10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel
MPN: 10M04SAU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.22 | $22.22 |
| 10 | $21.1 | $211.00 |
| 100 | $19.45 | $1,945.00 |
| 500 | $17.8 | $8,900.00 |
| 1,000 | $16.2 | $16,200.00 |
Drop-in alternatives for 10M04SAU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DAU324I7G
✅ Drop-In✓ In Stock
$13.5 / Unit
View Datasheet →10M04DCU324C8G
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$13.8 / Unit
View Datasheet →10M04DCU324I7P
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$9.95 / Unit
View Datasheet →10M04DCU324A7G
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$9.85 / Unit
View Datasheet →10M04SAU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Maximum User I/Os | 246 |
| Embedded Memory (bits) | 193,536 |
| Embedded Memory Blocks | M9K, 16 Kbits each |
| Number of Analog Inputs (ADC) | 4 (single-ended) / up to 8 (differential via soft IP) |
| ADC Resolution | 12-bit SAR |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) |
| Process Technology | TSMC 55nm embedded flash |
| Core Voltage | 1.0 V (10M04S variant) |
| Operating Temperature Range | -40C to +100C (Industrial, 'I' grade) |
| Speed Grade | 7 (I7G speed bin) |
| Package | 324-LFBGA (UBGA-324), 15 mm x 15 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) |
10M04SAU324I7G 324-lfbga (ubga-324), 15 mm x 15 mm Pin Configuration Guide
Complete pinout information for 10M04SAU324I7G (324-lfbga (ubga-324), 15 mm x 15 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04SAU324I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04SAU324I7G is suitable for 6 applications: Industrial Sensor Aggregation Bridge, Motor Control Pre-Processing Front-End, Portable Medical Device Front-End, I/O Expansion Bridge for SoCs, Industrial HMI Display Bridge, Factory Automation Protocol Converter.
Industrial Sensor Aggregation Bridge
The 10M04SAU324I7G aggregates up to 246 LVCMOS channels from industrial sensors (encoders, switches, analog front-ends) and bridges them to an upstream SoC over SPI, I2C, or parallel. Its integrated 12-bit SAR ADC digitizes up to 4 analog sensor channels without an external ADC, reducing BOM and PCB area by approximately 30% versus a discrete MCU-plus-CPLD-plus-ADC implementation. Industrial temperature range (-40C to +100C) and on-chip dual-configuration flash make it tolerant of factory-floor thermal stress and power-cycle events; instant-on configuration eliminates boot-time windows during cold-start.
Recommended
Motor Control Pre-Processing Front-End
The 10M04SAU324I7G performs pre-processing for BLDC and stepper motor control loops: encoding quadrature signals (QEI), generating PWM timers, and monitoring current/voltage via its on-die 12-bit ADC. The 4K logic elements support up to 4 simultaneous encoder channels with deterministic propagation delay, while the 246 I/Os give the design headroom for parallel bus expansion to a host DSP/MCU. Compared with a software-only implementation on an MCU, the MAX 10 offloads deterministic logic and frees CPU cycles for the actual control algorithm, improving loop bandwidth and reducing jitter.
Recommended
Portable Medical Device Front-End
In portable medical devices (handheld patient monitors, point-of-care analyzers), the 10M04SAU324I7G serves as a low-power glue-logic and ADC hub. The on-chip 12-bit ADC captures bio-sensor signals (pulse-oximeter current, temperature thermistor voltage) without an external ADC chip; 4K logic elements implement the digital filter and pacing logic; and 246 I/Os accommodate LCD parallel interfaces, button matrices, and host communication. Industrial temperature range supports storage and operation in clinical environments, while the small 15x15 mm BGA package fits handheld enclosures with limited PCB area.
Recommended
I/O Expansion Bridge for SoCs
The 10M04SAU324I7G frequently serves as an I/O expansion companion to cost-sensitive SoCs that have limited GPIO or no industrial-temperature interfaces. It connects to the SoC via SPI (typical 50 MHz) or parallel bus, exposing additional UART, I2C, SPI, PWM, or LVCMOS channels under firmware control. The MAX 10's industrial temperature rating and on-chip flash make it more robust than SRAM-based expansion FPGAs that lose configuration on power-cycle, while the integrated 4-input ADC adds analog channels the SoC lacks. Typical use cases include SBC I/O expansion, HDMI-to-LVDS bridges, and PC/104-style peripheral cards.
Recommended
Industrial HMI Display Bridge
The 10M04SAU324I7G bridges an industrial HMI controller (typically an ARM Cortex-A or Cortex-R SoC) to a TFT LCD panel via parallel RGB or LVDS. Its 246 I/Os carry 18- or 24-bit color data plus HSYNC/VSYNC/DE timing; 4K logic elements handle line buffers, gamma correction, and backlight PWM; and the on-chip ADC monitors the panel's temperature-sense thermistor for thermal protection. The industrial temperature range supports outdoor or factory-cabinet deployments, while the on-chip flash enables instant-on panel wake-up without external boot devices - critical for safety HMI prompts.
Recommended
Factory Automation Protocol Converter
The 10M04SAU324I7G implements protocol-conversion gateways in factory automation: UART/SPI/I2C on one side, RS-485 / CAN / Modbus RTU on the other. Its 246 I/Os handle multiple isolated bus channels simultaneously, while the integrated 12-bit ADC monitors 24V rail voltage for under-voltage/over-voltage detection. The MAX 10's dual-configuration flash supports fail-safe firmware A/B updates, and the industrial temperature range is essential for cabinet-mounted deployments near motors and heaters. Quartus Prime reference designs are available for common protocols, shortening time-to-prototype for new gateways.
Recommended
Recommended Products Summary
Engineering reference data for 10M04SAU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DAU324I7G | 10M04DCU324C8G | 10M04DCU324I7P | 10M04DCU324A7G |
|---|---|---|---|---|---|
| Package | 324-LFBGA (UBGA-324) | 324-LFBGA (UBGA-324) - same | 324-LFBGA (UBGA-324) - same | 324-LFBGA (UBGA-324) - same | 324-LFBGA (UBGA-324) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 - same | 4,000 - same | 4,000 - same | 4,000 - same |
| Embedded Memory (bits) | 193,536 | 193,536 - same | 193,536 - same | 193,536 - same | 193,536 - same |
| Maximum User I/Os | 246 | 246 - same | 246 - same | 246 - same | 246 - same |
| Supply Architecture | Single (3.3V, S-grade) | Dual (1.2V core + 3.3V I/O, D-grade) | Dual (DC-grade) | Dual low-power (DC-grade) | Dual (DC-grade) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive-grade |
| Speed Grade | 7 | 7 | 8 | 7 | 7 |
| ADC | 12-bit SAR, 4 inputs | 12-bit SAR, 4 inputs - same | 12-bit SAR, 4 inputs - same | 12-bit SAR, 4 inputs - same | 12-bit SAR, 4 inputs - same |
| Qty-1 Price (USD, as of 2026-09-05) | $22.22 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- On-chip non-volatile flash eliminates external boot PROM (vs Lattice iCE40 / Xilinx Spartan-7)
- Integrated 12-bit SAR ADC eliminates external ADC chip (vs 10M04DAU324I7G (without ADC usage in design))
- Same U324 BGA footprint across MAX 10 supply variants (vs Lattice ECP5 (LFE5U series))
Design Notes
The 10M04S-variant is single-supply (3.3V only); the on-chip LDO derives the 1.0V core. Per the MAX 10 device datasheet, the 3.3V VCCIO must come up cleanly and monotonically; if using a switching regulator, ensure output ripple is below 50 mVpp to avoid LDO dropout during cold-start. Estimated: at 50 MHz logic utilization and 100 MHz PLL, ICC core is approximately 50-120 mA; I/O current scales with switching frequency and load. Use 100 nF X7R bypass per power pin and 10 uF bulk near the package.
The 15x15 mm U324 LFBGA has a theta_JA of approximately 18 C/W with a JEDEC-compliant 4-layer PCB (per Intel package thermal data, generic number - verify exact value against the device-specific package file). Estimated: at 2 W total dissipation this yields a 36C temperature rise above ambient - acceptable for industrial use up to 64C ambient. For sealed enclosures, provide copper spreading under the BGA and at least 4 thermal vias into inner planes. Do not rely solely on package-top cooling for high-utilization designs.
Route all 8 I/O bank reference voltages (VREF) and the analog 3.3V supply (VCCA) separately from digital 3.3V. Per Intel MAX 10 hardware guidelines, the ADC analog pins must be guarded with a ground ring and isolated from switching digital traces; failure to do so can degrade ADC SNR by 6-10 dB. Place the 100 MHz external reference crystal within 5 mm of CLK pin with grounded guard ring. JTAG pins (TCK/TMS/TDO/TDI) should be pulled per datasheet if unused - do not leave floating.
Do not assume a re-spin from Cyclone IV to MAX 10 is pin-compatible: package ball maps differ between the families even when ball count matches. Always re-run Quartus Prime Pin Planner and re-import your HDL with the new target device selected. Per Intel migration guides, the configuration bitstream is not portable across families - you must regenerate the .sof/.pof with the correct device selected. The MAX 10 'S' vs 'D' vs 'DC' supply variants also share ball maps but require different external power circuits.
LVDS pairs must be length-matched within 10 ps (about 1.5 mm at the BGA escape pitch) per the MAX 10 device handbook. DDR-style interfaces (DDR3/LPDDR2) require source-synchronous tuning in Quartus Prime timing analyzer; the soft memory controller IP can be parameterised for the specific DRAM. For high-fanout GPIO (greater than 100 simultaneous switching outputs), use staggered slew-rate settings per bank to avoid SSO-induced ground bounce exceeding 0.3V.
Compliance Information
RoHS and REACH compliant per Intel product page; lead-free BGA balls per JEDEC J-STD-020. The standard 10M04SAU324I7G is not AEC-Q100 qualified - for automotive sub-systems requiring AEC-Q100, consider 10M04DCU324A7G (Automotive grade) from the same MAX 10 family in the same U324 footprint.
