10M04DCU324C8G - MAX 10 FPGA, 4K LE, 246 I/O, 324-UBGA | Intel
MPN: 10M04DCU324C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $21.85 | $218.50 |
| 100 | $18.4 | $1,840.00 |
| 500 | $15.95 | $7,975.00 |
| 1,000 | $13.8 | $13,800.00 |
Drop-in alternatives for 10M04DCU324C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M04DCU324A7G
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$9.85 / Unit
View Datasheet →10M04DAU324I7G
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$13.5 / Unit
View Datasheet →10M04DAU324C8G
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View Datasheet →10M04DCF256A7G
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$11.1 / Unit
View Datasheet →10M04DCU324C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 (10M04 density) |
| Logic Elements (LE) | 4,000 |
| User I/O Count | 246 |
| Embedded Memory (block RAM) | 246 Kbit (M9K blocks) |
| Embedded Block RAM bits | 193,536 |
| Embedded Multiplier (18x18) | 16 |
| Process Technology | 55 nm embedded NOR Flash + CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Configuration | Internal Flash (instant-on, single-chip) |
| Analog-to-Digital Converter | Integrated 12-bit, up to 1 Msps (typ. 17 analog inputs on U324) |
| PLLs | 2 |
| Package | 324-pin UBGA (U324), 0.8 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature (C8G speed/temp grade) | 0 C to +85 C (commercial) |
| Speed Grade | 8 (slower speed grade) |
| RoHS Status | Compliant |
10M04DCU324C8G 324-pin ubga (u324), 0.8 mm pitch Pin Configuration Guide
Complete pinout information for 10M04DCU324C8G (324-pin ubga (u324), 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DCU324C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04DCU324C8G is suitable for 6 applications: Industrial Machine Vision and Sensor Aggregation, BLDC and Servo Motor Control with ADC Feedback, IoT Edge Gateway with Instant-On Configuration, Communications Protocol Bridging, Portable Test and Measurement Instrumentation, Display and Video Interface Aggregation.
Industrial Machine Vision and Sensor Aggregation
The 10M04DCU324C8G's 4,000 LE and 246 user I/O let it aggregate several parallel image sensors, encoder streams, or GPIO banks onto a single processing pipeline without external mux ICs. The integrated 12-bit ADC samples feedback signals such as lighting current or temperature directly, eliminating an external ADC and shrinking the BOM. Quartus Prime Lite handles the image-data buffer pipeline using the device's M9K block RAM (246 Kbit), and instant-on Flash configuration means the vision node is ready within 10 ms of power-up, important for line-scan synchronization in factory automation. Choose this part when multiple parallel-bus sensors must be merged on a low-power, low-cost platform.
Recommended
BLDC and Servo Motor Control with ADC Feedback
The 10M04DCU324C8G is well-suited for BLDC and servo motor control where PWM generation, Hall-sensor decoding, and current/voltage feedback must be handled in real time. Its 16 embedded 18x18 multipliers compute the Park/Clark transforms and PI controllers without loading a host MCU, while the integrated 12-bit ADC samples phase currents directly from the inverting amplifiers at up to 1 Msps. The 2 PLLs synthesize jitter-free PWM carrier frequencies from a single external oscillator. The U324 package's 246 I/O expose up to 6 encoder interfaces plus 3-phase PWM channels simultaneously, making this part ideal for multi-axis motion controllers.
Recommended
IoT Edge Gateway with Instant-On Configuration
The MAX 10's embedded Flash gives the 10M04DCU324C8G instant-on capability, which is critical for battery-powered IoT gateways that wake on interrupt and must service sensor traffic within milliseconds. The 246 I/O expose multiple UART, SPI, I2C, and SDIO interfaces for connecting radios, sensors, and storage without external mux logic. Up to 1.4 Mbit of user Flash (family-typical) stores Wi-Fi credentials and OTA staging images, allowing field updates without external EEPROM. Choose this FPGA when latency-sensitive wake-up and multi-protocol bridging are required at the network edge.
Recommended
Communications Protocol Bridging
The 10M04DCU324C8G can act as a multi-protocol bridge, converting between UART, SPI, I2C, RS-422/RS-485, LVDS, and Ethernet MII/RMII interfaces in industrial networking equipment. Its 246 I/O and on-chip block RAM buffer packets at line rate, while the 16 DSP blocks can perform whitening, encryption pre-processing, or Manchester encoding. Because the MAX 10 family integrates Flash, no external boot memory is needed, simplifying the BOM for compact protocol-converter modules in building automation and process control networks.
Recommended
Portable Test and Measurement Instrumentation
Handheld oscilloscope and logic-analyzer front ends benefit from the 10M04DCU324C8G's combination of high I/O count, integrated ADC, and instant-on Flash. The U324 package exposes hundreds of single-ended and differential LVDS-capable pins for probing parallel buses, while the on-chip ADC samples analog test points up to 1 Msps. The FPGA also performs trigger logic, deep acquisition buffering in block RAM, and USB/PCIe data upload to a host processor. Choose this part when a portable instrument needs instant readiness and mixed-signal acquisition in a compact, low-power design.
Recommended
Display and Video Interface Aggregation
The 10M04DCU324C8G can aggregate multiple camera or display data streams (parallel RGB, MIPI-CSI via LVDS, or proprietary interfaces) and convert timing, color depth, or resolution on-the-fly. Its 246 I/O accommodate wide parallel video buses, while the M9K block RAM tiles provide line buffering without external SDRAM for low-resolution video. The integrated PLL generates pixel clocks from any reference, and instant-on Flash means the display subsystem initializes at the same instant as the host SoC. Choose this part for human-machine interface (HMI) panels and digital signage controllers.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DCU324C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DCU324A7G | 10M04DAU324I7G | 10M04DAU324C8G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 324-UBGA (U324), 0.8 mm pitch | 324-UBGA (U324) - same footprint | 324-UBGA (U324) - same footprint | 324-UBGA (U324) - same footprint |
| Logic Elements | 4,000 LE | 4,000 LE | 4,000 LE | 4,000 LE |
| User I/O | 246 | 246 | 246 | 246 |
| Speed Grade | 8 | 7 (faster Fmax) | 7 (faster Fmax) | 8 (same as target) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Embedded Block RAM | 246 Kbit | 246 Kbit | 246 Kbit | 246 Kbit |
| Embedded Multipliers (18x18) | 16 | 16 | 16 | 16 |
| Integrated 12-bit ADC | Yes (typ. 17 analog inputs) | Yes (same ADC block) | Yes (same ADC block) | Yes (same ADC block) |
| Configuration Method | Internal Flash (instant-on) | Internal Flash (instant-on) | Internal Flash (instant-on) | Internal Flash (instant-on) |
Key Differentiators
- Highest-density 10M04 variant in the 324-UBGA package, exposing the maximum I/O count (vs 10M04DCF256A7G (256-FBGA))
- Integrated 12-bit ADC plus instant-on Flash eliminates external converter and boot PROM (vs Discrete MCU + external ADC + boot SPI Flash)
- Non-volatile configuration with dual-boot Flash supports field-reliable OTA updates (vs SRAM-based FPGAs requiring external boot PROM)
Design Notes
The 324-UBGA uses a 0.8 mm ball pitch and requires HDI PCB fabrication with laser-drilled micro-vias. Follow Intel's MAX 10 hardware design guide for via-in-pad geometry: capture pad 0.40 mm, solder mask defined (SMD) or non-solder mask defined (NSMD) land 0.45 mm. Use at least 4 PCB layers with a dedicated ground plane directly under the BGA to provide low-impedance return paths for the high-frequency I/O switching. Decoupling: place 100 nF X7R capacitors within 2 mm of every VCCINT and VCCIO ball, plus bulk 10 uF X5R per power rail at the edge of the BGA footprint.
The 10M04DCU324C8G requires three supply rails: VCCINT (1.2 V core), VCCIO (per bank, 1.2-3.3 V), and VCCA (2.5 V analog for the integrated ADC). A common mistake is to skip ferrite-bead isolation between VCCA and the digital 2.5 V rail; doing so couples switching noise into the ADC reference and degrades effective resolution below 10 bits. According to Intel's MAX 10 power management guide, VCCA must be filtered with a 10 ohm ferrite bead and a 10 uF + 100 nF cap network. Estimate power consumption with the Quartus PowerPlay early-power estimator before committing to a regulator choice; typical 10M04 designs draw 0.5-1.5 W total depending on toggle rate and I/O utilization.
Do not leave JTAG TCK floating during configuration - pull it high through a 10 kohm resistor to VCCIO of the JTAG bank, otherwise transient noise can corrupt Flash programming. Do not exceed the maximum allowed VCCIO bank count (8 banks on U324) when mixing 1.8 V and 3.3 V interfaces; group same-voltage interfaces into the same VCCIO bank to avoid level-shifter overhead. Finally, the 'C' commercial temperature grade is not suitable for outdoor or industrial deployments - choose the 10M04DAU324I7G (industrial -40C to +100C) for those environments without changing the PCB layout.
Compliance Information
RoHS and REACH compliance per the 'G' suffix trailer per Intel's MAX 10 product declaration. AEC-Q100 not applicable - this is an industrial/consumer FPGA, not an automotive-qualified part. For automotive, consider the MAX 10 automotive grade variants if available in your design's package.
