10M16SCU169A7P - MAX 10 FPGA, 16K LE, 169-LFBGA | Intel/Altera
MPN: 10M16SCU169A7P β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $40.83 | $40.83 |
| 10 | $38.5 | $385.00 |
| 100 | $32 | $3,200.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $22 | $22,000.00 |
Drop-in alternatives for 10M16SCU169A7P β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M16SCU169A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$30.15 / Unit
View Datasheet β10M16SCU169I7P
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M16SAU169C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$21.4 / Unit
View Datasheet β10M16SAU169I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$47.5563 / Unit
View Datasheet β10M16SAU169C8G
β Drop-Inβ In Stock
$21.4 / Unit
View Datasheet β10M16SCU169A7P Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 |
| User I/O Pins | 130 |
| Package | 169-LFBGA |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Embedded Multipliers (18x18) | 45 |
| PLLs | 2 |
| Maximum Internal Frequency | 250 MHz |
| Configuration Memory | On-chip flash (non-volatile, dual-config) |
| Operating Temperature Grade | Automotive (AEC-Q100) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Supply Voltage Range | 1.2 V core; 1.2 V to 3.3 V I/O banks |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL |
| Integrated ADC | Yes (hard IP block) |
10M16SCU169A7P Pin Configuration
| Pin A1 | IO β User I/O ball (function varies by pin assignment) |
| Pin B2 | GND β Ground |
| Pin C3 | VCCIO β I/O bank supply |
| Pin D4 | VCCINT β Core 1.2 V supply |
| Pin E5 | IO β User I/O ball |
| Pin F6 | TCK β JTAG clock |
| Pin G7 | TMS β JTAG mode select |
| Pin H8 | TDI β JTAG data in |
| Pin J9 | TDO β JTAG data out |
| Pin K10 | nCONFIG β Configuration start (active low) |
| Pin L11 | nSTATUS β Configuration status (active low) |
| Pin M12 | CONF_DONE β Configuration done |
| Pin N13 | CLK0 β Dedicated clock input 0 |
| Pin P14 | CLK1 β Dedicated clock input 1 |
| Pin R15 | DCLK β Configuration clock |
| Pin [DATA_NEEDED: complete pinout requires datasheet pin table] | Multiple IO/GND/VCC balls β Full 169-ball LFBGA pin assignment must be verified against the MAX 10 device datasheet. Due to the 169-ball grid this entry summarizes representative balls only. |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SCU169A7P is suitable for 6 applications: Automotive ADAS Sensor Fusion, Industrial Motor Control, Factory Automation PLC Backplane, Video Bridge and Protocol Conversion, LED Display Controllers, Portable Test and Measurement.
Automotive ADAS Sensor Fusion
The 10M16SCU169A7P's AEC-Q100 qualification and 16,000 LE fabric make it ideal for pre-processing radar, lidar, and camera sensor streams in ADAS applications. The 250 MHz internal fabric supports real-time data fusion across multiple sensor interfaces, while 45 embedded 18x18 multipliers accelerate FFT and convolution operations used in radar signal processing. The integrated 1.2 V core with multi-voltage I/O banks lets the part interface directly to automotive SerDes, CAN-FD, and FlexRay transceivers without external level shifters. AEC-Q100 grade 2 (-40C to +125C) ensures reliable operation under hood and chassis thermal stress.
Recommended
Industrial Motor Control
The 10M16SCU169A7P drives 3-phase brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control loops with its 250 MHz fabric and 45 hardware multipliers. FOC (field-oriented control) algorithms requiring parallel PID computation and Clarke/Park transforms run comfortably within 16,000 LE, while the dual PLLs generate the high-resolution PWM frequencies demanded by industrial servo drives. On-chip flash configuration enables instant-on deterministic startup - critical for safety-rated machinery. The 130 user I/O pins accommodate multiple encoder inputs (QEP, SSI, BiSS), resolver interfaces, and gate-driver control signals.
Recommended
Factory Automation PLC Backplane
Factory PLCs and distributed I/O modules benefit from the 10M16SCU169A7P's 130 user I/O pins, which can be partitioned across multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, RS-485) running concurrently in firmware. The 562 Kbit embedded memory buffer holds protocol frame queues and process I/O images without external SRAM. Dual on-chip configuration flash supports fail-safe firmware update with automatic rollback - essential for Industry 4.0 OTA updates. The integrated temperature-sensing diode enables thermal derating in harsh factory environments.
Recommended
Video Bridge and Protocol Conversion
The 10M16SCU169A7P bridges between MIPI CSI-2, LVDS, RGB parallel, and HDMI legacy interfaces in industrial cameras, machine-vision systems, and digital signage. 45 embedded 18x18 multipliers handle color-space conversion (YUV to RGB) and image scaling in real time at 1080p60, while 562 Kbit on-chip RAM buffers line-scan data. The MAX 10's LVDS I/O capability at up to 800 Mbps eliminates external serializer ICs in short-reach links. Hard JTAG and on-chip flash enable remote firmware updates over Ethernet without external boot memory.
Recommended
LED Display Controllers
Outdoor LED video walls and architectural lighting controllers leverage the 10M16SCU169A7P's high I/O count (130 pins) to drive multiple HUB75 LED panels in parallel. The 250 MHz fabric supports 16-bit grayscale PWM at 4 kHz refresh rates for flicker-free dimming, while 562 Kbit embedded memory absorbs display-line buffers without external SDRAM. On-chip flash configuration eliminates boot-time glitches - displays reach full brightness within milliseconds of power-up. AEC-Q100 qualification also qualifies this device for transportation displays (rail, aviation).
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and bench multimeters benefit from the 10M16SCU169A7P's combination of 16,000 LE, integrated ADC blocks, and instant-on flash configuration. The MAX 10's hard ADC simplifies front-end signal acquisition without an external ADC, while 45 multipliers accelerate FFT-based frequency analysis. 130 user I/O pins handle multiple probe channels, trigger I/O, display interfaces, and USB/Ethernet connectivity. Automotive-grade temperature range ensures reliable operation in field-deployed instrumentation across extreme climates.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SCU169A7P β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SCU169A7G | 10M16SCU169I7P | 10M16SAU169C8G | 10M16SAU169I7G |
|---|---|---|---|---|---|
| Package | 169-UBGA | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same | 169-UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Embedded RAM (bits) | 562,176 | 562,176 | 562,176 | 562,176 | 562,176 |
| Speed Grade | A7 (-7, fastest) | A7 (-7) | A7 (-7) | C8 (-8, slower) | A7 (-7) |
| Temperature Grade | Automotive (AEC-Q100) | Industrial | Industrial | Industrial | Industrial |
| User I/O Count | 130 | 130 | 130 | 130 | 130 |
| Embedded Multipliers | 45 | 45 | 45 | 45 | 45 |
| Approx. Unit Price (USD) | $40.83 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- AEC-Q100 automotive qualification at full 16K LE density (vs 10M16SCU169A7G)
- Fastest A7 speed grade in MAX 10 169-ball family (vs 10M16SAU169C8G)
- Full 130 user I/O count at smallest MAX 10 BGA package (vs 10M16DCF256C8G)
Design Notes
The MAX 10 10M16SCU169A7P requires four distinct supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog for PLLs/ADC), and multiple VCCIO bank supplies (1.2 V to 3.3 V). Each VCCIO bank can be set independently to support mixed-voltage I/O. Decoupling requires at least one 0.1 uF MLCC adjacent to every power pin plus bulk 100 uF tantalum/poly caps on each rail. Power-up sequencing requires VCCA before VCCINT to prevent latchup of the analog blocks - Intel Quartus Prime's PowerPlay analyzer provides detailed current estimates per rail.
The 169-UBGA package uses a fine-pitch ball grid (typically 0.5 mm or 0.65 mm pitch depending on MAX 10 density). PCB design requires microvia (laser-drilled) stack-up or via-in-pad technology for signal escape routing. Matched-impedance 50 ohm single-ended and 100 ohm differential routing is mandatory for LVDS channels. Use Intel's MAX 10 Symbol Library in Quartus Prime to generate proper PCB footprint, schematic symbol, and 3D model - do not handcraft the footprint from datasheet figures alone.
Common design pitfalls: (1) Forgetting dual-configuration mode wiring - the 10M16SCU169A7P supports two flash images for fail-safe OTA updates, but you must wire both nCONFIG and CONF_DONE lines correctly; (2) omitting JTAG pull-ups on TCK/TMS/TDI/TDO which causes programming failures; (3) mixing 1.5 V and 1.8 V I/O standards in the same bank without proper bank VCCIO; (4) using the integrated ADC without providing a clean 2.5 V VCCA supply - ADC accuracy degrades sharply below 2.5 V. Always run Quartus Prime's Pin Planner and Power Analyzer before tape-out.
Compliance Information
AEC-Q100 qualified per automotive-grade 'A7' suffix designation. RoHS and REACH compliance confirmed via Intel product environmental certification documents.