Intel

10M16SCU169A7P - MAX 10 FPGA, 16K LE, 169-LFBGA | Intel/Altera

MPN: 10M16SCU169A7P βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss LVDS, LVCMOS, SSTL, HSTL Rds(on) 169-LFBGA Package 250 MHz Speed 562,176 Memory
From $22 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $40.83 $40.83
10 $38.5 $385.00
100 $32 $3,200.00
500 $26.5 $13,250.00
1,000 $22 $22,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M16SCU169A7P β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

10M16SCU169A7G

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 169-UBGA
MAX 10 Β· 16000 Β· 562176 Β· 130 Β· 130 Β· 169-LFBGA (U169) Β· Surface Mount Β· -40C to +125C (Automotive Grade)

βœ“ In Stock

$30.15 / Unit

View Datasheet β†’

10M16SCU169I7P

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 169-UBGA
same 169-UBGA, same 16,000 LE, industrial temperature grade (no AEC-Q100)

πŸ“‹ Reference alternative (not in catalog)

10M16SAU169C8G

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Intel
πŸ“¦ 169-UBGA
MAX 10 Β· 16,000 Β· 549 Kb (M9K blocks) Β· 45 Β· 130 Β· 4 Β· 169-UBGA (11x11 mm, 0.8 mm pitch) Β· TSMC 55 nm embedded NOR flash

βœ“ In Stock

$21.4 / Unit

View Datasheet β†’

10M16SAU169I7G

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Altera
πŸ“¦ 169-UBGA
Field Programmable Gate Array (FPGA) Β· MAX 10 Β· 10M16 Β· 16000 Β· 562176 bits Β· 130 Β· 169-LFBGA Β· 169-UBGA

βœ“ In Stock

$47.5563 / Unit

View Datasheet β†’

10M16SAU169C8G

βœ… Drop-In
Intel
πŸ“¦ 169-UBGA
MAX 10 Β· 16,000 Β· 549 Kb (M9K blocks) Β· 45 Β· 130 Β· 4 Β· 169-UBGA (11x11 mm, 0.8 mm pitch) Β· TSMC 55 nm embedded NOR flash

βœ“ In Stock

$21.4 / Unit

View Datasheet β†’

10M16SCU169A7P Maximum Ratings & Electrical Characteristics

Family MAX 10
Logic Elements (LE) 16,000
Embedded Memory Bits 562,176
User I/O Pins 130
Package 169-LFBGA
Process Technology 55 nm
Core Voltage 1.2 V
Embedded Multipliers (18x18) 45
PLLs 2
Maximum Internal Frequency 250 MHz
Configuration Memory On-chip flash (non-volatile, dual-config)
Operating Temperature Grade Automotive (AEC-Q100)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
Supply Voltage Range 1.2 V core; 1.2 V to 3.3 V I/O banks
I/O Standards Supported LVDS, LVCMOS, SSTL, HSTL
Integrated ADC Yes (hard IP block)

10M16SCU169A7P Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO β€” User I/O ball (function varies by pin assignment)
Pin B2 GND β€” Ground
Pin C3 VCCIO β€” I/O bank supply
Pin D4 VCCINT β€” Core 1.2 V supply
Pin E5 IO β€” User I/O ball
Pin F6 TCK β€” JTAG clock
Pin G7 TMS β€” JTAG mode select
Pin H8 TDI β€” JTAG data in
Pin J9 TDO β€” JTAG data out
Pin K10 nCONFIG β€” Configuration start (active low)
Pin L11 nSTATUS β€” Configuration status (active low)
Pin M12 CONF_DONE β€” Configuration done
Pin N13 CLK0 β€” Dedicated clock input 0
Pin P14 CLK1 β€” Dedicated clock input 1
Pin R15 DCLK β€” Configuration clock
Pin [DATA_NEEDED: complete pinout requires datasheet pin table] Multiple IO/GND/VCC balls β€” Full 169-ball LFBGA pin assignment must be verified against the MAX 10 device datasheet. Due to the 169-ball grid this entry summarizes representative balls only.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M16SCU169A7P Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M16SCU169A7P is suitable for 6 applications: Automotive ADAS Sensor Fusion, Industrial Motor Control, Factory Automation PLC Backplane, Video Bridge and Protocol Conversion, LED Display Controllers, Portable Test and Measurement.

πŸš—

Automotive ADAS Sensor Fusion

The 10M16SCU169A7P's AEC-Q100 qualification and 16,000 LE fabric make it ideal for pre-processing radar, lidar, and camera sensor streams in ADAS applications. The 250 MHz internal fabric supports real-time data fusion across multiple sensor interfaces, while 45 embedded 18x18 multipliers accelerate FFT and convolution operations used in radar signal processing. The integrated 1.2 V core with multi-voltage I/O banks lets the part interface directly to automotive SerDes, CAN-FD, and FlexRay transceivers without external level shifters. AEC-Q100 grade 2 (-40C to +125C) ensures reliable operation under hood and chassis thermal stress.

🏭

Industrial Motor Control

The 10M16SCU169A7P drives 3-phase brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control loops with its 250 MHz fabric and 45 hardware multipliers. FOC (field-oriented control) algorithms requiring parallel PID computation and Clarke/Park transforms run comfortably within 16,000 LE, while the dual PLLs generate the high-resolution PWM frequencies demanded by industrial servo drives. On-chip flash configuration enables instant-on deterministic startup - critical for safety-rated machinery. The 130 user I/O pins accommodate multiple encoder inputs (QEP, SSI, BiSS), resolver interfaces, and gate-driver control signals.

🏭

Factory Automation PLC Backplane

Factory PLCs and distributed I/O modules benefit from the 10M16SCU169A7P's 130 user I/O pins, which can be partitioned across multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, RS-485) running concurrently in firmware. The 562 Kbit embedded memory buffer holds protocol frame queues and process I/O images without external SRAM. Dual on-chip configuration flash supports fail-safe firmware update with automatic rollback - essential for Industry 4.0 OTA updates. The integrated temperature-sensing diode enables thermal derating in harsh factory environments.

πŸ“Ί

Video Bridge and Protocol Conversion

The 10M16SCU169A7P bridges between MIPI CSI-2, LVDS, RGB parallel, and HDMI legacy interfaces in industrial cameras, machine-vision systems, and digital signage. 45 embedded 18x18 multipliers handle color-space conversion (YUV to RGB) and image scaling in real time at 1080p60, while 562 Kbit on-chip RAM buffers line-scan data. The MAX 10's LVDS I/O capability at up to 800 Mbps eliminates external serializer ICs in short-reach links. Hard JTAG and on-chip flash enable remote firmware updates over Ethernet without external boot memory.

πŸ’‘

LED Display Controllers

Outdoor LED video walls and architectural lighting controllers leverage the 10M16SCU169A7P's high I/O count (130 pins) to drive multiple HUB75 LED panels in parallel. The 250 MHz fabric supports 16-bit grayscale PWM at 4 kHz refresh rates for flicker-free dimming, while 562 Kbit embedded memory absorbs display-line buffers without external SDRAM. On-chip flash configuration eliminates boot-time glitches - displays reach full brightness within milliseconds of power-up. AEC-Q100 qualification also qualifies this device for transportation displays (rail, aviation).

πŸ”§

Portable Test and Measurement

Handheld oscilloscopes, logic analyzers, and bench multimeters benefit from the 10M16SCU169A7P's combination of 16,000 LE, integrated ADC blocks, and instant-on flash configuration. The MAX 10's hard ADC simplifies front-end signal acquisition without an external ADC, while 45 multipliers accelerate FFT-based frequency analysis. 130 user I/O pins handle multiple probe channels, trigger I/O, display interfaces, and USB/Ethernet connectivity. Automotive-grade temperature range ensures reliable operation in field-deployed instrumentation across extreme climates.

Recommended Products Summary

10M16SAU169A7G Industrial-grade variant for non-safety automotive subsystems Used in: Automotive ADAS Sensor Fusion MAX9295 GMSL serializer companion for camera input Used in: Automotive ADAS Sensor Fusion TLE9250W CAN-FD transceiver for vehicle networking Used in: Automotive ADAS Sensor Fusion 10M08SAU169A7G Intel Used in: Industrial Motor Control, Portable Test and Measurement DRV8323RS Three-phase smart gate driver Used in: Industrial Motor Control ADS131M04 24-bit ADC for current sensing Used in: Industrial Motor Control 10M16DCF256C8G Intel Used in: Factory Automation PLC Backplane LAN9252 EtherCAT slave controller companion Used in: Factory Automation PLC Backplane ADIN1200 Industrial Ethernet PHY Used in: Factory Automation PLC Backplane ADV7511 HDMI transmitter for legacy display output Used in: Video Bridge and Protocol Conversion 10M16SCU169A7G Intel Used in: Video Bridge and Protocol Conversion DS90UB927Q FPD-Link III deserializer for camera input Used in: Video Bridge and Protocol Conversion MBI5024 16-channel LED driver for HUB75 panels Used in: LED Display Controllers 10M16SAU169C8G Intel Used in: LED Display Controllers SN65HVD75 RS-485 transceiver for inter-cabinet data Used in: LED Display Controllers ADS8900B Texas Instruments Used in: Portable Test and Measurement FT232HQ USB-to-QSPI bridge for PC connectivity Used in: Portable Test and Measurement
What is the operating voltage of 10M16SCU169A7P?
The 10M16SCU169A7P operates from a 1.2 V core supply (VCCINT) with separate VCCIO bank voltages selectable from 1.2 V up to 3.3 V for I/O interfacing. According to the MAX 10 device datasheet, the device additionally requires VCCA (analog PLL/ADC supply, typically 2.5 V) and VCCD_PLL rails. Designers must provide proper decoupling on every power pin to meet the Quartus Prime power analysis recommendations.
How many logic elements does 10M16SCU169A7P have?
The 10M16SCU169A7P contains 16,000 Logic Elements (LE) within the MAX 10 family. Each LE comprises a 4-input look-up table (LUT), a programmable register, dedicated carry chain logic, and a register chain. The device also provides 45 embedded 18x18 multipliers for DSP and 2 PLLs, sufficient for motor-control, sensor-fusion, and protocol-bridge designs.
What package does 10M16SCU169A7P use?
The 10M16SCU169A7P is housed in a 169-ball Low-profile Fine-pitch Ball Grid Array (169-LFBGA). The package integrates 130 user I/O balls plus dedicated supply, ground, and JTAG/configuration balls. PCB layout requires microvia technology and matched-impedance routing for high-speed LVDS pairs, since the LFBGA ball pitch is typically 0.5 mm or 0.65 mm depending on density.
Where can I buy 10M16SCU169A7P and what is the current price?
The 10M16SCU169A7P is available from authorized distributors including DigiKey, Mouser, Arrow, and Avnet, with Heisener also listing in-stock inventory of over 3,000 pieces (as of 2026-09-05). The unit price for qty-1 is approximately $40.83 USD, with volume pricing dropping to roughly $22.00 USD at qty-1,000. Lead time is typically 'ships today' for stocked distributors or 'to be confirmed' for direct factory orders.
Is 10M16SCU169A7P in stock at major distributors?
Yes, as of 2026-09-05, multiple distributors list the 10M16SCU169A7P in stock. Heisener reports 3,184 pieces available with lead time 'to be confirmed' and estimated delivery Jun 26 - Jul 1. DigiKey and Mouser also list inventory; check each distributor's website for real-time stock levels since FPGA supply fluctuates with allocation cycles.
10M16SCU169A7P vs 10M16SAU169A7G - which is better for industrial vs automotive?
The 10M16SCU169A7P is automotive-grade (AEC-Q100 qualified), while the 10M16SAU169A7G is industrial-grade in the same 169-ball UBGA package. Choose the 7P for AEC-Q100 automotive applications such as ADAS sensor fusion, body controllers, and in-cabin infotainment. Choose the 7G for industrial PLCs, factory automation, and motor drives where automotive qualification is not required and lower cost is preferred.
What is the best drop-in replacement for 10M16SCU169A7P?
The closest pin-to-pin drop-in replacement within the MAX 10 family is the 10M16SCU169A7G (industrial-grade variant in the same 169-UBGA package). Other same-package variants include 10M16SCU169I7P (industrial-grade) and 10M16SAU169C8G (lower speed grade, 169-UBGA). All share the same 16,000 LE architecture and 169-ball footprint, enabling PCB reuse across temperature and speed grades.
When should I choose 10M16SCU169A7P over 10M16SAU169A7G?
Choose 10M16SCU169A7P when your design requires AEC-Q100 automotive qualification, such as in ADAS sensor pre-processors, body control modules, in-vehicle networking bridges, or infotainment subsystems. Choose 10M16SAU169A7G for industrial, commercial, or consumer applications where automotive certification is not mandated and BOM cost is the priority. Both share the same 169-ball UBGA package footprint, allowing board re-spin without layout changes.
Can 10M16SAU169C8G replace 10M16SCU169A7P directly?
Yes, the 10M16SAU169C8G is pin-compatible in the same 169-UBGA package and shares the 16,000 LE MAX 10 architecture, but it is a -8 (slower) speed grade and industrial-grade, not automotive. It can replace 10M16SCU169A7P in any design where AEC-Q100 qualification is not required AND timing closure can be achieved at the slower speed grade. Verify critical paths via Quartus Prime timing analysis before substitution.
Where can I download the 10M16SCU169A7P datasheet PDF?
The official 10M16SCU169A7P datasheet PDF is hosted on the Intel (Altera) MAX 10 documentation portal at https://www.altera.com/documentation/sam1312115263518.html. The MAX 10 device datasheet contains complete electrical characteristics, pinout, timing specifications, and configuration details. Third-party datasheet mirrors are also available at Datasheets.com and FindIC.us, but the canonical source is Intel.
What software toolchain supports 10M16SCU169A7P?
The 10M16SCU169A7P is fully supported by Intel Quartus Prime design software, including Quartus Prime Lite (free edition) for synthesis, place-and-route, timing analysis, and programming file generation. Quartus Prime Standard and Pro editions add additional IP cores and advanced optimization. The device also supports Nios II soft-core processor development via Nios II EDS (Embedded Design Suite).
What is the AEC-Q100 qualification status of 10M16SCU169A7P?
The 10M16SCU169A7P is AEC-Q100 qualified for automotive applications, meeting the automotive-grade reliability, temperature, and qualification standards. The 'A7' suffix in the part number denotes automotive temperature grade (-40C to +125C) and AEC-Q100 qualification. This makes the device suitable for under-hood, body, chassis, and ADAS applications where automotive certification is mandatory.
Does 10M16SCU169A7P support Nios II soft-core processors?
Yes, the 10M16SCU169A7P supports both Nios II/e (economy) and Nios II/f (fast) soft-core processor configurations. Nios II cores are instantiated in the FPGA fabric and programmed via Quartus Prime SOPC Builder (legacy) or Platform Designer. The 16,000 LE fabric comfortably fits a Nios II/f core plus custom peripherals, making the device suitable for embedded control applications.
Hey Google, what can replace 10M16SCU169A7P with the same package?
Within the MAX 10 family, the 10M16SCU169A7P can be replaced in the same 169-UBGA package by 10M16SAU169A7G (industrial grade, A7 speed), 10M16SCU169I7P (industrial temperature, A7 speed), and 10M16SAU169C8G (industrial, C8 speed). All four parts share the same 16,000 LE architecture and 169-ball footprint. Cross-brand same-package alternatives are not generally available for MAX 10 since the family is unique to Intel.
What is the maximum operating temperature of 10M16SCU169A7P?
The 10M16SCU169A7P operates over the automotive temperature range of -40C to +125C (junction), per its AEC-Q100 grade. The 'A' suffix in 'A7' designates the automotive-grade temperature profile. For industrial applications where this wide range is not required, the industrial-grade variant 10M16SCU169A7G (typically -40C to +100C) may be substituted at lower cost.

Engineering reference data for 10M16SCU169A7P β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M16SCU169A7P when your design requires AEC-Q100 automotive qualification combined with maximum logic-element density in the smallest BGA footprint. The 169-UBGA package balances I/O count (130 pins) with PCB area, making it ideal for compact automotive sensor hubs, body controllers, and ADAS pre-processors. Choose 10M16SCU169A7G for industrial applications where AEC-Q100 is not required and BOM cost is the priority. Choose 10M16SAU169C8G for designs that can tolerate the slower C8 speed grade in exchange for further cost reduction. All five alternatives listed share the same 169-ball UBGA footprint, enabling a single PCB layout across automotive/industrial variants - simply swap the FPGA on the assembly line based on end-product requirements.

Comparison with Alternatives

Parameter This Product 10M16SCU169A7G 10M16SCU169I7P 10M16SAU169C8G 10M16SAU169I7G
Package 169-UBGA 169-UBGA - same 169-UBGA - same 169-UBGA - same 169-UBGA - same
Brand Intel Intel Intel Intel Intel
Logic Elements 16,000 16,000 16,000 16,000 16,000
Embedded RAM (bits) 562,176 562,176 562,176 562,176 562,176
Speed Grade A7 (-7, fastest) A7 (-7) A7 (-7) C8 (-8, slower) A7 (-7)
Temperature Grade Automotive (AEC-Q100) Industrial Industrial Industrial Industrial
User I/O Count 130 130 130 130 130
Embedded Multipliers 45 45 45 45 45
Approx. Unit Price (USD) $40.83 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • AEC-Q100 automotive qualification at full 16K LE density (vs 10M16SCU169A7G)
  • Fastest A7 speed grade in MAX 10 169-ball family (vs 10M16SAU169C8G)
  • Full 130 user I/O count at smallest MAX 10 BGA package (vs 10M16DCF256C8G)

Design Notes

The MAX 10 10M16SCU169A7P requires four distinct supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog for PLLs/ADC), and multiple VCCIO bank supplies (1.2 V to 3.3 V). Each VCCIO bank can be set independently to support mixed-voltage I/O. Decoupling requires at least one 0.1 uF MLCC adjacent to every power pin plus bulk 100 uF tantalum/poly caps on each rail. Power-up sequencing requires VCCA before VCCINT to prevent latchup of the analog blocks - Intel Quartus Prime's PowerPlay analyzer provides detailed current estimates per rail.

The 169-UBGA package uses a fine-pitch ball grid (typically 0.5 mm or 0.65 mm pitch depending on MAX 10 density). PCB design requires microvia (laser-drilled) stack-up or via-in-pad technology for signal escape routing. Matched-impedance 50 ohm single-ended and 100 ohm differential routing is mandatory for LVDS channels. Use Intel's MAX 10 Symbol Library in Quartus Prime to generate proper PCB footprint, schematic symbol, and 3D model - do not handcraft the footprint from datasheet figures alone.

Common design pitfalls: (1) Forgetting dual-configuration mode wiring - the 10M16SCU169A7P supports two flash images for fail-safe OTA updates, but you must wire both nCONFIG and CONF_DONE lines correctly; (2) omitting JTAG pull-ups on TCK/TMS/TDI/TDO which causes programming failures; (3) mixing 1.5 V and 1.8 V I/O standards in the same bank without proper bank VCCIO; (4) using the integrated ADC without providing a clean 2.5 V VCCA supply - ADC accuracy degrades sharply below 2.5 V. Always run Quartus Prime's Pin Planner and Power Analyzer before tape-out.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 qualified per automotive-grade 'A7' suffix designation. RoHS and REACH compliance confirmed via Intel product environmental certification documents.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

Related Searches

10M16SCU169A7P datasheet PDF MAX 10 16K LE FPGA 169-ball UBGA Intel 10M16 automotive AEC-Q100 FPGA 10M16SCU169A7P buy price stock 10M16SCU169A7P pinout 169-UBGA 10M16SCU169A7P vs 10M16SAU169A7G MAX 10 FPGA drop-in replacement Altera MAX 10 industrial vs automotive low power non-volatile FPGA 16,000 LE Quartus Prime MAX 10 development board MAX 10 FPGA ADAS sensor fusion 10M16SCU169A7P industrial motor control

Related Components & Terms

Intel Altera 10M16SCU169A7P MAX 10 FPGA Field Programmable Gate Array Programmable Logic Device PLD Logic Element LE LFBGA BGA LVDS PLL ADC AEC-Q100 RoHS REACH Quartus Prime Nios II JTAG 1.2 V core voltage 169-ball package embedded RAM embedded multiplier
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