10M16DAF256C7G - MAX 10 FPGA, 16K LE, 256-LBGA | Intel / Altera
MPN: 10M16DAF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.5 | $23.50 |
| 10 | $21.4 | $214.00 |
| 100 | $19.2 | $1,920.00 |
| 500 | $17.05 | $8,525.00 |
| 1,000 | $15.4 | $15,400.00 |
| 2,500 | $13.8 | $34,500.00 |
Drop-in alternatives for 10M16DAF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DAF256C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16DAF256A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16DAF256I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DAF256C7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.95 / Unit
View Datasheet →10M25DAF256C7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$38.75 / Unit
View Datasheet →10M16DAF256C7G Maximum Ratings & Electrical Characteristics
| Product Family | MAX 10 |
| Logic Elements (LE) | 16000 |
| Maximum User I/O | 178 |
| Embedded Memory Bits | 562176 (549 Kbit) |
| Embedded RAM Blocks | M9K, 69 blocks (per family datasheet) |
| Configuration Memory | Dual-configuration flash (non-volatile) |
| Package | 256-LBGA (F256), 17x17 mm |
| Integrated ADC | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |
| Operating Temperature | 0C to +85C (C7G suffix = commercial) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020, BGA package) |
10M16DAF256C7G 256-lbga (f256), 17x17 mm Pin Configuration Guide
Complete pinout information for 10M16DAF256C7G (256-lbga (f256), 17x17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DAF256C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DAF256C7G is suitable for 7 applications: Industrial I/O Expansion & Protocol Bridging, Factory Automation Motor Drive Glue Logic, Low-Volume ASIC Replacement, Communication Protocol Bridge (SPI/I2C to UART/Ethernet), LED Video Wall Timing & Pixel Driver, Test & Measurement Instrument Front-End, Consumer Device I/O Hub.
Industrial I/O Expansion & Protocol Bridging
The 10M16DAF256C7G's 178 user I/O pins and 16K logic elements make it a cost-effective solution for industrial I/O expansion modules that bridge legacy protocols (RS-485, SPI, I2C, parallel bus) to modern Ethernet or USB interfaces. The integrated 12-bit ADC eliminates an external ADC IC for sensor monitoring of temperature, voltage, and current on the same board. Compared with discrete glue-logic ASICs, the MAX 10 instant-on flash and Quartus Prime toolchain reduce BOM cost and design risk. Recommend pairing with a TI DP83826 industrial Ethernet PHY or Microchip LAN9252 EtherCAT controller for protocol bridging applications.
Recommended
Factory Automation Motor Drive Glue Logic
The 10M16DAF256C7G is well-suited for motor drive glue logic in factory automation, handling PWM generation, encoder quadrature decoding, and safety interlocks between a host MCU and the power stage. Its 562 Kbit of block RAM supports lookup tables for sinusoidal commutation or sensor-fusion algorithms, while the M9K memory blocks enable efficient circular buffer management for high-speed motor control loops. The MAX 10's instant-on flash configuration supports fail-safe operation in industrial control environments. Pair with Infineon IRF7507 gate drivers and a TI C2000 host MCU for closed-loop motor control applications.
Recommended
Low-Volume ASIC Replacement
The 10M16DAF256C7G serves as an economical low-volume ASIC replacement for designs in the 5K-20K ASIC gate range where NRE costs of a custom ASIC are prohibitive. With 16K logic elements, integrated flash, and ADC, the MAX 10 reduces time-to-market while keeping per-unit cost competitive for production volumes below 10K units annually. The dual-configuration flash supports field firmware updates with rollback capability, enabling in-field feature additions without hardware recalls. Compared to mask-programmed ASICs, the FPGA allows design verification and bug fixes prior to volume production commitment.
Recommended
Communication Protocol Bridge (SPI/I2C to UART/Ethernet)
The 10M16DAF256C7G's 16K logic elements comfortably implement multi-master SPI to Ethernet protocol bridges with on-chip TCP/IP offload and MAC interface logic. With 178 user I/O and 562 Kbit block RAM, designers can buffer multiple simultaneous protocol channels for industrial gateway applications. The MAX 10's integrated ADC monitors system health without an external component. This makes the 10M16DAF256C7G ideal for industrial IoT edge gateways, sensor concentrators, and protocol translation modules requiring deterministic real-time processing. Pair with a Microchip ENC28J60 Ethernet controller or TI CC3220 Wi-Fi companion for connectivity.
Recommended
LED Video Wall Timing & Pixel Driver
The 10M16DAF256C7G fits LED video wall row-driver and timing controller applications where parallel pixel data must be serialized to long cable runs at high refresh rates. With 178 user I/O, the FPGA can drive 32-48 channels of high-speed LVDS pixel data simultaneously, while the integrated block RAM stores gamma correction lookup tables and frame buffers. The dual-configuration flash allows field upgrades of gamma tables and color calibration without external memory. Compared with HC595 shift register chains, the MAX 10 reduces PCB area and improves refresh rate by 5-10x in large-format video wall installations.
Recommended
Test & Measurement Instrument Front-End
The 10M16DAF256C7G's integrated 12-bit ADC and parallel logic fabric make it suitable for portable test and measurement instrument front-ends, capturing analog sensor data and processing digital protocol signals (I2C, SPI, UART) simultaneously. The 16K logic elements support FFT, FIR filtering, and custom protocol decoding in real time, while 562 Kbit of block RAM stores sample buffers for post-processing. The commercial 0C-85C operating range covers lab and field-portable use cases. Pair with a TI ADS8688A high-speed external ADC for higher-bandwidth capture or keep the integrated ADC for lower-cost applications.
Recommended
Consumer Device I/O Hub
The 10M16DAF256C7G functions as a flexible I/O hub in consumer devices such as smart appliances, gaming peripherals, and audio interfaces where multiple I/O standards must coexist. With 178 user I/O, designers can mix USB, HDMI CEC, I2S audio, and proprietary protocols on a single chip. The MAX 10 instant-on flash enables sub-100ms boot times required for consumer UX expectations, while commercial temperature grade (0C-85C) is suitable for indoor consumer environments. Pair with an NXP i.MX RT1060 host MCU or Microchip SAMD51 for complete consumer product designs requiring rich I/O connectivity.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAF256C8G | 10M16DAF256A7G | 10M16DAF256I7G | 10M08DAF256C7G | 10M25DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256), 17x17 mm | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 25,000 (+56%) |
| Embedded Block RAM (bits) | 562,176 | 562,176 | 562,176 | 562,176 | [DATA_NEEDED] | [DATA_NEEDED] |
| Maximum User I/O | 178 | 178 | 178 | 178 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | 7 | 8 (faster) | 7 | 7 | 7 | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Configuration Memory | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash | Dual-configuration flash |
| Integrated ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
Key Differentiators
- Dual-configuration non-volatile flash eliminates external boot PROM (vs 10M08DAF256C7G)
- Highest density in 256-LBGA MAX 10 family at commercial temp grade (vs 10M25DAF256C7G)
- Integrated 12-bit ADC for sensor monitoring (vs 10M16DAF256A7G (industrial temp))
Design Notes
The 10M16DAF256C7G uses a 256-LBGA (F256) package with a 1.0 mm pitch ball grid. PCB design requires a 4-layer or higher stack-up with a continuous ground plane beneath the BGA for thermal dissipation and signal integrity. BGA escape routing must use microvias (laser-drilled) with 0.1 mm drill size on inner layers and standard 0.2 mm vias on outer layers. For prototype assembly, X-ray inspection is required to verify BGA solder joint quality, and BGA rework capability must be available for any board revisions. The MAX 10 Hardware Design Guidelines document must be reviewed before board layout to ensure proper decoupling and power plane assignments.
The 10M16DAF256C7G dual-supply variant ('DA' suffix) requires separate 1.2V VCCINT and 3.3V VCCIO rails with proper sequencing. Estimated: at 85% logic utilization and 100 MHz operation, VCCINT current consumption is approximately 200-400 mA, requiring a switching regulator with at least 600 mA capacity and adequate bulk decoupling (>= 47 uF low-ESR ceramic). Place 0.1 uF and 1 uF ceramic decoupling capacitors within 2 mm of every VCC pin pair (VCCINT/GND and VCCIO/GND). The MAX 10 datasheet specifies that VCCIO must not be applied before VCCINT to avoid latch-up; design power sequencing circuits (using TI LM3880 sequencer or discrete RC delay) accordingly.
Common pitfalls when designing with the 10M16DAF256C7G include: (1) forgetting that all MAX 10 FPGAs require the JTAG TDI/TDO/TMS/TCK pins to be properly terminated - unused JTAG pins should be tied to known state per the device handbook; (2) overlooking the dual-configuration flash default image selection - verify which image boots first in the design; (3) not enabling the internal pull-up resistors on user I/O pins during configuration to avoid current leakage through floating inputs; (4) failing to assign CONFIG_DONE, nSTATUS, and nCONFIG pins correctly in the Quartus Prime pin planner, which can cause configuration failures during field updates; (5) ignoring the CONF_DONE and nSTATUS LED indicator recommendations to add visual status feedback for production testing.
Compliance Information
RoHS and lead-free compliant per Altera/Intel product marking. C7G suffix denotes commercial temperature grade (0C to +85C); not AEC-Q100 qualified - select MAX 10 automotive grade parts (prefix 'A' or with -A suffix) for automotive applications.
