10M16DCU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
MPN: 10M16DCU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $56.73 | $56.73 |
| 10 | $54.2 | $542.00 |
| 100 | $48.95 | $4,895.00 |
| 500 | $44.3 | $22,150.00 |
| 1,000 | $40.1 | $40,100.00 |
Drop-in alternatives for 10M16DCU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DCU324C8G
✅ Drop-In✓ In Stock
$38.4 / Unit
View Datasheet →10M16DCU324A7G
✅ Drop-In✓ In Stock
$34.95 / Unit
View Datasheet →10M16DAU324I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16DAU324I7P
✅ Drop-In✓ In Stock
$51.2 / Unit
View Datasheet →10M08DCU324I7G
✅ Drop-In✓ In Stock
$8.5 / Unit
View Datasheet →10M16DCU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 16,000 |
| Adaptive Logic Modules (ALMs) | 9,920 |
| User I/O Count (Maximum) | 246 |
| Embedded Memory (M9K Blocks) | 558 Kbits |
| Distributed Logic RAM | 12.5 Kbits |
| Embedded User Flash | 562,176 bits (70 KB) |
| Embedded 18x18 Multipliers | 45 |
| PLLs | 4 |
| Maximum LVDS Channels | 125 |
| Package | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | 55 nm NOR-flash-based CMOS |
| Configuration Memory | On-die dual-configuration flash |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M16DCU324I7G 324-ubga (u324), 15 x 15 mm, 0.8 mm pitch Pin Configuration Guide
Complete pinout information for 10M16DCU324I7G (324-ubga (u324), 15 x 15 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCU324I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCU324I7G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Controllers, Factory Automation I/O Expansion, Portable Medical Devices, Low-Cost IoT Gateways, Test and Measurement Instrumentation.
Industrial Motor Control
The 10M16DCU324I7G's integrated 12-bit ADC, PWM-capable PLLs, and 246 user I/Os make it well suited for industrial motor control drives. Its on-die dual-configuration flash supports in-field firmware updates without production-line rework, and the industrial -40C to +100C temperature rating covers factory-floor conditions. Combined with 45 embedded 18x18 multipliers, the FPGA can implement Field-Oriented Control (FOC) loops in hardware, achieving sub-microsecond current-loop latency. Pair with TI C2000 gate drivers or Infineon EiceDRIVER for the power stage.
Recommended
Video Bridging and Display Controllers
With 246 user I/Os and 125 LVDS channels at up to 2.5 Gbps, the 10M16DCU324I7G is widely used in video bridging applications such as MIPI-to-LVDS, HDMI-to-MIPI, and DisplayPort-to-LVDS conversion. The 558 Kbits of block RAM provides sufficient line buffers for multi-megapixel display streams, while the dual-configuration flash supports A/B image failover for safety-critical displays. Quartus Prime IP cores accelerate development of CSI-2, DSI, and OpenLDI interfaces.
Recommended
Factory Automation I/O Expansion
The 246 GPIO count on the 10M16DCU324I7G enables a single FPGA to consolidate multiple industrial protocols such as EtherCAT, PROFINET, Modbus TCP, and RS-485 into one programmable device. Its non-volatile instant-on behavior eliminates boot-time delays required by microcontrollers+external flash combinations. The 4 PLLs allow independent clocking of isolated communication islands, and the on-die temperature sensor enables predictive maintenance telemetry.
Recommended
Portable Medical Devices
Medical designs benefit from the 10M16DCU324I7G's low static power (~25 mW typical), 562 Kbits of user flash for calibration and patient-data logging, and instant-on capability that lets handheld diagnostic equipment boot in under 10 ms. The 12-bit ADC supports direct sensor front-ends for ECG, SpO2, and temperature measurement. The industrial temperature range covers wearable and bedside use cases, while Quartus Prime functional-safety packages ease IEC 62304 documentation.
Recommended
Low-Cost IoT Gateways
IoT edge gateways use the 10M16DCU324I7G to bridge sensors over SPI/I2C/UART and to Ethernet or Wi-Fi radios. The 16K logic elements comfortably handle TLS acceleration and on-device sensor fusion, while the dual-configuration flash enables secure OTA updates. The 125 LVDS channels support direct connection to high-resolution camera sensors for vision-based IoT endpoints. Power consumption typically stays under 200 mW, enabling battery-backed operation.
Recommended
Test and Measurement Instrumentation
Test equipment designs leverage the 10M16DCU324I7G's 4 PLLs, 45 multipliers, and high I/O count to implement custom waveform generators, logic analyzers, and protocol testers. The on-die ADC combined with 246 user I/Os enables mixed-signal capture at modest sample rates. The 562 Kbits user flash stores calibration tables, eliminating external EEPROMs, and the industrial temperature range supports lab and field-deployed instrumentation alike.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DCU324C8G | 10M16DCU324A7G | 10M16DAU324I7G | 10M08DCU324I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 |
| User I/O Count | 246 | 246 | 246 | 246 | 246 |
| Embedded Multipliers (18x18) | 45 | 45 | 45 | 45 | 24 |
| Block RAM (M9K) | 558 Kbits | 558 Kbits | 558 Kbits | 558 Kbits | 256 Kbits |
| User Flash | 562,176 bits | 562,176 bits | 562,176 bits | 562,176 bits | 290,816 bits |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| PLLs | 4 | 4 | 4 | 4 | 2 |
Key Differentiators
- Mid-density 16K LE with 246 I/O in the MAX 10 family (vs 10M08DCU324I7G)
- Industrial temperature grade at no extra cost (vs 10M16DCU324C8G)
- Instant-on dual-configuration flash with integrated ADC (vs Cyclone V FPGA family)
Design Notes
The 324-UBGA U324 package uses a 0.8 mm ball pitch on a 15 x 15 mm substrate. PCB fabrication must support microvia HDI (High-Density Interconnect) stack-up with at least 4-6-4 layer count. Place at least 4 stitching vias around the BGA perimeter for ground-return inductance control. Reference the Intel MAX 10 device pin connection guidelines for unused-pin tie-off (do not leave UBGA balls floating; tie NC pins to ground per the datasheet). Estimated: microvia cost adds ~15-20% to PCB fabrication but is mandatory for reliable 0.8 mm BGA assembly.
The 10M16DCU324I7G requires three supply rails: VCCINT (core 1.2 V typical, up to ~200 mA), VCCIO (I/O bank voltage, 1.2 V-3.3 V per bank), and VCCA (analog PLL/ADC 2.5 V). All rails must come up within 100 ms of each other per Intel's MAX 10 power management guide. Use a TI TPS54331 or Analog Devices ADM7150 LDO for VCCA to keep ADC noise low; ferrite beads on each VCCIO bank isolate switching noise. Decouple each VCCIO/VCCINT pin pair with 0.1 uF and 10 uF capacitors placed within 100 mils of the ball.
Common pitfalls when designing with the 10M16DCU324I7G: (1) do not exceed 16 LVDS TX channels per bank - the bank VCCIO must be 2.5 V for LVDS operation; (2) the JTAG TCK signal requires a 1-10 kohm pull-down to prevent accidental configuration mode entry; (3) the MSEL[3:0] pins must be tied to VCCIO or GND per the desired configuration mode (AS, PS, JTAG, or fast-on) - floating MSEL causes configuration failure; (4) do not toggle the nCONFIG pin during the configuration window without sequencing per datasheet. Reference Intel AN 736: Using the MAX 10 FPGA Configuration User Guide for the full checklist.
Estimated: at full logic utilization (16K LE, 45 multipliers at 200 MHz, all 246 I/Os switching), the 10M16DCU324I7G consumes approximately 0.7-1.0 W of dynamic power. The 324-UBGA package has a theta-JA of approximately 18 C/W on a 4-layer JEDEC test board, yielding a ~20C junction rise above ambient. For industrial ambient at 85C, junction stays well within the +100C limit. If designing for +100C ambient, add thermal vias under the central BGA balls and consider a 1 oz copper inner-plane stack-up for thermal relief.
Compliance Information
RoHS and lead-free per manufacturer product page. The I7 industrial-grade variant is not AEC-Q100 qualified; choose 10M16DAU324I7G for automotive qualification.
