10M16DAU324I7P - MAX 10 FPGA 16K LE 246 I/O | Intel | 324-LFBGA
MPN: 10M16DAU324I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $65.8 | $6,580.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $51.2 | $51,200.00 |
Drop-in alternatives for 10M16DAU324I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DAU324I7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M16DAU324C8G
✅ Drop-In✓ In Stock
$35.4 / Unit
View Datasheet →10M16DAU324A7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M08DAU324I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.1 / Unit
View Datasheet →10M08DAU324C8G
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →10M16DAU324I7P Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 16000 |
| User I/O Count | 246 |
| Embedded Memory | 549 kbit |
| Embedded Multipliers (18x18) | 246 |
| Package | 324-LFBGA (UBGA-324) |
| Operating Supply Voltage (Core) | 1.2 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +100 C |
| Speed Grade | 7 |
| Temperature Grade | Industrial (I) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M16DAU324I7P 324-lfbga (ubga-324) Pin Configuration Guide
Complete pinout information for 10M16DAU324I7P (324-lfbga (ubga-324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DAU324I7P.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DAU324I7P is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Aggregation, Low-Cost ASIC Replacement, Sensor Fusion and IoT Edge Nodes, Portable Test and Measurement.
Industrial Motor Control
The 10M16DAU324I7P fits industrial motor control because its 16K logic elements comfortably handle field-oriented control (FOC) algorithms, sensorless observers, and multi-axis coordination at 32 kHz PWM update rates. The integrated 12-bit 1 MSPS ADC samples phase currents synchronously to PWM events without an external analog front-end, while 246 I/Os drive high-resolution encoder interfaces, resolver excitation, and gate-driver signals. The on-chip flash and dual-configuration boot allow in-field firmware upgrades between production runs. At 1.2 V core and industrial -40 to +100 C operation, the device tolerates factory-floor thermal stress.
Recommended
Factory Automation I/O Expansion
For PLC backplane and distributed I/O blocks, the 10M16DAU324I7P provides 246 user I/Os at 0.8 mm pitch, supporting LVDS, RS-485, 24 V field-bus isolators, and parallel industrial Ethernet interfaces. The 549 kbit embedded memory buffers high-speed packet inspection and timestamp data. Industrial temperature grade (-40 to +100 C) and 1.2 V core simplify MTBF analysis. Designers can map EtherCAT or PROFINET soft IP into the same die, eliminating a companion ASIC. The MAX 10 dual-boot flash supports redundant firmware for zero-downtime field updates.
Recommended
Video Bridging and Display Aggregation
The 10M16DAU324I7P can aggregate multiple MIPI CSI-2 or parallel CMOS camera inputs into a single USB3 or Ethernet output in video bridging applications. The 246 18x18 multipliers accelerate JPEG/H.264 encoding, while 549 kbit block RAM holds multiple video line buffers without external SDRAM. The industrial temperature range covers outdoor surveillance and machine-vision enclosures. The 324-LFBGA package delivers the I/O density required for 8-bit parallel camera interfaces and HDMI/DVI output bridges. On-chip flash cuts BOM cost versus SRAM-based FPGAs.
Recommended
Low-Cost ASIC Replacement
The 10M16DAU324I7P replaces custom ASICs in volumes below 100K units where NRE charges are uneconomical. With 16K LEs, 246 I/Os, hard ADC, on-chip flash, and 1.2 V operation, the MAX 10 integrates nearly all glue logic of a typical mixed-signal ASIC. Industrial temperature grade supports automotive and industrial markets. The dual-boot flash and JTAG-based programming eliminate the need for an external boot PROM. Designers prototype on the MAX 10 dev kit then move to production boards with the same 324-LFBGA footprint.
Recommended
Sensor Fusion and IoT Edge Nodes
Edge-sensor aggregation nodes use the 10M16DAU324I7P to interface multiple SPI, I2C, and UART sensors, then pre-process and compress data before forwarding to a host MCU. The 549 kbit embedded memory holds moving-window statistics and FIR filter taps; the 246 18x18 multipliers accelerate FFT and Kalman filter math. The integrated 12-bit ADC samples analog environmental sensors (temperature, pressure) without an external ADC chip. Industrial temperature range supports outdoor deployment, while the 324-LFBGA package's compact 19 mm x 19 mm footprint suits small-form-factor sensor hubs.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M16DAU324I7P's high I/O count to capture multiple channels at 200 MHz+ while running on-board DSP for FFT, eye-diagram, and protocol decode. The integrated 12-bit ADC eliminates an external mixed-signal front end for low-bandwidth channels. Industrial -40 to +100 C support covers bench-to-field portable instruments. The on-chip flash simplifies factory calibration storage, and the 549 kbit block RAM buffers deep acquisition captures. USB3, Ethernet, or PCIe soft IP can be implemented in the same die to streamline BOM.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAU324I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAU324I7G | 10M16DAU324C8G | 10M16DAU324A7G | 10M08DAU324I7G | 10M08DAU324C8G |
|---|---|---|---|---|---|---|
| Package | 324-LFBGA (UBGA-324) | 324-LFBGA | 324-LFBGA | 324-LFBGA | 324-LFBGA | 324-LFBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16000 | 16000 | 16000 | 16000 | 8000 | 8000 |
| User I/Os | 246 | 246 | 246 | 246 | 246 | 246 |
| Embedded Memory | 549 kbit | 549 kbit | 549 kbit | 549 kbit | 378 kbit | 378 kbit |
| Temperature Grade | Industrial -40 to +100 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Automotive -40 to +125 C (AEC-Q100) | Industrial -40 to +100 C | Commercial 0 to +85 C |
| Speed Grade | 7 | 7 | 8 | 7 | 7 | 8 |
| AEC-Q100 Qualified | No | No | No | Yes | No | No |
Key Differentiators
- Highest I/O density in MAX 10 10M16 family (vs 10M16DAF484I7P)
- Industrial temperature grade with maximum density (vs 10M16DAU324C8G)
- Lower density drop-in for cost-optimized designs (vs 10M08DAU324I7G)
Design Notes
The 324-LFBGA package uses 0.8 mm ball pitch. Follow Intel AN 532 for land pattern, solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) pad choice, and reflow profile. SMD pads with a 0.35 mm copper pad diameter and 0.65 mm solder-mask opening are recommended for robust BGA joint formation. Allow at least 6 layers with dedicated ground and 1.2 V power planes beneath the device to provide low-impedance current return paths for the high-speed I/O and ADC.
The 10M16DAU324I7P requires multiple supply rails: 1.2 V core (VCCINT), 1.2 V or 2.5 V PLL analog (VCCA), 2.5 V or 3.3 V configuration (VCCIO7/8 for configuration banks), and per-bank VCCIO for I/O standards. Decouple each rail with 100 nF X7R ceramic capacitors placed within 2 mm of each power pin, plus bulk 10-47 uF tantalum or polymer capacitors on the board. Sequence VCCINT before VCCIO per Intel Power-Up sequencing guidelines to avoid latch-up. The integrated ADC requires a clean 2.5 V analog supply separate from digital 2.5 V.
Estimated: at maximum toggling activity and 246 I/O switching simultaneously, dynamic current can exceed 500 mA on the 1.2 V core. Designers should budget thermal dissipation for the LFBGA package, which has theta-JA around 25 C/W on a standard 4-layer JEDEC test board. Provide thermal vias under the central ball array to the opposite copper plane. JTAG configuration pins (TCK, TMS, TDI, TDO) must not be left floating - add 10 kohm pull-ups to VCCIO7 to keep the device in a known state during power-up.
Compliance Information
Industrial-grade MAX 10 FPGA; RoHS and REACH compliant per Intel product declaration. For AEC-Q100 qualified version, choose 10M16DAU324A7G.
