10CL055YU484C8G - Cyclone 10 LP FPGA, 56K LE, 484-UBGA | Intel
MPN: 10CL055YU484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88 | $880.00 |
| 100 | $79.5 | $7,950.00 |
| 500 | $71.2 | $35,600.00 |
| 1,000 | $63.8 | $63,800.00 |
Drop-in alternatives for 10CL055YU484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL055YU484C6G
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View Datasheet →10CL055YU484A7G
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View Datasheet →10CL055YU484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CL055YF484C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CL040YU484C8G
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View Datasheet →10CL055YF484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CL055YU484C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 55856 |
| Embedded Memory (bits) | 2396160 |
| Maximum User I/Os | 321 |
| Package | 484-pin UBGA |
| Package Code | U484 |
| Operating Temperature Range | 0C to 85C (Commercial) |
| Speed Grade | 8 |
| Supply Voltage Core | 1.0 V (typical, see datasheet) |
| Configuration Mode | JTAG, AS, PS, FPP |
| Process Technology | 60 nm low-power |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes / Compliant |
| Design Software | Intel Quartus Prime Lite / Standard |
10CL055YU484C8G u484 Pin Configuration Guide
Complete pinout information for 10CL055YU484C8G (u484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL055YU484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL055YU484C8G is suitable for 6 applications: Industrial Motor Control, Machine Vision and Video Processing, Automotive Driver Assistance (ADAS), IoT Edge Gateway Aggregation, Broadcast and Pro-Audio Equipment, Low-Cost Prototyping and Education Platforms.
Industrial Motor Control
The 10CL055YU484C8G is well suited to industrial motor control systems where its 55,856 logic elements can host multiple PWM generators, encoder interface logic, and Field-Oriented Control (FOC) state machines concurrently. The 321 user I/Os accommodate multi-axis servo drives, with the embedded 18x18 multipliers handling Park/Clarke transforms and PID computation at high update rates. Compared to a microcontroller-only solution, the FPGA offloads time-critical sampling, enabling current loop rates above 100 kHz and deterministic latency for safety-critical functions.
Recommended
Machine Vision and Video Processing
In machine vision pipelines, the 10CL055YU484C8G ingests raw sensor data from MIPI or parallel LVDS interfaces and performs real-time preprocessing such as color conversion, Bayer demosaicing, and convolution-based edge detection. The 2,396,160 embedded memory bits buffer line-scan image data, while the DSP blocks accelerate Sobel and Gaussian filters. The 484-UBGA package exposes sufficient I/Os for dual-channel camera aggregation, and the DDR3 controller sustains throughput to external frame buffers.
Recommended
Automotive Driver Assistance (ADAS)
For ADAS subsystems such as surround-view stitching, lane departure warning, and radar preprocessing, the 10CL055YU484C8G provides deterministic real-time response that microcontrollers cannot guarantee. The 484-BGA package supports the high pin counts required for multi-camera LVDS aggregation, while embedded memory buffers radar FFT data. Note: while this part is commercial-temperature, the 10CL055YU484I7G industrial variant is recommended for automotive underhood or cabin environments requiring extended thermal range.
Recommended
IoT Edge Gateway Aggregation
The 10CL055YU484C8G aggregates multiple IoT protocols (SPI, I2C, UART, CAN, Modbus) on a single die, replacing discrete protocol-converter ICs and a microcontroller. Its 55,856 LEs implement on-chip TCP/IP offload, secure boot, and edge-analytics inference engines. The 321 I/Os handle dozens of sensor inputs simultaneously, and the low-power 60 nm process minimizes idle-mode consumption for always-on gateway deployments in retail, agriculture, or smart-building contexts.
Recommended
Broadcast and Pro-Audio Equipment
Professional audio gear such as digital mixing consoles, broadcast routers, and effects processors leverage the 10CL055YU484C8G's deterministic low-latency DSP capability. The 18x18 multipliers implement biquad filter chains and dynamics processors on hundreds of audio channels, while the embedded memory holds delay-line buffers for reverb and chorus effects. The 484-BGA package routes numerous AES3, MADI, or Dante network streams concurrently without an external ASIC.
Recommended
Low-Cost Prototyping and Education Platforms
The 10CL055YU484C8G is widely used in university digital logic labs and R&D prototypes where designers need a moderately dense, well-documented FPGA with free toolchain support. Quartus Prime Lite supports the entire Cyclone 10 LP family at no cost, lowering the barrier to entry. The 484-UBGA package is large enough to break out to a wide range of peripherals on a development board, while the 55,856 LEs accommodate full RISC-V soft-core implementations alongside student designs.
Recommended
Recommended Products Summary
Engineering reference data for 10CL055YU484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL055YU484C6G | 10CL055YU484A7G | 10CL040YU484C8G | 10CL055YU484I7G |
|---|---|---|---|---|---|
| Package | 484-UBGA (U484) | 484-UBGA (U484) - same | 484-UBGA (U484) - same | 484-UBGA (U484) - same | 484-UBGA (U484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 55856 | 55856 (same) | 55856 (same) | 40000 (-28%) | 55856 (same) |
| Embedded Memory (bits) | 2396160 | 2396160 (same) | 2396160 (same) | ~1700000 (-29%) | 2396160 (same) |
| Max User I/Os | 321 | 321 (same) | 321 (same) | 321 (same) | 321 (same) |
| Speed Grade | 8 | 6 (slower) | A7 (slowest) | 8 (same) | 7 (slower) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) |
| Process Technology | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power | 60 nm low-power |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Optimal balance of logic density and low power (vs 10CL040YU484C8G)
- Faster speed grade within same package (vs 10CL055YU484C6G)
- Same-package industrial temperature option exists (vs 10CL055YU484I7G)
- Lower static power than Cyclone IV predecessors (vs Cyclone IV EP4CE55F484)
Design Notes
The 10CL055YU484C8G requires multiple supply rails: a 1.0 V core, 1.5 V/1.8 V/2.5 V/3.3 V I/O bank voltages, and an auxiliary 2.5 V analog supply. Per Intel's Cyclone 10 LP Pin Connection Guidelines, decouple each rail with a 100 uF bulk capacitor plus 0.1 uF and 0.01 uF high-frequency ceramics placed within 5 mm of the BGA balls. Power-on sequencing must follow the datasheet-specified order to prevent latch-up; use a sequencer IC if multiple rails come up simultaneously.
The 484-UBGA package's theta_JA is approximately 15 C/W with a properly designed thermal via array under the package. Estimated: at maximum toggle activity (60-70% utilization), the device may dissipate 2-3 W, yielding a 30-45 C junction rise above ambient. For applications approaching 85 C ambient, integrate at least a 4x4 thermal via array (0.3 mm drill, 1.0 mm pitch) under the BGA and stitch copper pours on inner layers for heat spreading.
The 1.0 mm pitch UBGA requires 4-layer or 6-layer PCB stackup with controlled impedance routing for high-speed LVDS and DDR interfaces. Each BGA ball needs a 0.5 mm pad with a non-solder-mask-defined (NSMD) finish for reliability. Fanout should use dog-bone or via-in-pad patterns depending on inner-layer escape routing. Matched-length tuning within 25 mils is required for DDR3 address/command and within 10 mils for source-synchronous LVDS pairs.
Do not leave JTAG pins (TCK, TMS, TDI, TDO, TRST) floating - they must be pulled to defined logic levels per the datasheet, or the device may enter unintended configuration states. Similarly, unused I/O banks must have their VCCIO pins powered or the bank must be software-disabled to avoid floating input leakage. Configuration mode pins MSEL[3:0] must be hard-wired to the correct values for the chosen configuration scheme (AS, PS, FPP, or JTAG).
Place the 50 MHz to 100 MHz configuration clock oscillator within 25 mm of the CLKUSR/CCLK pin, and route the trace over a continuous ground reference plane with no splits. For AS configuration mode, route the ASDO, ASMI, nCSO, and DATA signals away from high-frequency switching nets (DDR, SERDES) to avoid coupling during configuration. Keep the nCONFIG and nSTATUS traces short and avoid crossing noisy planes.
Compliance Information
RoHS compliant per 'G' suffix in part number. Commercial temperature grade (0-85C). For industrial temperature, choose 10CL055YU484I7G. Not AEC-Q100 qualified; refer to Intel's automotive-grade product line for AEC-Q100 options.
