10M02DCU324I7G - MAX 10 FPGA 2K LE, 160 I/O, U324 BGA | Intel
MPN: 10M02DCU324I7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.36 | $2.36 |
| 10 | $2.18 | $21.80 |
| 100 | $1.95 | $195.00 |
| 500 | $1.74 | $870.00 |
| 1,000 | $1.55 | $1,550.00 |
Drop-in alternatives for 10M02DCU324I7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M02DCU324C8G
β Drop-Inπ Reference alternative (not in catalog)
10M02DCU324A7G
β Drop-Inβ In Stock
$6.3 / Unit
View Datasheet β10M02DCU324I6G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCU324A6G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCU324C7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LEs) | 2,000 |
| Embedded Memory (M9K blocks) | 16 |
| Embedded Memory (bits) | 110,592 |
| Embedded Multipliers (18x18) | 16 |
| User I/O Count | 160 |
| User I/O Banks | 8 |
| Package | 324-ball UBGA (U324) |
| Pin/Pitch | 324 balls / 0.8 mm pitch |
| Process Node | 55 nm |
| Configuration Memory | On-chip dual-boot flash |
| Core Voltage (VCCINT) | 1.2 V |
| Analog Block | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| RoHS Status | Compliant |
10M02DCU324I7G 324-ball ubga (u324) Pin Configuration Guide
Complete pinout information for 10M02DCU324I7G (324-ball ubga (u324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M02DCU324I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M02DCU324I7G is suitable for 6 applications: Industrial Motor Control, Human-Machine Interface (HMI) and Touch Panels, Sensor Fusion and Data Acquisition Front-Ends, Protocol Bridging and I/O Expansion, Portable Test and Measurement Instruments, LED Lighting and Signage Control.
Industrial Motor Control
The 10M02DCU324I7G is well suited to industrial motor control and inverter drive front-ends because the on-die 12-bit SAR ADC samples motor phase currents and bus voltage without an external ADC chip, and the 16 embedded 18x18 multipliers implement field-oriented control (FOC) and Clarke/Park transforms in real time. With 2,000 LEs the device fits a single-axis FOC plus PWM and protection logic; per the MAX 10 datasheet the 160 user I/O drive gate-driver signals, encoder feedback, and CAN/UART comms. Industrial I7 temperature grade (-40C to +100C) matches cabinet and motor-mount environments without derating.
Recommended
Human-Machine Interface (HMI) and Touch Panels
The 10M02DCU324I7G drives TFT LCD panels and capacitive touch interfaces in industrial HMI terminals, bridging RGB/parallel display data from a host processor and running the touch-scan state machine directly. Per Intel MAX 10 datasheet, the 160 user I/O and LVCMOS 1.8/2.5/3.3 V I/O standards cover 24-bit parallel display buses plus SPI/I2C touch controllers, while the on-die 12-bit ADC reads backlight current for closed-loop dimming. The integrated configuration flash means the HMI boots instantly at power-on without wait states, critical for operator UX.
Recommended
Sensor Fusion and Data Acquisition Front-Ends
The 10M02DCU324I7G integrates sensor signal conditioning, on-die ADC sampling, and pre-processing FFT/averaging in a single chip for multi-sensor data acquisition front-ends. According to the MAX 10 datasheet, the 12-bit SAR ADC with up to [DATA_NEEDED: ADC channel count] channels multiplexes thermocouple, RTD, strain-gauge, and 4-20 mA loop inputs, while 2,000 LEs implement digital filtering and alarm logic. Industrial temp grade and 160 I/O support multi-channel industrial sensor hubs with one FPGA replacing MCU plus external ADC plus CPLD glue.
Recommended
Protocol Bridging and I/O Expansion
The 10M02DCU324I7G implements low-latency protocol bridges (UART to SPI, I2C to parallel, CAN to Ethernet) and I/O expansion for legacy industrial controllers lacking modern interfaces. Per Intel MAX 10 datasheet, the 160 user I/O and 8 I/O banks allow mixed-voltage bridging (3.3 V host to 1.8 V peripheral) on one chip, while the embedded 110 Kbit block RAM buffers packet payloads. This makes the device ideal for retrofitting Modbus RTU to Ethernet/IP gateways or adding 32-bit GPIO to embedded Linux boards.
Recommended
Portable Test and Measurement Instruments
The 10M02DCU324I7G powers portable oscilloscopes, logic analyzers, and bench-top meters, where 2,000 LEs implement capture state machines and 18x18 multipliers run real-time DSP on the analog front-end stream. According to the MAX 10 datasheet, instant-on dual-boot flash eliminates boot wait at power-on, and 12-bit ADC integrates with the analog front-end for self-test calibration routines. The 1.2 V core plus on-die regulators keep quiescent current low for battery-powered handhelds, while the U324 industrial temp grade tolerates field use.
Recommended
LED Lighting and Signage Control
The 10M02DCU324I7G drives high-channel-count LED walls, architectural lighting, and signage where each LED node requires PWM dimming and fault monitoring. Per Intel MAX 10 datasheet, 160 user I/O support direct drive of 32-bit LED driver chains (4-wire serial), 18x18 multipliers run CIE color-space conversions, and the 12-bit ADC reads LED current sense for closed-loop brightness control. Industrial I7 temperature grade and instant-on flash make the device ideal for outdoor DMX/sACN and Art-Net lighting controllers.
Recommended
Recommended Products Summary
Engineering reference data for 10M02DCU324I7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02DCU324C8G | 10M02DCU324A7G | 10M02DCU324I6G | 10M02DCU324A6G | 10M02DCU324C7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Temperature Grade | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C8) | Automotive/Extended -40C to +125C (A7) | Industrial -40C to +100C (I6, slower speed) | Automotive -40C to +125C (A6, slower speed) | Commercial 0C to +85C (C7, fast speed) |
| Speed Grade | I7 (fast industrial) | C8 (fast commercial) | A7 (fast automotive) | I6 (slow industrial) | A6 (slow automotive) | C7 (fast commercial) |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| Embedded 18x18 Multipliers | 16 | 16 | 16 | 16 | 16 | 16 |
| User I/O Count | 160 | 160 | 160 | 160 | 160 | 160 |
| On-chip Configuration Flash | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) |
| 12-bit SAR ADC | Yes (integrated) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade at fast speed bin (vs 10M02DCU324C8G)
- Industrial temperature envelope (vs automotive extended) (vs 10M02DCU324A7G)
- Instant-on dual-boot configuration flash on-die (vs Cyclone V FPGAs in same density)
Design Notes
Estimated: at typical utilization (~70% LEs, 50% RAM, full I/O switching at 100 MHz) the 10M02DCU324I7G core VCCINT 1.2 V draws roughly 200-400 mA, and I/O VCCIO banks draw another 5-50 mA per bank depending on toggle rate and load. Use a low-noise 1.2 V LDO (e.g., TPS7A4701) for VCCINT and per-bank LDO for VCCIO, with 10 uF bulk ceramic plus 0.1 uF X7R decoupling on every supply pin. Per the Intel MAX 10 pin connection guidelines, VCCA analog supply must be tied to a clean 2.5 V rail even if the ADC is unused, to prevent leakage.
The U324 0.8 mm pitch BGA requires microvia or via-in-pad PCB technology; use ENIG surface finish and J-STD-020 MSL3 handling. Per Intel MAX 10 datasheet pin connection guidelines, route 8 I/O bank VCCIO supplies as separate planes so mixed-voltage interfacing (1.8 V + 3.3 V) does not require external level shifters. Place the dedicated JTAG pins (TCK/TMS/TDO/TDI) with 4.7 kΞ© pull-ups on TCK plus TMS to keep the configuration port stable in noisy industrial environments.
Estimated: the U324 package theta-JA is approximately 25-30 C/W on a 4-layer 2 oz copper PCB, so at 0.5 W dissipation the junction rises 12-15 C above ambient. Per the Intel MAX 10 datasheet, the industrial I7 temperature grade envelope is -40C to +100C, so headroom is adequate in cabinet environments. For fanless operation in sealed enclosures, place thermal vias under the BGA center and on the perimeter ground balls to spread heat, and consider 6-layer stackup with 1 oz inner copper for additional dissipation.
Do not leave VCCA analog supply floating - per Intel MAX 10 datasheet pin connection guidelines, VCCA must be tied to a clean 2.5 V rail even if the integrated 12-bit ADC is unused, otherwise leakage paths cause core current creep and possible latch-up. Also ensure the dual-boot configuration flash is programmed with a valid image in both CFM0 and CFM1 before field deployment, or the instant-on guarantee fails. Finally, never hot-swap VCCINT without powering down VCCIO first, as the on-die regulators can latch.
Compliance Information
Per Intel/Altera MAX 10 material declaration data sheet: RoHS compliant, lead-free solder balls only, halogen-free per JEDEC JS709B, REACH compliant. Not AEC-Q100 qualified in I7 grade - choose A7 variant for AEC-Q100 automotive. MSL3 per J-STD-020 handling required.
