10M04DAU324C8G - 4K-LUT MAX 10 FPGA, 324-LFBGA | Intel
MPN: 10M04DAU324C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.0635 | $13.06 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 10M04DAU324C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M04DAU324I7G
✅ Drop-In✓ In Stock
$13.5 / Unit
View Datasheet →10M02SCU324C8G
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →10M04DAF256C7G
✅ Drop-In✓ In Stock
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View Datasheet →10M02DCU324A7G
✅ Drop-In✓ In Stock
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View Datasheet →10M04DAU324C8G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | MAX 10 |
| Logic Elements | 4,000 |
| Embedded Memory | 193,536 bits |
| User I/O | 246 |
| Package | 324-LFBGA |
| Package Code | U324 |
| Technology | 55 nm |
| Core Voltage | 1.2 V |
| Ordering Part Number | 10M04DAU324C8G |
| Speed Grade | C8G |
| Mounting Type | Surface Mount |
| Maximum User I/O | 246 |
| Ball Grid Package | 324 balls |
| Device Manufacturer | Intel / Altera |
10M04DAU324C8G 324 balls Pin Configuration Guide
Complete pinout information for 10M04DAU324C8G (324 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DAU324C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04DAU324C8G is suitable for 6 applications: Industrial Control Logic, Communications Interface Bridge, Test and Measurement Equipment, Embedded System Interface Aggregation, Automotive and Vehicle Electronics, Programmable Motor-Control Support.
Industrial Control Logic
10M04DAU324C8G fits industrial control systems that need configurable logic, deterministic state machines, and multiple external interfaces. Its 4,000 logic elements provide capacity for control sequencing, signal conditioning logic, and protocol-related state handling, while 193,536 embedded-memory bits can hold command tables, lookup data, or small buffer structures. The 246 user I/O can connect to sensors, actuators, digital converters, and supervisory controllers. Engineers can implement parallel control paths in programmable hardware and update logic when system requirements change. The supplied data does not confirm the operating-temperature range, so industrial temperature qualification must be checked in the manufacturer documentation. The 324-LFBGA package also requires a carefully designed BGA power, ground, and escape layout.
Recommended
Communications Interface Bridge
10M04DAU324C8G can serve as a configurable bridge between processors, converters, memories, and communications peripherals. Its 246 user I/O support multiple parallel or serialized board-level interfaces, while the programmable fabric can implement protocol framing, clock-domain management, serialization, and data-format conversion. The 4,000 logic elements are useful for moderate interface complexity without moving to a larger FPGA. The 193,536 embedded-memory bits allow packet buffers, lookup tables, or channel-control storage. Timing and supported I/O standards are not provided in the verified data and must be confirmed before selecting the device for a specific interface. PCB planning should include controlled-impedance routing, local decoupling, and a verified 324-ball escape strategy.
Recommended
Test and Measurement Equipment
10M04DAU324C8G is relevant to test and measurement equipment that requires configurable measurement sequencing, stimulus generation, capture control, or instrument interfacing. The FPGA can implement deterministic trigger logic and parallel data handling, while 4,000 logic elements support moderate control and processing structures. Its 246 user I/O can interface with analog-to-digital converters, digital-to-analog converters, front-panel controllers, and test fixtures. The 193,536-bit embedded memory can support capture windows, calibration constants, or command storage. Exact timing performance, I/O standards, and power requirements are not present in the supplied data, so they must be established from the official datasheet. The LFBGA package benefits from solid ground references and low-noise power distribution.
Recommended
Embedded System Interface Aggregation
10M04DAU324C8G fits embedded systems that need to aggregate several slower peripherals into a processor- or controller-facing interface. The 246 user I/O provide broad connection flexibility, and 4,000 logic elements can implement register decoding, handshaking, multiplexing, interrupt aggregation, and timing control. Embedded memory of 193,536 bits can support FIFO-like storage, lookup tables, and local command data. This allows the host processor to offload repetitive hardware operations while retaining software control. Designers must verify the target’s configuration method, voltage rails, I/O-bank restrictions, and timing because those values are not supplied in the verified excerpts. The 324-LFBGA footprint is suitable for compact boards but requires disciplined BGA assembly and signal-integrity planning.
Recommended
Automotive and Vehicle Electronics
10M04DAU324C8G may be evaluated for vehicle electronics that require configurable control, sensor aggregation, or interface conversion. The 246 user I/O can connect multiple vehicle-control signals, and the programmable fabric can implement timing, protocol, and supervisory logic. Its 4,000 logic elements and 193,536 embedded-memory bits are useful for moderate-density functions such as signal routing, status handling, and data buffering. However, the verified data does not establish AEC-Q100 qualification or an automotive operating-temperature grade, so the target must not be selected for automotive use solely from the family or package name. Confirm qualification, temperature range, reliability documentation, and lifecycle status with the manufacturer before design-in.
Recommended
Programmable Motor-Control Support
10M04DAU324C8G can support motor-control electronics as a configurable logic and interface companion. The 4,000 logic elements can handle control sequencing, feedback processing, fault handling, and communication between a controller and power-stage circuitry. Its 246 user I/O provide connections to position sensors, gate-driver interfaces, status signals, and supervisory circuits. The 193,536 embedded-memory bits can be used for lookup tables or small command and event buffers. The FPGA should be evaluated for the required switching frequency, I/O timing, isolation strategy, and fault response; the supplied data does not provide those electrical or timing specifications. Designers should also confirm the 324-LFBGA pin map and signal-integrity layout before using it near a high-current motor-drive stage.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DAU324C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DCU324C8G | 10M04DAU324I7G | 10M02SCU324C8G | 10M04DAF256C7G | 10M02DCU324A7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-LFBGA, U324 | 324-LFBGA, U324 | 324-LFBGA, U324 | 324-LFBGA, U324 | [DATA_NEEDED: package and pin compatibility] | 324-LFBGA, U324 |
| Logic Elements | 4,000 | [DATA_NEEDED: logic elements] | [DATA_NEEDED: logic elements] | [DATA_NEEDED: logic elements] | [DATA_NEEDED: logic elements] | [DATA_NEEDED: logic elements] |
| Embedded Memory | 193,536 bits | [DATA_NEEDED: embedded memory] | [DATA_NEEDED: embedded memory] | [DATA_NEEDED: embedded memory] | [DATA_NEEDED: embedded memory] | [DATA_NEEDED: embedded memory] |
| User I/O | 246 | [DATA_NEEDED: user I/O] | [DATA_NEEDED: user I/O] | [DATA_NEEDED: user I/O] | [DATA_NEEDED: user I/O] | [DATA_NEEDED: user I/O] |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] | [DATA_NEEDED: core voltage] | [DATA_NEEDED: core voltage] | [DATA_NEEDED: core voltage] | [DATA_NEEDED: core voltage] |
| Technology | 55 nm | [DATA_NEEDED: technology] | [DATA_NEEDED: technology] | [DATA_NEEDED: technology] | [DATA_NEEDED: technology] | [DATA_NEEDED: technology] |
| Confirmed Drop-In Status | Target ordering code | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data | Not fully confirmed by supplied cross-reference data |
| Verified Distributor Result | DigiKey, Mouser, LCSC, Octopart | [DATA_NEEDED: distributor result] | [DATA_NEEDED: distributor result] | [DATA_NEEDED: distributor result] | [DATA_NEEDED: distributor result] | [DATA_NEEDED: distributor result] |
Key Differentiators
- Confirmed 4,000-logic-element capacity (vs 10M02SCU324C8G)
- Confirmed 193,536-bit embedded memory (vs 10M04DCU324C8G)
- 246 user I/O for interface aggregation (vs 10M04DAU324I7G)
Design Notes
The verified data identifies a 1.2 V core voltage, but the complete power architecture is [DATA_NEEDED: supply voltage range, current consumption, and power-up sequencing]. Before layout release, obtain the manufacturer power requirements and calculate the current budget for core, I/O, configuration, and auxiliary rails. Place local decoupling capacitors at the associated power pins, keep the high-current return path continuous, and use a ground plane. Do not design from the 1.2 V core value alone; FPGA I/O banks can require additional voltages that are not specified in the supplied excerpts.
The 324-LFBGA package requires a controlled BGA escape and assembly process. Use the exact manufacturer footprint and ball numbering rather than a generic 324-ball land pattern. Confirm the PCB stack-up, via-in-pad policy, solder-mask definition, ball diameter, and pin-1 orientation from the official package drawing. Route slower control and configuration signals away from high-speed edges, provide solid ground references, and verify that the selected assembly house supports the package pitch. The exact package dimensions and ball-map values are [DATA_NEEDED: LFBGA mechanical dimensions and ball map].
For interface and clock distribution, treat the FPGA as part of the complete channel. Confirm I/O-bank voltage limits, supported I/O standards, clock-pin assignments, and timing constraints from the manufacturer datasheet. The supplied data does not specify I/O standards, timing performance, or differential-channel capability. Use short point-to-point routes for critical clocks, maintain a continuous reference plane, add series termination where the interface requires it, and simulate the selected configuration before release. 246 available user I/O is a capacity figure, not a guarantee that every I/O can operate at every voltage or data rate.
Compliance Information
The supplied web data does not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Automotive qualification is not established.
