10M02DCU324A7G - MAX 10 FPGA, 2K LE, 160 I/O, 324-UBGA | Intel
MPN: 10M02DCU324A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.68 | $10.68 |
| 10 | $9.85 | $98.50 |
| 100 | $8.72 | $872.00 |
| 500 | $7.45 | $3,725.00 |
| 1,000 | $6.3 | $6,300.00 |
Drop-in alternatives for 10M02DCU324A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M02DCU324I7G
β Drop-Inβ In Stock
$1.55 / Unit
View Datasheet β10M02DCU324C8G
β Drop-Inπ Reference alternative (not in catalog)
10M02DCU324A7G
β Drop-Inβ In Stock
$6.3 / Unit
View Datasheet β10M02SCU324A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCV36A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCU324A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| Embedded Memory | 110,592 bits |
| User I/O Count | 160 |
| Embedded 18x18 Multipliers | 16 |
| User Flash Memory | Integrated (on-chip flash configuration) |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation |
| Core Voltage | 1.15 V to 1.25 V |
| Operating Junction Temperature | -40 C to +125 C (TJ) |
| Package Type | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 15 x 15 mm |
| Mounting Type | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) |
| RoHS Status | Compliant |
10M02DCU324A7G Pin Configuration
| Pin A1 | IO β User I/O (multi-function; specific function per pin-out file) |
| Pin A2 | IO β User I/O |
| Pin A3 | GND β Ground reference |
| Pin A4 | VCCIO β I/O bank supply voltage |
| Pin A5 | IO β User I/O |
| Pin B1 | IO β User I/O |
| Pin B2 | VCCINT β Core logic supply (1.15-1.25 V) |
| Pin B3 | IO β User I/O |
| Pin B4 | IO β User I/O |
| Pin B5 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M02DCU324A7G is suitable for 6 applications: Industrial Motor Control, Multi-Protocol Sensor Interface Bridge, LED Display Video Wall Controllers, Low-Cost Machine Vision Pre-Processing, Power Conversion & Inverter Control, Automotive Body Electronics & I/O Expansion.
Industrial Motor Control
The 10M02DCU324A7G's 16 embedded 18x18 multipliers and integrated 12-bit ADC make it well suited for field-oriented control (FOC) loops on permanent-magnet and induction motor drives. The 2,000 logic elements can host the full FOC state machine, current-loop PI controllers, and SVM modulator in a single device, while the 160 I/O drive three-phase PWM outputs plus encoder / Hall-sensor inputs. Unlike a microcontroller approach, the FPGA gives deterministic single-cycle loop times below 1 us, which is critical for high-RPM precision servo applications.
Recommended
Multi-Protocol Sensor Interface Bridge
The 10M02DCU324A7G's 160 I/O and reconfigurable I/O standards let it bridge between heterogeneous industrial protocols - for example, I2C sensor arrays feeding SPI or UART host controllers, or MII/RGMII Ethernet to parallel sensor data. The 2,000 logic elements are sufficient to implement multi-master I2C controllers, SPI peripherals, and protocol-format converters in parallel. The on-chip user flash can store per-protocol bitstreams and bootloader code, enabling a single FPGA to support firmware-over-Ethernet field upgrades.
Recommended
LED Display Video Wall Controllers
For medium-resolution LED video walls, the 10M02DCU324A7G can drive up to 16 high-speed LVDS pairs simultaneously, supporting HUB75 LED panels at 1/16 scan rate up to 384x384 pixels per device. The integrated multipliers and dual-clock PLL handle gamma correction and color-space conversion. The non-volatile instant-on flash boot lets the panel start displaying test patterns within 50 ms of power-on - useful for safety signage that must show content immediately.
Recommended
Low-Cost Machine Vision Pre-Processing
The 10M02DCU324A7G can implement real-time Sobel / Laplacian edge detection on a parallel-pixel camera interface using its 16 multipliers and embedded SRAM as line buffers. The integrated 12-bit ADC supports direct connection to analog industrial cameras, while the 160 I/O drive a 24-bit RGB output bus plus overlay text layers. For higher-resolution applications, multiple 10M02 devices can be cascaded over LVDS, scaling to multi-megapixel inspections at low total cost.
Recommended
Power Conversion & Inverter Control
The 10M02DCU324A7G's deterministic logic and on-chip 12-bit ADC are well matched to digital-control loops in solar inverters, UPS systems, and telecom rectifiers. The 2,000 LE host the full digital controller (PI compensators, ramp generator, MPPT for solar), while 160 I/O support parallel MOSFET / IGBT gate-driver interfaces plus AC-line current sensing. The on-chip user flash stores calibration constants and protection thresholds - critical for non-volatile fault logging.
Recommended
Automotive Body Electronics & I/O Expansion
The 10M02DCU324A7G's -40 C to +125 C extended-industrial junction-temperature range and high I/O count support automotive body-control applications such as body-comfort modules, HVAC controllers, and BCM I/O expansion. With 160 I/O it can interface directly to LIN / CAN transceivers plus discrete switches / LEDs without external bus-expanders. Designers should note that this part is not AEC-Q100 qualified; for AEC-Q100 grade-1 / grade-2 applications, select the MAX 10 'A7G' automotive variants or the Cyclone 10 LP 'A7G' parts.
Recommended
Recommended Products Summary
Engineering reference data for 10M02DCU324A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02DCU324I7G | 10M02DCU324C8G | 10M02SCU324A7G | 10M02DCV36A7G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 324-UBGA (15x15 mm) | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical | 324-UBGA (15x15 mm) - identical |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| User I/O | 160 | 160 | 160 | 160 | 160 |
| Speed Grade | A7 (industrial, fast) | I7 (industrial, ~15% slower than A7) | C8 (commercial, ~20% slower than A7) | A7 | A7 |
| Operating Temperature | -40 C to +125 C (TJ) | -40 C to +100 C (industrial guaranteed) | 0 C to +85 C (commercial) | -40 C to +125 C (TJ) | -40 C to +125 C (TJ) |
| Approx. Unit Price (qty-1) | $10.68 | $11.50 (estimated) | $9.85 (estimated) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile on-chip flash boot (vs Cyclone 10 LP 10CL02 family)
- Integrated 12-bit SAR ADC (vs Lattice iCE40 LP1K)
- 160 user I/O in BGA-324 footprint (vs MAX 10 10M02 in M153 or U169 packages)
- A7 speed grade at -40 C to +125 C extended industrial (vs 10M02DCU324C8G (C8 commercial grade))
Design Notes
The 324-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W with a standard JEDEC 4-layer test board, but this degrades in dense PCB layouts with limited inner copper. For designs running at sustained high toggle rates above 50 MHz and high I/O utilization, use 8 thermal balls on the package bottom and connect them through to a ground plane with thermal vias (12-mil drill, 0.5 oz plating). Without this, junction-temperature derating may occur in sealed industrial enclosures at +70 C ambient.
The 15x15 mm 324-ball UBGA uses a 0.8 mm ball pitch - assembly requires PCB microvia or laser-drilled via technology (not standard 4-layer through-hole FR-4 alone). Use a 1-6-1 stack-up with HDI microvias from the top layer to internal ground planes for the BGA fanout. Allow at least 8 mm of perimeter trace space around the BGA for via fanout and reference-plane stitching capacitors; signal-integrity simulation is recommended for any DDR3 or LVDS pair routing through the BGA.
Do not confuse the 10M02DCU324A7G (MAX 10 family, non-volatile flash) with the Cyclone 10 LP 10CL02 parts (volatile SRAM, requires external configuration PROM). Both have similar LE counts but differ in boot behavior and toolchain IP libraries - Quartus Prime generates non-compatible bitstreams between the two families. Also note that the MAX 10 '10M02' is distinct from the MAX V '5M02' family; check the prefix '10M' vs '5M' before placing an order.
Place the 12-bit ADC analog power pins (VCCA) decoupled with 10 uF + 0.1 uF + 1 nF star topology - keep digital return currents out of the analog ground island. Use the Quartus Prime Pin Planner to assign differential I/O pairs (LVDS) before floorplanning, since the IOE structure of the MAX 10 imposes specific pair-placement rules for proper placement of the differential buffer and termination network.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is the standard industrial-temperature variant; for AEC-Q100 automotive grades, refer to the 10M02 automotive ordering part numbers (separate OPN).
