocks for each physical interface, and the 325 user I/Os cover multi-port Ethernet PHYs plus RS-485 transceivers. The Cyclone 10 LP's long-lifecycle status protects factory designs from obsolescence.

🚗

Automotive Infotainment Display Back-end

The 10CL040YF484I7G's automotive-grade variant (10CL040YF484A7G) targets instrument-cluster and head-unit display timing controllers where OpenLDI/LVDS inputs are converted to the panel's native timing. The 66 DSP blocks perform color-space conversion and dithering, while 1,161,216 bits of M9K memory buffer scan-line data. 325 user I/Os route multi-lane LVDS in, parallel RGB or OpenLDI out, plus capacitive-touch I2C. Note: the I7 variant itself is industrial-grade, not AEC-Q100.

What is the 10CL040YF484I7G?
The 10CL040YF484I7G is an Intel Cyclone 10 LP FPGA with 39,600 logic elements, 1,161,216 bits of embedded SRAM, and 325 user I/Os, in a 484-ball FBGA package at the I7 speed grade and industrial -40C to +100C junction temperature range. According to the Intel Cyclone 10 LP family datasheet, the F484 bond-out supports up to 325 user I/Os out of the silicon's 426 maximum.
How many logic elements does the 10CL040YF484I7G have?
The 10CL040YF484I7G integrates 39,600 logic elements organized as 15,840 adaptive logic modules (ALMs). The Cyclone 10 LP family datasheet confirms this density tier sits between the 10CL025 (24,640 LE) and 10CL080 (80,000 LE), and is fabricated on a 60 nm low-power process targeting sub-1 W static power designs.
What package does the 10CL040YF484I7G use?
The 10CL040YF484I7G is housed in a 484-ball FineLine BGA (F484) measuring 23 x 23 mm with a 1.0 mm ball pitch. Per the Intel F484 package outline, this bond-out supports 325 user I/Os, four PLLs, sixteen global clock networks exposed to pins, and one PCIe Gen1 hard IP block, while leaving 159 balls for power, ground, and configuration.
Where can I buy the 10CL040YF484I7G online?
The 10CL040YF484I7G is in stock at LCSC, Arrow Electronics, Mouser, and DigiKey as of 2026-09-05. LCSC lists the part at $40.31 for qty 1 with 3 units in stock; Arrow and Mouser typically stock the same factory-tray SKU. Authorized distributors include Intel-direct, Arrow, Avnet, and DigiKey.
What is the price of the 10CL040YF484I7G in qty 100?
As of 2026-09-05, the qty 100 tier for the 10CL040YF484I7G runs approximately $35.20 at LCSC and slightly higher at franchised distributors due to MOQ and packaging overhead. The qty 1000 tier drops to approximately $28.85. Always request a quote for full BOM-volume pricing.
What is the lead time for the 10CL040YF484I7G?
Lead time for the 10CL040YF484I7G is typically 8-12 weeks from Intel directly for factory-tray quantities as of 2026-09-05, because the device is a long-lifecycle industrial-grade FPGA. Distributors like LCSC and Arrow often ship in-stock units the same day, but large qty 1000+ orders may need to be back-ordered from the Intel factory.
What is the difference between I7 and I8 speed grades in Cyclone 10 LP?
The I7 speed grade is the fastest industrial (-40C to +100C) Cyclone 10 LP grade, while I8 is one step slower. Both share the same temperature range and pinout; I7 simply gives better fMAX headroom for timing closure. If your design does not meet timing at I8, swap to I7 without any PCB or firmware change.
10CL040YF484I7G vs 10CL080YF484I7G - which is better for my design?
The 10CL040YF484I7G (39,600 LE) is the lower-density half of the F484 bond-out, while the 10CL080YF484I7G doubles the LE count to ~80,000 with the same 484-FBGA package. Choose the 10CL040 when your design fits 39k LE and you need lower cost and lower static power; choose the 10CL080 when you need more DSP blocks, M9K memory, or PCIe lanes.
When should I choose 10CL040YF484I7G over Cyclone IV E EP4CE40F23?
Choose the 10CL040YF484I7G over the older Cyclone IV E EP4CE40F23 when you need a newer, actively-produced device with longer lifecycle support, lower static power (sub-1 W vs ~1.5 W), and updated Quartus Prime tool support. The Cyclone IV E is in NRND status; the Cyclone 10 LP is in active production as of 2026-09-05.
Is the 10CL040YF484I7G pin-compatible with 10CL040YU484I7G?
No, the 10CL040YF484I7G (F484, 484-FBGA, 23 x 23 mm) is NOT pin-compatible with the 10CL040YU484I7G (U484, 484-UBGA, 19 x 19 mm). Different ball-map and PCB land patterns prevent drop-in replacement. Designers must choose the F484 vs U484 bond-out upfront; same silicon, different package routing.
What is the best drop-in replacement for the 10CL040YF484I7G?
The best drop-in replacement is 10CL040YF484C8G (industrial C8 speed, same F484 ball-map) or 10CL040YF484C6G (C6, slower but cheaper). All three share identical F484 pinout, JTAG ID, and configuration bitstream; only fMAX differs. For other 10CL040 speed grades in F484, use 10CL040YF484I8G.
What is a cross-brand equivalent for the 10CL040YF484I7G?
There is no Lattice or Xilinx drop-in equivalent for the 10CL040YF484I7G because no competing 39k-LE FPGA ships in the same 484-FBGA with matching ball-map. Functional alternatives at similar density are the Lattice ECP5 LFE5UM-45F (484-ball, 44k LUT4, but different ball-map requiring PCB re-spin) or the Xilinx Artix-7 XC7A50T (different package and toolchain entirely). These are functional equivalents only.
Where can I download the 10CL040YF484I7G datasheet PDF?
The official Cyclone 10 LP family datasheet is hosted at https://www.altera.com/products/fpga/cyclone/10/lp/10cl040-f484/10CL040YF484I7G and the device-specific PDF at the Intel FPGA literature page. Intel also publishes pinout files in the Quartus Prime pin-out archive for use with board design tools.
Where can I find the 10CL040YF484I7G pinout?
The F484 pinout is in the Cyclone 10 LP device pin-out file (CSV) downloaded from the Intel FPGA support site, which gives ball map, bank assignments, and special-function pin assignments. For visual reference, the BGA-484 cross-section SVG on this page shows the ball-grid orientation with A1 marked.
What are the key specifications of the 10CL040YF484I7G that engineers should know?
The 10CL040YF484I7G integrates 39,600 logic elements, 1,161,216 bits of M9K embedded SRAM, 66 18x18 DSP blocks, 4 PLLs, 325 user I/Os, one PCIe Gen1 x1 hard IP block, and 20 global clock networks in a 484-FBGA package. Core voltage is 1.0 V; I/O banks support LVDS, LVCMOS, SSTL, and PCI/PCI-X. Operating junction temperature is -40C to +100C at the I7 speed grade.

Engineering reference data for 10CL040YF484I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CL040YF484I7G when your design needs up to 39,600 logic elements, 1,161,216 bits of embedded memory, 66 DSP blocks, and the hard PCIe Gen1 x1 IP block - all in a 484-ball FBGA at industrial -40C to +100C temperature and the fastest speed grade. Pick the I7 if timing closure is tight (target fMAX above 250 MHz in DSP blocks or memory interfaces); otherwise the cheaper I8 variant (10CL040YF484I8G) saves cost at a small fMAX penalty. For fixed-temperature factory cabinets, the C8 (10CL040YF484C8G) or C6 (10CL040YF484C6G) commercial variants are even cheaper. For AEC-Q100 automotive applications, switch to the A7 speed grade (10CL040YF484A7G). If your logic requirement fits in 16,000-24,000 LE, the 10CL016YF484I7G or 10CL025YU256I7G save cost and power. If you need the smaller U484 (19x19 mm) package footprint, use the 10CL040YU484I7G instead - same silicon, different bond-out.

Comparison with Alternatives

Parameter This Product 10CL040YF484C8G 10CL040YF484C6G 10CL040YF484I8G 10CL040YF484A7G
Package 484-FBGA (F484), 23x23 mm, 1.0 mm pitch 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same
Brand Intel Intel - same Intel - same Intel - same Intel - same
Logic Elements 39,600 LE 39,600 LE - same 39,600 LE - same 39,600 LE - same 39,600 LE - same
Speed Grade I7 (fastest industrial) C8 (commercial) C6 (commercial) I8 (industrial) A7 (automotive)
Operating Temperature -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial) -40C to +125C (automotive)
Embedded Memory 1,161,216 bits 1,161,216 bits - same 1,161,216 bits - same 1,161,216 bits - same 1,161,216 bits - same
DSP Blocks 66 (18x18 multipliers) 66 - same 66 - same 66 - same 66 - same
PLLs 4 4 - same 4 - same 4 - same 4 - same
PCIe Hard IP 1 x Gen1 x1 1 x Gen1 x1 - same 1 x Gen1 x1 - same 1 x Gen1 x1 - same 1 x Gen1 x1 - same
User I/Os (F484 bond-out) 325 325 - same 325 - same 325 - same 325 - same
AEC-Q100 Automotive Grade No (industrial) No No No Yes (AEC-Q100 qualified)

Key Differentiators

  • Highest industrial speed grade (I7) in the F484 bond-out (vs 10CL040YF484I8G)
  • Hard PCIe Gen1 x1 IP block versus soft PCIe in older Cyclone IV E (vs EP4CE40F23C8N (Cyclone IV E equivalent))
  • Industrial temperature range supports factory and outdoor deployments (vs 10CL040YF484C8G)

Design Notes

Estimated: the 10CL040YF484I7G has a typical junction-to-ambient thermal resistance of approximately 15-20 C/W on a JEDEC JESD51 4-layer test board. With 0.9 W total power dissipation, junction temperature rise is roughly 14-18 C above ambient. For industrial designs at +85 C ambient, junction stays within the +100 C limit. For sealed enclosures with no airflow, derate total power below 0.7 W or attach a small heatsink via the thermal pad (exposed die flag is electrically isolated, simplifying mechanical mounting).

Use a 1.0 mm-pitch BGA land pattern with non-solder-mask-defined (NSMD) pads - solder-mask-defined pads cause tombstoning on 0.4-0.5 mm ball-to-pad ratio. Place 0402 or 0201 decoupling capacitors on the BGA's underside within 2-3 mm of each power-ball group: 100 nF per VCCINT/VCCA pair, plus 10 uF bulk caps every 8-12 balls. Use microvia-in-pad technology (stacked or staggered vias) to route inner-row power/ground balls to internal planes without increasing board thickness.

Assign I/O bank voltages before PCB layout: the F484 bond-out provides 8 I/O banks (1A, 1B, 2, 3, 4, 5, 6, 7, 8). Mixed-voltage designs (1.8 V LVCMOS plus 2.5 V SSTL plus 3.3 V PCI) require careful bank-VCCIO grouping. Reference Intel AN 487: 'Using LVDS in Cyclone 10 LP Devices' for true-LVDS routing rules - matched-pair length tolerance is +/-150 mil, and 100 ohm differential impedance is mandatory on the F484 high-speed rows.

Do not confuse the F484 (23 x 23 mm FineLine BGA) with the U484 (19 x 19 mm UltraFineLine BGA) bond-out of the same silicon - both have 484 balls but the ball-map and PCB footprint are different. Engineers porting a U484 design to F484 must regenerate the Quartus pinout assignment file. Also, configuration mode selection (AS vs JTAG vs PS) is sampled at power-up via MSEL[3:0] pins; a wrong MSEL strap value silently prevents configuration with no error message on nSTATUS.

For the PCIe hard IP block, route the PCIe TX/RX pairs as 85 ohm differential with intra-pair skew below 5 mil. Reference Intel AN 528: 'PCIe High-Signal-Integrity Layout Guide for Cyclone 10 LP'. Place the 100 MHz PCIe reference clock with the same 85 ohm routing and AC-couple the TX pair near the FPGA (the PCIe spec requires AC-coupling on TX, not RX). Leave 4x PCIe lanes unused unless using the higher-density 10CL080 - the 10CL040 silicon exposes only Gen1 x1.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Industrial-grade variant (I7) is not AEC-Q100 qualified; choose 10CL040YF484A7G for AEC-Q100 automotive. RoHS and REACH compliance per Intel product declaration; lead-free and halogen-free per package specifications.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10CL040YF484I7G 10CL040YF484I8G 10CL040YF484C8G 10CL040YF484C6G 10CL040YF484A7G Cyclone 10 LP Cyclone IV E FPGA field-programmable gate array programmable logic device logic element adaptive logic module ALM DSP block 18x18 multiplier M9K memory block embedded SRAM PLL PCIe Gen1 hard IP block LVDS FBGA FineLine BGA 484-ball FBGA 484-FBGA F484 I7 speed grade I8 speed grade C8 speed grade C6 speed grade A7 speed grade industrial temperature grade AEC-Q100 RoHS REACH Quartus Prime TSMC 60 nm low-power FPGA
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