10CL080YF484C6G - Cyclone 10 LP FPGA 81K LE BGA-484 | Intel
MPN: 10CL080YF484C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $125 | $125.00 |
| 10 | $115.5 | $1,155.00 |
| 100 | $102.75 | $10,275.00 |
| 500 | $92.4 | $46,200.00 |
| 1,000 | $84.95 | $84,950.00 |
Drop-in alternatives for 10CL080YF484C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL080YF484C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$12.65 / Unit
View Datasheet →10CL080YF484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$71.95 / Unit
View Datasheet →10CL080YU484C6G
✅ Drop-In✓ In Stock
$34.75 / Unit
View Datasheet →10CL055YF484C6G
✅ Drop-In✓ In Stock
$112.4 / Unit
View Datasheet →10CL040YF484C6G
✅ Drop-In✓ In Stock
$108.25 / Unit
View Datasheet →10CL080YF484C6G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP FPGA |
| Logic Elements (LE) | 81,264 |
| Total Memory Bits | 2,810,880 bits |
| Embedded Memory (M9K blocks) | 305 blocks |
| Logic Array Blocks (LAB) | 5,070 |
| 18x18 Multipliers | 289 |
| Maximum User I/O Pins | 347 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm low power |
| Package | 484-ball FineLine BGA (F484) |
| Speed Grade | 6 (commercial) |
| Operating Temperature | 0C to +85C (commercial, C suffix) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Supply Voltage (Core) | 1.2 V |
| RoHS Status | Compliant (Y suffix) |
10CL080YF484C6G 484-ball fineline bga (f484) Pin Configuration Guide
Complete pinout information for 10CL080YF484C6G (484-ball fineline bga (f484) package) with 347 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL080YF484C6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 347 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL080YF484C6G is suitable for 6 applications: Industrial Machine Vision and Video Bridging, Motor Control and Industrial Drive, Factory Automation and Protocol Bridging, Portable Medical Instrumentation, Software-Defined Radio Front-End, Display Controllers and Video Wall Processing.
Industrial Machine Vision and Video Bridging
The 10CL080YF484C6G fits industrial machine vision pipelines because its 81,264 logic elements, 289 18x18 multipliers, and 2,810,880 bits of embedded memory support multi-channel Bayer-to-RGB conversion, Sobel/edge filtering, and frame-buffer line storage on a single device. The 4 PLLs generate the parallel pixel clocks and Camera Link LVDS frequencies needed for industrial cameras, while the 347 user I/Os absorb wide video buses without external bus muxes. Compared with an ASSP vision processor, the FPGA allows custom algorithm upgrades per production run without respin cost.
Recommended
Motor Control and Industrial Drive
The 10CL080YF484C6G is well suited for multi-axis industrial motor drives because its 289 18x18 multipliers implement field-oriented control (FOC) and space-vector PWM loops in hardware, freeing the host CPU for supervisory tasks. The 305 M9K memory blocks hold sine/cosine lookup tables and per-axis current-loop state, while 4 PLLs derive the switching-frequency clocks from a single crystal. The commercial 0-85C temperature grade covers enclosed cabinet deployments, and the F484 BGA footprint enables compact PCB integration next to the gate-driver stage.
Recommended
Factory Automation and Protocol Bridging
The 10CL080YF484C6G enables factory automation protocol bridges such as EtherCAT-to-PROFINET, Modbus-TCP-to-Profibus, or CAN-to-Ethernet converters. Its 81,264 LEs handle the protocol stack state machines and 2,810,880 memory bits buffer message frames, while 4 PLLs synthesize the precise Ethernet PHY reference clocks needed for 100 Mbit/s operation. The 347 user I/Os expose multiple PHY/RGMII/MII interfaces plus industrial fieldbus transceivers on the same BGA, reducing the bill of materials versus a discrete MCU plus ASIC approach.
Recommended
Portable Medical Instrumentation
The 10CL080YF484C6G fits portable patient-monitoring and diagnostic devices because its 60 nm low-power process delivers low static power consumption versus higher-density Stratix parts. The 81,264 LEs implement DSP filters (ECG/EEG/pulse-oximetry) and display controllers, while 2,810,880 memory bits hold patient-data buffers and waveform-history rings. The F484 BGA with 347 user I/Os supports TFT-LCD panels, touch controllers, and USB/Ethernet PHYs on a compact PCB. Quartus Prime power analysis tools confirm the device meets battery-powered thermal envelopes.
Recommended
Software-Defined Radio Front-End
The 10CL080YF484C6G suits low-cost software-defined radio (SDR) receivers and IQ-baseband processors because its 289 18x18 multipliers deliver up to ~1.5 GMACs of DSP throughput for FIR filtering, FFTs, and digital down-conversion. The 2,810,880 bits of embedded memory buffer IQ sample streams, and 4 PLLs generate the ADC/DAC sample clocks plus IF mixing frequencies. The 347 user I/Os expose multiple LVDS pairs for ADC/DAC interfaces. For higher-bandwidth multi-antenna designs, the 10CL080YF484C8G (speed grade 8) extends Fmax headroom.
Recommended
Display Controllers and Video Wall Processing
The 10CL080YF484C6G drives multi-panel video walls and digital signage controllers because its 81,264 LEs handle scaling, color-space conversion, and bezel-compensation pipelines for up to four 1080p60 streams simultaneously. The 305 M9K memory blocks act as line buffers and frame-store, and the 347 user I/Os drive multiple HDMI/DVI/V-by-One links via external PHY serializers. Compared with a multi-ASIC approach, the FPGA scales to different panel counts via firmware change rather than hardware respin.
Recommended
Recommended Products Summary
Engineering reference data for 10CL080YF484C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL080YF484C8G | 10CL080YF484I7G | 10CL080YU484C6G | 10CL055YF484C6G | 10CL040YF484C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same | 484-ball UltraFineLine BGA (U484) - different ball pitch | 484-ball FineLine BGA (F484) - same | 484-ball FineLine BGA (F484) - same |
| Logic Elements | 81,264 | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 55,856 (-31%) | 39,600 (-51%) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 (same die) | 2,810,880 (same die) | 2,810,880 (same die) | 2,396,160 (-15%) | 1,161,216 (-59%) |
| 18x18 Multipliers | 289 | 289 (same die) | 289 (same die) | 289 (same die) | 156 (-46%) | 108 (-63%) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | 6 (commercial) | 8 (commercial, faster) | 7 (industrial) | 6 (commercial) | 6 (commercial) | 6 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Approx. Unit Price (qty 1) | $125.00 | ~$145 (+16%) | ~$140 (+12%) | ~$135 (+8%) | ~$95 (-24%) | ~$78 (-38%) |
Key Differentiators
- Mid-density sweet spot in Cyclone 10 LP family (vs 10CL055YF484C6G and 10CL110 series)
- Pin-compatible upward and downward density migration (vs 10CL055YF484C6G / 10CL080YF484C8G)
- Lowest static power in its density class (vs 10CL080YF484C8G)
Design Notes
Estimated: The F484 FineLine BGA uses a 1.0 mm ball pitch on a 22x22 array. PCB stack-up must support 0.4 mm laser-drilled microvias or via-in-pad to fan out the inner rows reliably; a 4-layer 1 oz copper stack-up is the typical minimum. The PCB must use ENIG or OSP surface finish to ensure solder joint reliability over the device's 0-85C commercial operating range. Intel's Cyclone 10 LP Hardware Reference Manual provides a reference 8-layer stack-up that achieves the required signal-integrity margins for LVDS and DDR3 interfaces.
Estimated: With theta_JA of approximately 18 C/W (F484, JEDEC JESD51 still-air), at 2 W total power dissipation the junction rises 36 C above ambient. For the 0-85C commercial window this leaves ~31 C margin; designs targeting the upper commercial limit require at least 5 cm^2 of unbroken inner copper pour stitched to the thermal balls. Always validate with the Quartus Prime PowerPlay early-power-estimator using realistic toggle-rate and utilization assumptions before PCB commitment.
Do not assume the 10CL080YF484C6G, 10CL080YF484C8G, and 10CL080YF484I7G are interchangeable across all applications - the C8G has tighter Fmax but higher power; the I7G adds industrial temperature range. Always check that the Quartus Prime fitter report confirms timing closure at the target speed grade before substituting. Also note that the 10CL080YU484C6G uses the U484 (0.8 mm pitch) BGA which is NOT PCB footprint-compatible with the F484 (1.0 mm pitch) used here - PCB redesign is required for that variant.
Compliance Information
Y suffix confirms lead-free / Pb-free reflow-compatible finish per Intel OPN decoder. Not AEC-Q100 qualified (FPGAs are typically not automotive-qualified in the Cyclone 10 LP tier).
