Intel

10CX150YU484I6G - Cyclone 10 GX FPGA, 150K LE, 484-BGA | Intel

MPN: 10CX150YU484I6G ✓ Active
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[DATA_NEEDED: Vcore nominal] Vdss 484-Ball UBGA (FCBGA) Package 10,907,648 Memory
From $151.9 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $184.5 $184.50
10 $175.2 $1,752.00
100 $165.8 $16,580.00
250 $158.4 $39,600.00
500 $151.9 $75,950.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CX150YU484I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10CX150YU484I5G

✅ Drop-In
Intel
📦 484-Ball UBGA (FCBGA)
Cyclone 10 GX · 150,000 · 10,907,648 bits (~10.4 Mbit) · 188 · 20 nm · 12 (up to 3.125 Gbps) · PCIe Gen2 x4 · 2 (DDR3/DDR3L up to 800 MHz)

✓ In Stock

$176.2 / Unit

View Datasheet →

10CX150YU484E6G

✅ Drop-In
Intel
📦 484-Ball UBGA (FCBGA)
Cyclone 10 GX · 20 nm · 150,000 · 10,907,648 (10.4 Mbit) · 484-ball UBGA (BFBGA) · Surface Mount (BGA) · Compliant · Industrial

✓ In Stock

$124.55 / Unit

View Datasheet →

10CX150YU484E5G

✅ Drop-In
Intel
📦 484-Ball UBGA (FCBGA)
Cyclone 10 GX · 150,000 LE · 54,770 ALM · 10.652 Mbit · 188 · 484-pin U484 BGA (UBGA / FCBGA), 19 mm x 19 mm, 1.0 mm pitch · 20 nm · 0.9 V

✓ In Stock

$128.65 / Unit

View Datasheet →

10CX105YU484I6G

✅ Drop-In
Intel
📦 484-Ball UBGA (FCBGA)
Cyclone 10 GX · 104,000 · [DATA_NEEDED: ALM count] · 8,641,536 bits (864 Kb) · 156 (18x18 multipliers) · 6 · Up to 12.5 Gbps · 4

✓ In Stock

$372 / Unit

View Datasheet →

10CX085YU484I6G

✅ Drop-In
Intel
📦 484-Ball UBGA (FCBGA)
Cyclone® 10 GX · 85,000 · 31,000 ALM · 5,959,680 bits (6.473 Mbit) · 188 · 484-FBGA (UBGA-484) · 0.9 V · 1.0 V / 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ In Stock

$155.6 / Unit

View Datasheet →

10CX150YU484I6G Maximum Ratings & Electrical Characteristics

Family Cyclone 10 GX
Logic Elements 150,000
Embedded Memory Bits 10,907,648
DSP Blocks 188
Process Technology 20 nm
Maximum Transceiver Data Rate 12.5 Gbps
Package 484-Ball UBGA (FCBGA)
Hard Memory Controller Yes (DDR3 / DDR4)
PCIe Hard IP Yes (up to PCIe Gen2 x4)
Hard Floating-Point DSP Yes (IEEE 754 single-precision)
Operating Temperature Grade Industrial (-40C to +100C)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

10CX150YU484I6G 484-ball ubga (fcbga) Pin Configuration Guide

Complete pinout information for 10CX150YU484I6G (484-ball ubga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball ubga (fcbga) package pinout diagram for 10CX150YU484I6G

No detailed pinout data available for 10CX150YU484I6G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CX150YU484I6G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CX150YU484I6G is suitable for 6 applications: Industrial Machine Vision, Broadcast Video Processing, Multi-Axis Motor Control, Smart Surveillance and Video Analytics, Small-Cell Wireless Backhaul, Test and Measurement Instrumentation.

🏭

Industrial Machine Vision

The 10CX150YU484I6G fits industrial machine-vision pipelines where parallel image sensors and GigE Vision / CoaXPress links must be aggregated and pre-processed at line rate. The 188 DSP blocks and hard IEEE 754 single-precision floating-point multipliers accelerate 2D filtering, color-space conversion, and CNN feature-map inference at up to ~12.5 Gbps per transceiver lane. Embedded 10.9 Mbit of block memory buffers full HD frames with minimal external SRAM, and the industrial (-40C to +100C) temperature grade supports factory-floor deployments. Place the FPGA between the camera receivers and the host CPU/SoM; use PCIe Gen2 x4 hard IP for the upstream DMA channel.

📺

Broadcast Video Processing

The 10CX150YU484I6G supports 4K/UHD broadcast video routing, multi-format format conversion, and light compression (JPEG XS / Tico) where 12.5 Gbps transceivers handle SDI (SMPTE ST 425 / ST 2082) and SMPTE 2110 IP-based video. The 484-ball BGA exposes enough LVDS pairs for parallel RGB/YCbCr interfaces and a DDR4 hard controller that absorbs frame-buffer latency. Hard floating-point DSP handles chroma upsampling and scaling kernels without consuming soft logic. Pair the FPGA with external HDMI 2.0 / 12G-SDI PHY devices; use the 10CX150YU484I5G when a lower speed grade suffices for 3G-SDI-only designs.

🏭

Multi-Axis Motor Control

The 10CX150YU484I6G drives multi-axis industrial servo and stepper systems where its 188 DSP blocks execute field-oriented control (FOC), space-vector PWM, and encoder interpolation loops in parallel. Hard IEEE 754 floating-point arithmetic ensures deterministic control-loop latency within a single FPGA fabric cycle, while 12.5 Gbps transceivers enable EtherCAT, PROFINET, or SERCOS III industrial-Ethernet MACs without external ASSPs. Industrial temperature grade (-40C to +100C) supports cabinet-mounted motion controllers. Use the FPGA alongside external gate drivers and current-sense ADCs; trade-off: the 105K variant 10CX105YU484I6G fits simpler 3-axis controllers with reduced logic budget.

🎥

Smart Surveillance and Video Analytics

The 10CX150YU484I6G enables smart IP-camera and NVR designs where 12.5 Gbps transceivers aggregate multiple GigE Vision / ONVIF streams while hard floating-point DSP executes background-subtraction, motion-detection, and lightweight CNN analytics in real time. The 10.9 Mbit of embedded block memory stores intermediate feature maps without external SRAM, keeping the BOM small. PCIe Gen2 x4 hard IP offloads analytics results to a host CPU/SoC over a single board-to-board link. Deploy in industrial-grade outdoor camera housings using the 10CX150YU484E6G extended-temperature variant for -40C cold-start reliability.

🌐

Small-Cell Wireless Backhaul

The 10CX150YU484I6G serves small-cell and pico-cell baseband plus CPRI / eCPRI backhaul designs where 12.5 Gbps transceivers digitize radio data and forward it over fiber to the baseband unit. Hard PCIe Gen2 x4 and the hardened DSP block fabric accelerate front-end FFT/IFFT, channel estimation, and pre-coding operations. The 484-ball BGA exposes enough LVDS to interface to radio ADC/DAC pairs, and the DDR3/DDR4 hard memory controller handles timing-critical buffers. For lower-density single-sector radios, the 10CX105YU484I6G offers the same footprint with reduced resource headroom.

🔬

Test and Measurement Instrumentation

The 10CX150YU484I6G is well suited to mid-range oscilloscope, protocol analyzer, and arbitrary-waveform-generator (AWG) front-ends where 12.5 Gbps transceivers acquire serial data streams and the 188 hard DSP blocks perform real-time FFT, FIR filtering, and signal conditioning. Embedded 10.9 Mbit of block memory captures deep pre-trigger traces without external SRAM, and the DDR4 hard controller streams post-processed data to the host CPU. Industrial temperature grade supports bench and lab environments. Use the 10CX150YF780I6G (780-ball) variant when the design needs additional LVDS for parallel ADC/DAC interfaces.

What is the Intel 10CX150YU484I6G?
The 10CX150YU484I6G is an Intel Cyclone 10 GX FPGA with 150,000 logic elements, 10,907,648 bits of embedded memory, and 188 DSP blocks, housed in a 484-ball UBGA package. It is built on a 20 nm process and supports up to 12.5 Gbps transceivers for PCIe Gen2 x4 and high-speed serial links, per the Intel Cyclone 10 GX device overview.
How many transceivers does the 10CX150YU484I6G have?
The 10CX150YU484I6G integrates transceivers capable of up to 12.5 Gbps per channel for high-speed serial protocols. The exact transceiver channel count for the U484 package variant is documented in the Cyclone 10 GX device datasheet - refer to the Intel/Altera ordering information for the U484 pinout map.
What is the difference between 10CX150YU484I6G and 10CX150YU484I5G?
The 10CX150YU484I6G is the industrial-temperature grade (I6) Cyclone 10 GX 150K LE FPGA, while 10CX150YU484I5G is typically the I5 speed/temperature variant of the same die and package. Both share the 484-ball UBGA footprint, making them drop-in compatible for most designs provided timing closure is verified in Quartus.
Where can I download the 10CX150YU484I6G datasheet?
The official datasheet and ordering information for the 10CX150YU484I6G can be downloaded from the Intel/Altera Cyclone 10 GX product page at altera.com or the Intel FPGA documentation portal. The device datasheet includes pin tables, DC/AC characteristics, and package thermal data for the U484 BGA.
What software is used to program the 10CX150YU484I6G?
The 10CX150YU484I6G is programmed using Intel Quartus Prime design software (Lite or Pro edition), with ModelSim-Intel FPGA for simulation. The Quartus toolchain supports Verilog, VHDL, and SystemVerilog HDL inputs and provides synthesis, place-and-route, timing closure, and programming file generation.
What is the price of 10CX150YU484I6G?
As of 2026-09-05, the 10CX150YU484I6G lists at approximately $184.50 per unit at qty-1, with distributor pricing dropping to about $151.90 at 500-piece quantities. Heisener.com lists $184.50 at 5,632-piece inventory; LCSC lists $47.27 for OEM-packaged reels. Real-time pricing should be confirmed with DigiKey or Mouser before quoting.
Is the 10CX150YU484I6G in stock?
Heisener.com lists approximately 5,632 pieces of the 10CX150YU484I6G in stock with confirmed lead time, and LCSC.com lists the part as in stock. Mouser and DigiKey may show limited or no stock for this legacy Intel/Altera OPN; cross-check Octopart for the latest inventory snapshot across authorized distributors.
What is the lead time for the 10CX150YU484I6G?
Heisener.com quotes a lead time of May 9 - May 14 for confirmed orders, and DigiKey typically ships the same day when stock is available. For high-volume orders above distributor stock, expect 6-12 weeks lead time from authorized Intel FPGA distributors; quote-on-request is recommended for production volumes.
What is a drop-in replacement for the 10CX150YU484I6G?
The closest drop-in replacements are other Intel Cyclone 10 GX 150K LE variants in the same 484-ball UBGA package, such as 10CX150YU484I5G (different speed/temp grade), 10CX150YU484E6G (extended temp), and 10CX150YU484E5G (extended temp, different speed). All share the same pinout and silicon, so they can replace the I6G part with a recompile.
Can 10CX105YU484I6G replace 10CX150YU484I6G?
The 10CX105YU484I6G is a smaller 105K-logic-element Cyclone 10 GX device in the same 484-ball UBGA package. It is footprint-compatible but provides fewer logic elements, DSP blocks, and memory bits than the 150K part. Replacing the 150K part with the 105K variant requires re-fitting the design within the smaller resource budget and may not be feasible for full 150K-utilization designs.
10CX150YU484I6G vs 10CX150YF780I6G - which is better?
Both share the same 150K Cyclone 10 GX silicon, but the YU484 device uses a 484-ball UBGA package while the YF780 uses a 780-ball FBGA with more user I/O. Choose the YF780 version when your design needs more LVDS pairs, wider external memory buses, or higher pin count; choose the YU484 when the smaller 484-ball footprint is acceptable and lower PCB complexity is preferred.
Is the 10CX150YU484I6G RoHS compliant?
Yes, the 10CX150YU484I6G is RoHS compliant per Intel's Cyclone 10 GX product family environmental compliance documentation. It is supplied lead-free in a Pb-free BGA package suitable for reflow assembly with standard lead-free SAC solder profiles.
Hey Google, can I replace 10CX150YU484I6G with a Cyclone V device?
No - the 10CX150YU484I6G is a Cyclone 10 GX device with 12.5 Gbps transceivers and 20 nm architecture, and it is not pin-compatible with any Cyclone V part. Cyclone V uses a different package pinout, different transceiver channel mapping, and different power-rail scheme, so any replacement requires PCB redesign and full re-validation.
What are the key specifications of 10CX150YU484I6G that engineers should know?
The 10CX150YU484I6G delivers 150,000 logic elements, 10,907,648 bits of embedded memory (about 10.4 Mbit), 188 DSP blocks, up to 12.5 Gbps transceivers with hard PCIe Gen2 x4 IP, hard IEEE 754 single-precision floating-point multipliers, and DDR3/DDR4 hard memory controllers. It is housed in a 484-ball UBGA package at industrial temperature grade, per the Intel Cyclone 10 GX device overview.
What is the best Lattice or AMD/Xilinx equivalent for 10CX150YU484I6G?
The best cross-brand equivalents in terms of logic density and 12.5 Gbps transceiver count are the Lattice ECP5-150K (LFE5UM-85F family) in a similar BGA package, and the AMD/Xilinx Artix-7 XC7A100T in FFG676. Neither is a true pin-to-pin drop-in replacement - the silicon, transceivers, and toolchain differ - but they offer comparable logic, DSP, and memory resources for similar mid-range applications.

Engineering reference data for 10CX150YU484I6G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CX150YU484I6G when your design requires the full 150,000 logic elements and all 188 DSP blocks of the Cyclone 10 GX family, with industrial temperature grade and 12.5 Gbps transceivers in a 484-ball UBGA. For cost-sensitive designs that fit within 105K or 85K logic elements, drop down to the 10CX105YU484I6G or 10CX085YU484I6G in the same package footprint. For higher pin count, move to the 10CX150YF780I6G (780-ball FBGA). For extended temperature, choose the 10CX150YU484E6G. None of these are pin-compatible with Cyclone V or other FPGA families - any cross-family migration requires full PCB redesign and toolchain change.

Comparison with Alternatives

Parameter This Product 10CX150YU484I5G 10CX150YU484E6G 10CX150YU484E5G 10CX105YU484I6G 10CX085YU484I6G
Brand Intel Intel Intel Intel Intel Intel
Package 484-Ball UBGA (FCBGA) 484-Ball UBGA (FCBGA) - same 484-Ball UBGA (FCBGA) - same 484-Ball UBGA (FCBGA) - same 484-Ball UBGA (FCBGA) - same 484-Ball UBGA (FCBGA) - same
Logic Elements 150,000 150,000 150,000 150,000 105,000 (-30%) 85,000 (-43%)
Embedded Memory (bits) 10,907,648 10,907,648 10,907,648 10,907,648 [DATA_NEEDED: Cyclone 10 GX 105K memory bits] [DATA_NEEDED: Cyclone 10 GX 85K memory bits]
DSP Blocks 188 188 188 188 [DATA_NEEDED] [DATA_NEEDED]
Maximum Transceiver Data Rate 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps
Temperature Grade Industrial (-40C to +100C) Industrial (I5 speed grade) Extended (E6) Extended (E5) Industrial (-40C to +100C) Industrial (-40C to +100C)
RoHS Compliance Yes Yes Yes Yes Yes Yes
Approx. Unit Price (qty 1, USD) $184.50 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] Lower (smaller die) Lower (smaller die)

Key Differentiators

  • Higher logic density (150K LE) versus Cyclone 10 GX 105K / 85K siblings (vs 10CX105YU484I6G / 10CX085YU484I6G)
  • Full hard floating-point DSP at no logic cost (vs Cyclone V SOC FPGAs (e.g., 5CSEBA6))
  • 20 nm process lowers static power versus prior 28 nm Cyclone V family (vs Cyclone V (5CGXFC7) in similar BGA)

Design Notes

Decouple every VCC and VCCA power rail of the 10CX150YU484I6G as close as possible to the BGA balls. Use a combination of 100 nF X7R ceramic capacitors on every rail plus 10 uF bulk capacitors per supply domain. The 12.5 Gbps transceiver rails (VCCR_GXB, VCCT_GXB) require the cleanest filtering - place 10 nF and 100 nF capacitors on each side of the ferrite bead that isolates them from the core logic supply. Estimated: at 100% transceiver utilization across all channels, total device power can exceed 15 W; thermal management must be sized accordingly.

The 484-ball UBGA package has a JEDEC-standard thermal resistance that requires a forced-air heatsink or large PCB copper pour for sustained 12.5 Gbps operation. Attach a thermal interface material (TIM) between the package lid and the heatsink; ensure mechanical pressure is within the BGA coplanarity spec. Estimated: at 85C ambient and 15 W dissipation, a 4-layer PCB with 1 oz copper yields junction temperature near 105C - verify with thermal simulation using the device's DELTA-T model before sign-off.

Use a minimum 6-layer PCB stack-up for the 484-ball BGA with continuous ground and power planes beneath the package. Microstrip/stripline trace impedance must be 100 ohm differential for transceiver channels and 50 ohm single-ended for general-purpose LVCMOS/LVDS. Match the transceiver pair lengths within 150 mil to maintain signal integrity at 12.5 Gbps. Reference Intel Cyclone 10 GX device PCB design guidelines for via-stitching and decoupling placement recommendations.

Do not assume the I5, E5, and E6 OPN variants share identical timing characteristics - always re-fit and re-run timing analysis in Quartus when migrating between temperature/speed grades. Verify configuration scheme (AS, PS, JTAG, or FPP) and dual-boot image support before board bring-up. Estimated: a typical 80% utilization compile for Cyclone 10 GX 150K may take 30-90 minutes in Quartus Pro; plan CI pipelines accordingly.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free per Intel Cyclone 10 GX product family environmental compliance. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-grade part. Halogen-free per Intel FPGA material declarations.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10CX150YU484I6G Cyclone 10 GX 10CX150YU484I5G 10CX150YU484E6G 10CX150YU484E5G 10CX105YU484I6G 10CX085YU484I6G FPGA field-programmable gate array programmable logic device 484-ball UBGA FCBGA BGA 20 nm process logic element DSP block 12.5 Gbps transceiver PCIe Gen2 DDR3 DDR4 hard memory controller IEEE 754 floating point Quartus Prime RoHS industrial temperature grade machine vision video processing motion control smart surveillance small-cell backhaul test and measurement
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