Intel

10M02SCU169A7G - MAX 10 FPGA, 2K LE, 169-UBGA | Intel / Altera

MPN: 10M02SCU169A7G βœ“ Active
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1.0 V / 1.2 V Vdss 169-ball UBGA (U169) Package 7 Speed 110,592 bits Memory
From $13.42 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $22.75 $22.75
10 $20.48 $204.80
100 $17.95 $1,795.00
500 $15.21 $7,605.00
1,000 $13.42 $13,420.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M02SCU169A7G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

10M02SCE144A7G

βœ… Drop-In
Intel
πŸ“¦ 144-pin EQFP
MAX 10 Β· 2,000 Β· 101 Β· 1,016 Kbit Β· 1,008 Kbit (110,592 bit per datasheet) Β· 16 Β· 2 Β· DDR3 / LPDDR2

βœ“ In Stock

$4.62 / Unit

View Datasheet β†’

10M02SCU169C8G

βœ… Drop-In
πŸ“¦ 169-ball UBGA (U169)
same U169 package, commercial 0C to +85C temp range vs industrial -40C to +125C

πŸ“‹ Reference alternative (not in catalog)

10M02SCU169I7G

βœ… Drop-In
πŸ“¦ 169-ball UBGA (U169)
same U169 package, industrial temp grade, identical pinout

πŸ“‹ Reference alternative (not in catalog)

10M02SCU169A8G

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 169-ball UBGA (U169)
same U169 package, speed grade 8 (slower), pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

LCMXO2-2000HC-4TG144C

βœ… Drop-In
πŸ“¦ 144-pin TQFP
same 2K LUT density, non-volatile flash, TQFP-144 package vs UBGA-169 (requires PCB layout change, but pin-compatible logic interface)

πŸ“‹ Reference alternative (not in catalog)

XC2C32A-6VQG44C

βœ… Drop-In
πŸ“¦ 44-pin VQFN
Xilinx CoolRunner-II CPLD equivalent, 32 macrocells, much lower logic density, requires full PCB redesign

πŸ“‹ Reference alternative (not in catalog)

10M02SCU169A7G Maximum Ratings & Electrical Characteristics

Family MAX 10
Logic Elements (LEs) 2,000
Adaptive Logic Modules (ALMs) 160
User Flash Memory 110,592 bits
Block RAM (M9K) 138 Kbits
DSP Blocks (18x18 Multipliers) 12
PLLs 4 (fractional)
Maximum User I/O Pins 130
Package 169-ball UBGA (U169)
Package Size 11 x 11 mm
Process Technology 55 nm embedded flash (TSMC)
Configuration Method Internal flash, dual-boot support
Operating Temperature -40C to +125C (industrial)
Core Voltage 1.0 V / 1.2 V
Speed Grade 7
RoHS Status Compliant

10M02SCU169A7G 11 x 11 mm Pin Configuration Guide

Complete pinout information for 10M02SCU169A7G (11 x 11 mm package) with 130 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

11 x 11 mm package pinout diagram for 10M02SCU169A7G

No detailed pinout data available for 10M02SCU169A7G.

Refer to the datasheet for full pin configuration.

Estimated pin count: 130 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M02SCU169A7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M02SCU169A7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Sensor Pre-Processing, Portable Medical Device Glue Logic, Low-Cost Video Processing & Bridging, Power Sequencing & Hot-Swap Control.

🏭

Industrial Motor Control

The 10M02SCU169A7G's 2,000 logic elements and 12 DSP 18x18 multipliers are well-matched to sensorless FOC and trapezoidal BLDC motor control loops, while the 169-ball UBGA package supports the wide pin count required for multi-axis encoder feedback. The device's industrial -40C to +125C temperature rating suits factory-floor cabinet environments, and instant-on flash configuration eliminates boot-time delays during safety-critical power-up sequencing. Quartus Prime DSP Builder and the integrated 12-bit ADC (separate ADC block on larger MAX 10) provide closed-loop current sensing without an external ADC chip.

🏭

Factory Automation I/O Expansion

With 130 user I/Os, the 10M02SCU169A7G can aggregate dozens of 24V industrial signals, perform level translation between 3.3V LVCMOS and 5V LVTTL, and add protocol bridging (Modbus, RS-485, I2C, SPI) in a single chip. The on-chip user flash stores configuration parameters and calibration constants per production line, while instant-on flash boot eliminates PLC scan-time jitter at startup. The wide LVDS support enables high-speed encoder and fieldbus interfaces.

πŸš—

Automotive Sensor Pre-Processing

The 10M02SCU169A7G's industrial temperature rating and robust 55 nm embedded flash process make it suitable for in-cabin sensor pre-processing in entry-level ADAS, body controllers, and driver-monitoring subsystems. The 2,000 LEs can implement image-pipeline pre-filters (resize, color-space conversion) before forwarding data to an external SoC over LVDS, while the 12 DSP blocks accelerate fixed-point FFT pre-processing for ultrasonic parking sensors. AEC-Q100 qualification status should be verified per specific MAX 10 part variant.

πŸ’Š

Portable Medical Device Glue Logic

In portable medical devices (blood-glucose meters, pulse oximeters, handheld ECGs), the 10M02SCU169A7G replaces multiple discrete CPLDs and logic buffers by consolidating display control, keypad scanning, battery management, and sensor I/O into a single programmable device. The 110 Kbits of user flash stores calibration coefficients and device serial numbers, while the instant-on capability supports fast wake-from-standby user experiences. Low static power consumption and small UBGA-169 footprint suit battery-powered handheld form factors.

πŸ“Ί

Low-Cost Video Processing & Bridging

The 10M02SCU169A7G supports LVDS, MIPI D-PHY (with external resistors), and CMOS video interfaces, enabling low-cost video bridging applications such as format conversion between MIPI-CSI and parallel CMOS, frame-buffer cropping, and OSD overlay. The 12 x 18x18 DSP multipliers perform real-time color-space conversion and gamma correction. The dual-boot flash supports secure boot and field firmware updates for video processing modules in kiosks and digital signage.

⚑

Power Sequencing & Hot-Swap Control

The 10M02SCU169A7G's instant-on non-volatile configuration (sub-15 ms boot) and 130 LVCMOS-capable I/Os make it ideal for complex multi-rail power-sequencing controllers in ATCA, AdvancedTCA, and high-availability server backplanes. The 12 DSP blocks and 138 Kbits of M9K block RAM enable real-time monitoring of voltage, current, and temperature rails via integrated ADC channels. The on-chip user flash stores fault logs and sequencing profiles that survive power cycling.

Recommended Products Summary

10M02SCE144A7G Intel Used in: Industrial Motor Control EP4CE6E22C8N Cyclone IV alternative for higher-performance motor control Used in: Industrial Motor Control 10M02DCU324A7G Intel Used in: Factory Automation I/O Expansion MAX31855 Thermocouple-to-digital converter companion Used in: Factory Automation I/O Expansion 10M02SCU169I7G Industrial-temp grade variant with same U169 footprint Used in: Automotive Sensor Pre-Processing MAX10ADC On-chip 12-bit ADC for analog sensor interfacing Used in: Automotive Sensor Pre-Processing MAX17048 Fuel gauge IC companion for battery monitoring Used in: Portable Medical Device Glue Logic ADS1292 Low-power analog front-end for biopotential measurement Used in: Portable Medical Device Glue Logic ADV7513 HDMI transmitter companion for video output Used in: Low-Cost Video Processing & Bridging MT9M114 Image sensor companion for parallel CMOS video input Used in: Low-Cost Video Processing & Bridging LTC2974 4-channel power system manager companion Used in: Power Sequencing & Hot-Swap Control ADM1278 Hot-swap controller with current sense Used in: Power Sequencing & Hot-Swap Control
What is the logic element count of 10M02SCU169A7G?
The 10M02SCU169A7G integrates 2,000 logic elements (LEs), equivalent to 160 adaptive logic modules (ALMs). This makes it the smallest member of the Intel MAX 10 FPGA family, intended for glue-logic, I/O expansion, and modest state-machine workloads. The '02' in the part number specifically denotes 2K LEs, distinguishing it from the 10M08 (8K), 10M16 (16K), 10M25 (25K), 10M40 (40K), and 10M50 (50K) variants.
How many user I/O pins does the 10M02SCU169A7G offer?
The 10M02SCU169A7G exposes 130 user I/O pins out of 169 total balls in its U169 UBGA package. Per the Altera MAX 10 device overview, the remaining balls are allocated to power, ground, configuration, JTAG, and high-speed transceiver / clock pins. The 130 user I/Os support LVCMOS, LVDS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate.
Does the 10M02SCU169A7G contain on-chip flash memory?
Yes. The 10M02SCU169A7G integrates 110,592 bits (108 Kbits) of user-accessible embedded flash, in addition to the configuration flash used for FPGA bitstream storage. This dual-flash architecture is a defining feature of the MAX 10 family, allowing instant-on configuration in under 15 ms without requiring an external boot flash, while also providing user data storage for parameters, look-up tables, and serial numbers.
What package does the 10M02SCU169A7G use?
The 10M02SCU169A7G uses a 169-ball Ultra FineLine BGA package, known in Altera nomenclature as U169. According to the MAX 10 datasheet, this package measures 11 x 11 mm with a 0.8 mm ball pitch, making it suitable for compact industrial and consumer designs. The U169 package is footprint-compatible with larger MAX 10 devices, enabling board-level upgrades.
How much block RAM does the 10M02SCU169A7G include?
The 10M02SCU169A7G includes 138 Kbits of M9K block RAM, equivalent to sixteen 9-Kbit memory blocks. M9K blocks can be configured as RAM, ROM, FIFO, or shift registers at widths up to 36 bits. For data-intensive designs exceeding M9K capacity, logic-based RAM can be synthesized from the 2,000 LEs at a roughly 2x area penalty versus dedicated blocks.
What development software supports the 10M02SCU169A7G?
The 10M02SCU169A7G is fully supported by Intel Quartus Prime design software, including the free Quartus Prime Lite edition. Quartus Prime provides synthesis, place-and-route, timing analysis, simulation (ModelSim-Intel FPGA Starter Edition), and the Platform Designer system-integration tool. Programming is performed via JTAG using the USB-Blaster, Intel FPGA Download Cable II, or compatible third-party programmers.
Where can I buy the 10M02SCU169A7G?
The 10M02SCU169A7G is in stock at authorized distributors including DigiKey (5283222), Mouser, LCSC (C1550700), Heisener, and icDirectory. Pricing as of 2026-09-05 starts at approximately USD 11.51 per unit for higher volumes at Heisener and USD 22.75 at LCSC for low-quantity orders. Lead time at most distributors is in-stock or 1-2 weeks; check individual distributor pages for current inventory.
What is the price of the 10M02SCU169A7G?
The 10M02SCU169A7G is priced at approximately USD 22.75 per unit at LCSC and USD 11.51 per unit at Heisener for higher volumes, as of 2026-09-05. For higher quantity breaks (100, 500, 1000 pieces), distributor pricing typically scales downward by 10-40%. Always request a quote from authorized distributors for volume procurement, as pricing fluctuates with market demand and lead time.
What is the lead time for the 10M02SCU169A7G?
Lead time for the 10M02SCU169A7G is generally in-stock to 2 weeks at major authorized distributors (DigiKey, Mouser, LCSC, Heisener) as of 2026-09-05. Heisener explicitly quotes Aug 9 - Aug 14 estimated delivery for orders placed today. For higher volumes (above 5,000 pieces), lead times may extend to 6-10 weeks depending on factory allocation.
Is the 10M02SCU169A7G suitable for industrial applications?
Yes. The 10M02SCU169A7G carries an industrial operating temperature range of -40C to +125C (denoted by the '7' speed/temperature code) and supports LVDS, RS-485, and differential signalling commonly used in factory environments. Its instant-on dual-boot flash makes it well-suited for industrial motor control, sensor interfacing, and deterministic safety-logic applications where SRAM-based FPGAs would need external boot devices.
10M02SCU169A7G vs 10M02SCE144A7G - which should I choose?
The 10M02SCU169A7G and 10M02SCE144A7G share the same 2,000-LE MAX 10 silicon and industrial temperature grade; the difference is package and I/O count. The 10M02SCU169A7G uses the 169-ball UBGA with up to 130 user I/Os, while the 10M02SCE144A7G uses the 144-pin EQFP with fewer I/Os. Choose 10M02SCU169A7G when you need maximum I/O density in the smallest footprint; choose 10M02SCE144A7G for easier manual soldering and prototyping.
10M02SCU169A7G vs LCMXO2-2000HC - which is better for low-power designs?
The 10M02SCU169A7G (Intel MAX 10) and LCMXO2-2000HC (Lattice MachXO2) are both non-volatile low-density FPGAs targeting similar use cases. The MAX 10 offers higher I/O count (130 vs ~104), on-chip user flash (110 Kbits), and an integrated 12-bit ADC, but consumes more static current (~25 mA typical) than the MachXO2 (~1 mA typical). Choose MAX 10 when you need ADC integration or more logic; choose MachXO2 when standby power is critical.
What is the best drop-in replacement for the 10M02SCU169A7G?
The best drop-in replacement for the 10M02SCU169A7G is the 10M02SCE144A7G from the same Intel MAX 10 family, provided the design can be re-laid-out to the 144-pin EQFP package. For exact U169 footprint drop-in, the 10M02SCU169C8G and 10M02SCU169I7G provide the same 169-ball UBGA footprint with industrial or commercial temperature grades and pin-to-pin compatibility. All MAX 10 devices share the same configuration and JTAG interfaces.
Where to download the 10M02SCU169A7G datasheet PDF?
The official 10M02SCU169A7G datasheet PDF can be downloaded from the Altera / Intel product page at https://www.altera.com/products/fpga/max/10/10m02-u169/10M02SCU169A7G, or via the Octopart datasheet mirror at https://octopart.com/datasheet/intel/10M02SCU169A7G. The datasheet includes pinout tables, DC/AC electrical characteristics, configuration timing, and reference schematics for typical applications.
Where to find the 10M02SCU169A7G pinout?
The 10M02SCU169A7G pinout for the 169-ball U169 package is documented in the MAX 10 device datasheet, available at the Altera product page linked above. The pinout table lists ball coordinates (A1 through U12 in BGA matrix), signal names, and I/O bank assignments. For an interactive graphical pinout, use the Quartus Prime Pin Planner tool, which auto-imports the pinout from the device database once the 10M02SCU169A7G is selected as the target device.
What are the key specifications of 10M02SCU169A7G that engineers should know?
The 10M02SCU169A7G integrates 2,000 LEs, 138 Kbits of M9K block RAM, 12 DSP (18x18) multipliers, 4 PLLs, and 110,592 bits of user flash in a 169-ball UBGA (U169) package. It supports up to 130 user I/Os, external memory interfaces including LPDDR2/DDR3/DDR3L/DDR2, and operates across -40C to +125C industrial temperature. Core voltage is 1.0/1.2 V. The non-volatile flash provides instant-on configuration in under 15 ms.
What is the best Lattice equivalent for the 10M02SCU169A7G?
The closest Lattice Semiconductor equivalent for the 10M02SCU169A7G is the LCMXO2-2000HC (MachXO2 family), which offers a similar 2,000-LUT density with non-volatile configuration flash. However, it is not a pin-to-pin drop-in: the MachXO2 uses TQFP-144 or BGA-132 packages, requiring PCB redesign. For footprint-compatible Lattice options, evaluate the Lattice ECP5 series (LFE5U-12F), which targets higher-density applications with similar BGA packages.

Engineering reference data for 10M02SCU169A7G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M02SCU169A7G when your design needs up to 2,000 logic elements with maximum I/O density (130 user I/Os) in a small 11x11 mm UBGA footprint, plus integrated user flash for parameter storage. The industrial -40C to +125C temperature grade suits factory automation, motor control, and entry-level automotive applications. Select the 10M02SCE144A7G instead when prototyping with hand-solderable EQFP-144 packaging, accepting fewer I/Os (79). For the same U169 footprint with commercial temperature only, the 10M02SCU169C8G is a drop-in alternative. Choose the Lattice LCMXO2-2000HC only when standby power below 1 mA is critical, and accept the TQFP-144 footprint change and lack of user flash. Avoid the Xilinx XC2C32A for designs exceeding 32 macrocells of logic.

Comparison with Alternatives

Parameter This Product 10M02SCE144A7G 10M02SCU169C8G 10M02SCU169I7G LCMXO2-2000HC-4TG144C
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Lattice Semiconductor
Package 169-ball UBGA (U169) 144-pin EQFP 169-ball UBGA (U169) - same 169-ball UBGA (U169) - same 144-pin TQFP
Logic Elements 2,000 2,000 2,000 2,000 2,000 LUTs
Block RAM 138 Kbits 138 Kbits 138 Kbits 138 Kbits 74 Kbits
User Flash 110,592 bits 110,592 bits 110,592 bits 110,592 bits None (volatile config)
DSP Blocks 12 x 18x18 12 x 18x18 12 x 18x18 12 x 18x18 None (soft multipliers)
Max User I/O 130 79 130 130 104
Operating Temperature -40C to +125C (Industrial) -40C to +125C (Industrial) 0C to +85C (Commercial) -40C to +125C (Industrial) 0C to +85C (Commercial)

Key Differentiators

  • On-chip user flash for parameter storage (vs LCMXO2-2000HC-4TG144C)
  • Footprint-compatible same-family upgrades (vs 10M02SCE144A7G)
  • Integrated DSP blocks for fixed-point math (vs XC2C32A-6VQG44C)

Design Notes

The 169-ball U169 UBGA uses a 0.8 mm ball pitch and 11x11 mm body. Use 0.4 mm-diameter NSMD (non-solder-mask defined) pads with a 0.5 mm via-in-pad (VIPPO) stack-up for reliable BGA reflow. Assign at least 4 inner layers to GND for return-path integrity, and route all 4 PLL analog power pins (VCCA_PLL) from a ferrite-isolated 2.5V LDO to minimize jitter. Estimated: based on standard MAX 10 U169 layout guidelines; verify against the MAX 10 Hardware Reference Manual.

The MAX 10 core requires 1.0 V (low-power mode) or 1.2 V (typical). VCCIO is banked and supports 1.2 V to 3.3 V per I/O bank. Place 0.1 uF X7R ceramic decoupling caps within 2 mm of every VCC pin and one 10 uF bulk cap per power rail. Estimate: a fully-loaded 10M02 design with 130 active I/Os and 100 MHz operation consumes approximately 25-50 mA quiescent current and 150-300 mA peak; verify against the MAX 10 PowerPlay Early Power Estimator before final BOM release.

Do not confuse the U169 UBGA package with the older E144 EQFP package - the ball pitch and footprint are not compatible. Ensure JTAG TMS, TDI, TDO, TCK pins are routed with 4.7 kohm pull-ups to VCCIO_8 (3.3 V) to enable reliable configuration from a USB-Blaster. The CONFIG_SEL pin (if present in your variant) must be tied high for internal flash boot, or low for external EPCQ boot. The DEV_OE and DEV_CLRn pins should be tied to logic high and 4.7 kohm pull-up respectively for normal operation.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance confirmed via Altera/Intel product environmental compliance documentation. AEC-Q100 status is part-variant dependent - check specific MAX 10 automotive datasheet addendum for AEC-qualified variants. Halogen-free per JEDEC JS709B.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

Related Searches

10M02SCU169A7G 10M02SCU169A7G datasheet MAX 10 FPGA 2K logic elements Intel 169-ball UBGA FPGA non-volatile FPGA 130 user I/O 10M02SCU169A7G price buy MAX 10 FPGA industrial motor control 10M02SCU169A7G vs LCMXO2-2000HC 10M02 drop-in replacement MAX 10 instant-on dual-boot flash Altera MAX 10 Quartus Prime low power FPGA 2K LE factory automation what is MAX 10 FPGA used for 10M02SCU169A7G pinout U169

Related Components & Terms

Intel Altera 10M02SCU169A7G 10M02SCE144A7G 10M02SCU169C8G 10M02SCU169I7G LCMXO2-2000HC-4TG144C MAX 10 FPGA PLD non-volatile FPGA logic element ALM block RAM M9K DSP block PLL UBGA-169 U169 EQFP-144 JTAG Quartus Prime LPDDR2 DDR3 AEC-Q100 RoHS REACH factory automation motor control sensor pre-processing
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