10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel
MPN: 10M08SAU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.5 | $3,050.00 |
| 500 | $26.8 | $13,400.00 |
| 1,000 | $23.4 | $23,400.00 |
Drop-in alternatives for 10M08SAU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08SAU324C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DAU324I7G
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →10M08DAU324C8G
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →10M16SAU324I7G
✅ Drop-In✓ In Stock
$32.4 / Unit
View Datasheet →10M16DAU324I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04SAU324I7G
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →10M08SAU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded User Flash | 387,072 bits |
| General Purpose SRAM | 246 Kbits |
| PLLs | 2 (with up to 4 output taps) |
| Maximum User I/O Pins | 250 |
| On-chip ADC | Dual 12-bit, 1 MSPS |
| Core Voltage (VCC) | 1.2 V |
| Operating Supply Voltage | 3 V / 3.3 V |
| Package | 324-LFBGA (UBGA-324), 15x15 mm |
| Configuration Memory | On-die flash (non-volatile) |
| Configuration Interface | JTAG (IEEE 1149.1), Active Serial |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
10M08SAU324I7G 324-lfbga (ubga-324), 15x15 mm Pin Configuration Guide
Complete pinout information for 10M08SAU324I7G (324-lfbga (ubga-324), 15x15 mm package) with 250 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08SAU324I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 250 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08SAU324I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Processing, Sensor Fusion and IoT Edge Nodes, Legacy CPLD Replacement (Instant-On Conversion), Medical Patient Monitoring Interfaces.
Industrial Motor Control
The 10M08SAU324I7G is well suited to industrial motor control drives because its 8000 logic elements and dual 12-bit 1 MSPS on-chip ADC can sample three-phase current feedback and implement field-oriented control (FOC) state machines in a single chip. Its 250 user I/Os handle encoder inputs, PWM outputs to gate drivers, and communication buses (RS-485, CAN, EtherCAT) without external logic. The instant-on flash configuration boots the drive in under 10 ms, meeting IEC 61800 safety startup time requirements.
Recommended
Factory Automation I/O Expansion
The 10M08SAU324I7G expands discrete and analog I/O channels on PLCs and distributed I/O modules. The 324-LFBGA package exposes 250 user I/Os, allowing direct termination of high-density field wiring without external shift registers. Its on-die ADCs convert 4-20 mA analog inputs, and the embedded flash stores configuration so modules retain their personality after hot-swap replacement. With 8K LE the device can host multiple industrial protocols concurrently while still leaving logic headroom for diagnostics.
Recommended
Video Bridging and Display Processing
The 10M08SAU324I7G bridges between CMOS camera interfaces, LVDS display panels, and HDMI/DVI controllers. Its 8000 logic elements implement pixel-clock-domain crossing, color space conversion, and frame-buffer arbitration with up to 18x18 hardware multipliers for scaling. The 324-LFBGA package offers 250 user I/Os to support wide parallel video buses (24-bit RGB, dual channel LVDS). Instant-on boot enables the display to come up with the rest of the system within 10 ms.
Recommended
Sensor Fusion and IoT Edge Nodes
The 10M08SAU324I7G aggregates I2C, SPI, and UART data from multiple environmental sensors and pre-processes the stream before forwarding it to a host MCU. Its dual 12-bit ADCs accept analog sensor outputs (temperature, strain gauges, light) and the embedded Nios II soft-core path implements sensor-fusion algorithms. With 387 Kbits of on-die flash it stores calibration constants and node identity, eliminating an external EEPROM and reducing the IoT node BOM by 2-3 dollars.
Recommended
Legacy CPLD Replacement (Instant-On Conversion)
The 10M08SAU324I7G is a drop-in instant-on replacement for aging 5 V CPLDs such as Altera MAX II/MAX V and Xilinx XC9500XL, delivering equivalent glue-logic functionality at lower power. Its on-die flash boots the design within 10 ms, satisfying industrial front-panel boot sequences where CPLDs traditionally held the system in reset until valid. Designers port legacy AHDL/VHDL designs directly to Quartus Prime and migrate to the 324-LFBGA footprint without external boot PROM.
Recommended
Medical Patient Monitoring Interfaces
The 10M08SAU324I7G supports medical patient monitoring equipment such as multi-parameter bedside monitors by routing ECG, SpO2, and temperature signals through its dual 12-bit ADCs and processing the digital stream in fabric. The 8K LE capacity implements digital filters (bandpass for ECG, smoothing for SpO2 photoplethysmography) without an external DSP. The industrial -40C to +100C operating range supports both operating-room and ambulance environments, while the on-die flash stores device calibration for IEC 60601-1 compliance.
Recommended
Recommended Products Summary
Engineering reference data for 10M08SAU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08SAU324C8G | 10M08DAU324I7G | 10M16SAU324I7G | 10M04SAU324I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements | 8000 | 8000 | 8000 | 16000 | 4000 |
| Supply Variant | Single-supply (SAU) | Single-supply (SAU) | Dual-supply (DAU) | Single-supply (SAU) | Single-supply (SAU) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Embedded Flash | 387,072 bits | 387,072 bits | 387,072 bits | 549,888 bits | 295,296 bits |
| Max User I/O | 250 | 250 | 250 | 250 | 250 |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS |
| Approx Unit Price (qty 1) | 38.50 USD | 32.00 USD | 37.20 USD | 62.00 USD | 28.40 USD |
Key Differentiators
- Industrial temperature range with same U324 footprint (vs 10M08SAU324C8G)
- Single-supply design eliminates external config regulator (vs 10M08DAU324I7G)
- Lower logic capacity for cost-sensitive designs (vs 10M16SAU324I7G)
Design Notes
Estimated: The 10M08SAU324I7G as a single-supply SAU variant only requires VCCIO (3.3 V) and VCC (1.2 V) rails. Use a TI TPS7A4701 LDO for low-noise VCC generation. Sequence VCC (1.2 V core) before VCCA (2.5 V PLL analog) before VCCIO (3.3 V I/O). Per Intel MAX 10 datasheet, max power dissipation at 250 I/O switching at 100 MHz is approximately 1.2 W; design thermal relief accordingly.
The 324-LFBGA package uses a 1.0 mm ball pitch; PCB requires microvia stack-up with 0.4 mm laser-drilled vias. Per Intel layout guidelines, route the outer two rows of balls on the top layer only and use via-in-pad for inner rows. Match all differential pairs to 100 ohm +/- 10% impedance and keep length mismatch under 150 mil for LVDS links. Decoupling: place one 0.1 uF X7R per VCC pin, one 4.7 uF bulk per voltage plane.
Common pitfalls: (1) Do not leave JTAG TCK floating - pull to ground through 10 kohm. (2) The dual ADC inputs share the VCCA power rail; noisy VCCA directly degrades ADC SNR by 6-10 dB. (3) MSL 3 packaging requires dry-bag storage and bake-out at 125C for 24 hours before assembly if the bag is opened more than 168 hours before reflow. (4) Do not use the configuration pins as regular I/O unless the MSEL pins are set to JTAG-only mode.
Compliance Information
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is an industrial-grade FPGA. Conflict-minerals declaration compliant per Intel supply chain policy.
