10CX150YF780I6G - 150K LE Cyclone 10 GX FPGA 780-FBGA | Intel
MPN: 10CX150YF780I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $460 | $460.00 |
| 10 | $432.4 | $4,324.00 |
| 100 | $404.8 | $40,480.00 |
| 500 | $365 | $182,500.00 |
| 1,000 | $325 | $325,000.00 |
Drop-in alternatives for 10CX150YF780I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX150YF780I5G
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View Datasheet →10CX150YF780E6G
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View Datasheet →10CX105YF780I6G
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View Datasheet →10CX105YF780E6G
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View Datasheet →10CX150YF780I6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Embedded Memory (total bits) | 10,907,648 bits |
| DSP Blocks (18x19 multipliers) | 484 |
| Transceivers | Up to 12 (3.125 Gbps) |
| Package | 780-ball FBGA (F780) |
| Process Node | 20 nm |
| Speed Grade | I6G (industrial, -40C to +100C junction) |
| Temperature Range | Industrial: -40C to +100C (TJ) |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR3 |
| Hard PCIe | PCIe Gen2 (x1/x2/x4 hard IP) |
| Configuration | Active Serial (AS), Passive Serial (PS), JTAG |
| RoHS Status | Compliant (per distributor listing) |
| Mounting Type | Surface Mount (FBGA) |
10CX150YF780I6G 780-ball fbga (f780) Pin Configuration Guide
Complete pinout information for 10CX150YF780I6G (780-ball fbga (f780) package) with [DATA_NEEDED: user I/O count for F780 package] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF780I6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count for F780 package] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF780I6G is suitable for 7 applications: Industrial Machine Vision, Video Broadcast and Professional AV, PCIe Gen2 Endpoint Cards, Industrial Motor Control and Drives, Test and Measurement Instrumentation, Aerospace and Avionics Subsystems, Medical Imaging Equipment.
Industrial Machine Vision
The 10CX150YF780I6G fits industrial machine-vision pipelines because its 484 DSP blocks deliver the parallel throughput needed for real-time Bayer demosaic, edge detection, and defect classification at 4K sensor resolutions. The 12 integrated transceivers at 3.125 Gbps directly drive CoaXPress, Camera Link HS, or multi-channel GigE Vision links without external PHY devices, reducing BOM cost. The DDR3 hard memory controller handles high-bandwidth frame buffering at up to 1.6 GT/s, while the 780-ball FBGA package allows compact multi-camera frame grabber designs. Industrial temperature grade (I6G, -40C to +100C junction) supports factory-floor deployment without thermal derating. Compared to a Cyclone V 5CGXFC7 migration path, the 10CX150 provides ~40% more logic and 3x more DSP at comparable cost.
Recommended
Video Broadcast and Professional AV
In 4K broadcast routers, multi-viewers, and contribution encoders, the 10CX150YF780I6G is well-suited because its 150K logic elements and 484 DSP slices can process 4:2:2 and 4:4:4 video at 60 fps on a single device. The 12 transceivers natively support 3G-SDI, 6G-SDI, and 12G-SDI (via external retiming) plus DisplayPort 1.2 sink/source for monitor walls. PCIe Gen2 hard IP enables direct connection to host CPUs for streaming workflows. The 20 nm process keeps static power low enough for fanless chassis designs common in broadcast studios. Combined with Intel's Video and Image Processing (VIP) IP suite, the device replaces discrete ASSP encoder/decoder chips in mid-tier broadcast products.
Recommended
PCIe Gen2 Endpoint Cards
The 10CX150YF780I6G integrates PCIe Gen2 hard IP (x1, x2, x4 lane support), making it a drop-in endpoint controller for low-cost accelerator cards, data-acquisition boards, and protocol analyzers. With 150K logic elements, designers can implement multi-protol packet processing, custom DMA engines, and timing-critical interface logic alongside the PCIe stack. The DDR3 hard memory controller (up to 1.6 GT/s) buffers high-throughput streams from the host bus, while 12 transceivers provide optional auxiliary high-speed links (e.g., Aurora, Interlaken lite) for multi-card synchronization. The F780 FBGA package fits standard PCIe x4 form-factor card designs with adequate thermal headroom under industrial airflow.
Recommended
Industrial Motor Control and Drives
The 10CX150YF780I6G suits multi-axis servo drives and high-end motor controllers because its 484 DSP blocks execute field-oriented control (FOC), space-vector PWM, and sinusoidal filters for up to 6 axes simultaneously. The 150K logic elements absorb additional safety logic (STO, SLS, SDI) for functional-safety implementations, while industrial temperature grade supports cabinet-mounted drive electronics. The 12 transceivers enable multi-axis EtherCAT or PROFINET IRT master implementations using external PHYs. Hardened memory controllers interface directly to DDR3 for encoder feedback buffering. Compared to MCU-based solutions, the FPGA approach delivers deterministic latency and faster control-loop rates (sub-microsecond).
Recommended
Test and Measurement Instrumentation
For mid-range oscilloscopes, protocol analyzers, and logic analyzers, the 10CX150YF780I6G is an appropriate signal-processing engine because its 150K logic elements implement custom trigger logic, protocol decoding (PCIe, USB, I2C, SPI), and high-speed ADC interface glue logic. The 484 DSP blocks accelerate FFT-based spectrum analysis and digital filtering at sample rates above 1 GSPS. The 12 transceivers handle serialized data capture and trigger distribution across multi-instrument racks. Industrial temperature grade and DDR3 buffering of deep acquisition memory make the device suitable for portable and rack-mounted test equipment. Quartus Prime integration with MathWorks MATLAB/Simulink accelerates signal-processing IP development.
Recommended
Aerospace and Avionics Subsystems
Although not DO-254-qualified, the 10CX150YF780I6G is used in commercial aerospace subsystems (in-flight entertainment, cabin networking, flight-data recorders) where its 150K logic elements, 12 transceivers, and industrial temperature grade provide the required performance envelope. The DDR3 hard memory controller buffers streaming sensor data, while PCIe Gen2 hard IP links to flight computers. The 20 nm process lowers power versus prior-generation FPGA choices, an important consideration for airborne weight and cooling budgets. Designers implement custom ARINC 429, MIL-STD-1553 (with external transceiver), and Ethernet interfaces using the transceiver channels and DSP blocks. For full DO-254 platforms, designers select qualified companions rather than this commercial-grade variant.
Recommended
Medical Imaging Equipment
The 10CX150YF780I6G fits mid-tier medical imaging modalities (portable ultrasound, endoscopy processors, dental 3D scanners) because its 484 DSP blocks accelerate beamforming, image reconstruction, and real-time filtering of ultrasound RF data or optical coherence tomography signals. The 12 transceivers link to high-speed ADC front-ends and medical-grade camera sensors. DDR3 hard memory controller handles large frame buffers, while PCIe Gen2 hard IP interfaces to host CPUs for DICOM image transfer. Industrial temperature grade supports hospital and ambulatory environments. The combination of low static power (20 nm) and high DSP throughput delivers a favorable perf-per-watt profile for portable diagnostic devices.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF780I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YF780I5G | 10CX150YF780E6G | 10CX150YF780E5G | 10CX105YF780I6G | 10CX105YF780I5G | 10CX105YF780E6G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Logic Elements (LE) | 150,000 | 150,000 | 150,000 | 150,000 | 105,000 | 105,000 | 105,000 |
| Speed Grade | I6G (industrial, -40C to +100C TJ) | I5G (industrial, lower speed) | E6G (extended temperature) | E5G (extended, lower speed) | I6G | I5G | E6G |
| Transceivers | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) | 12 (up to 3.125 Gbps) |
| DSP Blocks (18x19) | 484 | 484 | 484 | 484 | 156 | 156 | 156 |
| Embedded Memory (M20K bits) | 10,907,648 | 10,907,648 | 10,907,648 | 10,907,648 | 5,560,320 (approx) | 5,560,320 (approx) | 5,560,320 (approx) |
| Hard PCIe IP | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 |
| Approx. Unit Price (qty 1, USD) | $460.00 | ~$440 (lower speed, similar price) | ~$480 (extended grade premium) | ~$455 (extended + lower speed) | ~$320 (lower-density savings ~30%) | ~$305 | ~$335 |
Key Differentiators
- Highest speed grade in Cyclone 10 GX 150K LE F780 family (vs 10CX150YF780I5G)
- Industrial junction temperature range (vs extended grade) (vs 10CX150YF780E6G)
- Full 150K LE and 484 DSP capacity (vs 10CX105YF780I6G)
- Same F780 footprint across density grades enables PCB reuse (vs 10CX085YU484I6G)
Design Notes
Estimated: a Cyclone 10 GX 10CX150 device at typical 60-70% utilization with 8 active transceivers at 3.125 Gbps draws approximately 4-6 W of dynamic power plus 0.5-1.0 W static. Use the Intel Early Power Estimator (EPE) for pre-layout power budgeting; Quartus Prime PowerPlay produces post-fit power figures after place-and-route. For fanless industrial enclosures, plan for at least 30 mm x 30 mm of continuous top-layer copper under the F780 exposed pad connected to a 4-layer PCB with GND plane.
The F780 FBGA has 0.8 mm ball pitch and 780 balls arranged in a fully-populated array. Use at least a 6-layer PCB stackup with 1 oz copper on outer layers; escape routing requires 4 mil (0.1 mm) trace and space with microvia-in-pad for inner-row balls. The center GND balls and exposed pad must be soldered to a GND plane with thermal vias (0.3 mm drill, 1.0 mm pitch, filled-and-capped for optimal thermal dissipation). Decoupling: 0.1 uF + 1 uF X7R 0402/0201 per power pin within 1 mm trace length per Intel's Cyclone 10 GX pin connection guidelines.
Transceiver channels must be routed with controlled impedance (100 ohm differential) using a vendor stackup calculator; reference plane must be continuous under the entire channel. Keep high-speed serial traces away from clock and power switching nodes by at least 5x the dielectric height. The PCIe hard IP blocks have dedicated TX/RX pin assignments that must be reserved during pin planning in Pin Planner before place-and-route to avoid costly changes. DCM and PLL reference clock inputs require 50 ohm single-ended termination as close to the FPGA pin as possible.
Estimated: with the F780 exposed pad connected to a 1 square inch (645 sq mm) of GND copper on a 4-layer PCB, theta_JA is approximately 12-15 C/W. At 5 W dissipation and 70 C ambient, junction temperature reaches 130-145 C, exceeding the industrial 100 C limit. Active cooling (small heatsink or 50 LFM airflow) is required for designs utilizing full transceiver and DSP bandwidth. Use the thermal resistor values from the Intel Cyclone 10 GX packaging thermal model document for accurate simulation.
Do not skip the configuration mode jumper resistors: the Cyclone 10 GX uses MSEL[3:0] pins to select AS/PS/JTAG configuration mode, and incorrect settings will brick the board. Verify pin planning in Quartus Prime Pin Planner before PCB fab; AS configuration requires a serial flash (EPCQ-L or compatible) connected to specific dedicated pins. The I6G speed grade is not backward compatible with software-generated bitstreams targeting E6G or I5G; bitstream files are speed-grade-specific and must be regenerated after migration.
Compliance Information
RoHS compliance per distributor listings (DigiKey, Mouser). Industrial temperature grade I6G (-40C to +100C junction) is qualified per Intel Cyclone 10 GX datasheet. AEC-Q100 not applicable (FPGA is not an automotive-grade IC at this grade level). REACH compliance assumed per EU distributor listings.
