10M16SAU169I7G - 16K Logic, 130 I/O FPGA | Altera | Embedded Control
MPN: 10M16SAU169I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.5563 | $47.56 |
| 10 | $47.5563 | $475.56 |
| 100 | $47.5563 | $4,755.63 |
| 500 | $47.5563 | $23,778.15 |
| 1,000 | $47.5563 | $47,556.30 |
Drop-in alternatives for 10M16SAU169I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16SAU169C8G
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →10M16SAE144C8G
✅ Drop-In✓ In Stock
$27.01 / Unit
View Datasheet →10M16DCF256I7G
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →10M16DCF484C7G
✅ Drop-In✓ In Stock
$31.8 / Unit
View Datasheet →10M08SCU169I7G
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →10M16SAU169I7G Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Product Family | MAX 10 |
| Device Variant | 10M16 |
| Logic Elements | 16000 |
| Embedded Memory | 562176 bits |
| User I/O | 130 |
| Package | 169-LFBGA |
| Alternate Package Description | 169-UBGA |
| Package Type | Ball Grid Array |
| Process Technology | 55 nm |
| Integrated M9K SRAM | 549 KB |
| User Flash Memory | 549 Kbit |
| Integrated ADC | 12 bit |
| Phase-Locked Loops | 4 |
| Configuration Type | Non-volatile |
| Ordering Temperature Classification | Industrial |
| Speed Grade | 7 |
10M16SAU169I7G ball grid array Pin Configuration Guide
Complete pinout information for 10M16SAU169I7G (ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SAU169I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SAU169I7G is suitable for 6 applications: Industrial Control, Factory Automation, Communications Equipment, Test and Measurement, Embedded Control Systems, Motor-Control Interface.
Industrial Control
10M16SAU169I7G fits industrial control systems that need parallel programmable logic, 130 user I/O, and non-volatile configuration in a 169-LFBGA package. The 16000 logic elements provide capacity for interface aggregation, state machines, timing, safety sequencing, and protocol adaptation. The MAX 10 family's integrated resources can reduce external support circuitry when the exact configuration is verified. The design should use the 130 I/O for sensor, actuator, and communications interfaces while keeping unused pins and bank resources under explicit constraints. Industrial temperature qualification, exact I/O voltage, clocking, and power sequencing must be confirmed from the manufacturer documentation before release.
Recommended
Factory Automation
10M16SAU169I7G is suitable for factory automation equipment requiring deterministic hardware logic, multiple control interfaces, and configuration retention. Its 16000 logic elements can implement motion-command preprocessing, I/O event handling, communication bridges, and machine sequencing. The 130 I/O resources are useful when a controller must connect to encoders, limit switches, actuators, or isolated I/O modules. MAX 10 integration may simplify the platform by combining programmable logic with system-level resources, but the exact ADC, PLL, and user-flash capabilities must be confirmed for the selected device and configuration. Designers should validate industrial temperature, timing, and package-ball assignments before PCB release.
Recommended
Communications Equipment
10M16SAU169I7G can serve communications equipment that needs moderate logic density, parallel processing, and a large programmable I/O interface. The 16000 logic elements support packet handling, framing, channel aggregation, clock-domain management, and low-latency control functions. The 130 I/O count enables connection to serializers, transceivers, management controllers, status signals, and backplane interfaces. A non-volatile MAX 10 configuration can simplify field deployment when the complete device configuration flow is approved. Because the supplied data does not specify transceiver count, maximum clock frequency, or I/O voltage, those values must not be inferred. Validate signal integrity, bank usage, timing, and the supported design-software flow.
Recommended
Test and Measurement
10M16SAU169I7G is a good fit for test and measurement equipment that requires configurable acquisition control, deterministic sequencing, and numerous digital connections. The 16000 logic elements can implement trigger logic, counters, timing generation, data routing, and instrument-control interfaces. Its 130 I/O support can connect sensors, ADC or DAC control signals, calibration paths, displays, and service buses. The family-level description of a 12-bit ADC, four PLLs, 549 KB of M9K SRAM, and 549 Kbit of user flash may add value, but these claims are secondary and require confirmation for the exact ordering code. Establish measurement accuracy, I/O standards, timing budgets, and thermal conditions from the full device documentation.
Recommended
Embedded Control Systems
10M16SAU169I7G supports embedded control designs that need hardware parallelism, configurable interfaces, and retained configuration. With 16000 logic elements and 562176 embedded memory bits, the device can combine control processing, peripheral bridging, timing functions, and application-specific state machines without a fixed-function ASIC. The 130 I/O count is helpful for mixed peripheral counts, while the 169-LFBGA package provides a high-density surface-mount implementation. The non-volatile architecture can reduce system complexity if configuration storage, programming, and in-system update requirements are confirmed. Review power rails, startup sequencing, supported I/O standards, clock resources, and configuration method before schematic completion; the verified snippets do not provide these electrical limits.
Recommended
Motor-Control Interface
10M16SAU169I7G fits motor-control interface electronics where programmable timing, signal conditioning coordination, and multiple I/O are required. The 16000 logic elements can manage encoder inputs, PWM timing, fault handling, command arbitration, and communication with a supervisory controller. The 130 user I/O provide capacity for Hall or encoder signals, bridge-enable controls, current-sense paths, status indicators, and isolated interfaces. MAX 10 family integration may help consolidate functions, but motor designs must carefully separate noisy power domains from sensitive logic and confirm the target's supported I/O standards and voltage levels. Industrial temperature, timing, thermal performance, and exact ball assignments remain mandatory verification items before hardware release.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SAU169I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SAU169C8G | 10M16SAE144C8G | 10M16DCF256I7G | 10M16DCF484C7G | 10M08SCU169I7G |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA | 169-LFBGA | 144-LQFP | 256-FBGA | 484-FBGA | 169-UBGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 16000 | 16000 | 16000 | 16000 | 16000 | 8000 |
| Embedded Memory | 562176 bits | 562176 bits | 562176 bits | 562176 bits | 562176 bits | [DATA_NEEDED] |
| User I/O | 130 | 130 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | 7 | 8 | 8 | 7 | 7 | 7 |
| Temperature Classification | Industrial | Commercial | Commercial | Industrial | Commercial | Industrial |
| Process Technology | 55 nm | 55 nm | 55 nm | 55 nm | 55 nm | 55 nm |
Key Differentiators
- U169 package identity with 130 user I/O (vs 10M16SAU169C8G)
- Verified target resource density (vs 10M08SCU169I7G)
- Industrial ordering classification (vs 10M16SAU169C8G)
- High-density package resource count (vs 10M16SAE144C8G)
Design Notes
Start the power design from the exact MAX 10 10M16 U169 ordering documentation, not from a generic FPGA rail recommendation. The supplied data confirms the 16000 logic elements, 562176 memory bits, 130 I/O, 169-LFBGA package, and speed grade 7, but it does not provide core voltage, I/O voltage, current, or power-consumption values. Confirm the permitted I/O-bank combinations, rail ramp requirements, decoupling network, and power-up sequencing for the selected speed grade and configuration. Use the complete manufacturer's power estimator and post-layout analysis, because logic utilization, clock rate, I/O toggling, and enabled IP can materially change demand.
Treat the 169-LFBGA package as a high-density BGA layout and obtain the complete official ball map before placement. The supplied snippets do not provide individual ball numbers, bank assignments, power pins, clock inputs, or configuration connections. Cross-check the selected device, speed grade, and package against the manufacturer footprint and escape recommendations. Keep high-speed clocks and sensitive analog or control paths away from aggressive power and I/O edges, provide an uninterrupted reference plane, and use the documented via and fanout pattern. Do not begin routing from a guessed 169-ball pinout, because the 169-LFBGA and 169-UBGA descriptions are package-family terminology rather than a verified ball map.
Plan signal integrity around the selected I/O standards, bank restrictions, clock domains, and the actual external interfaces. The target exposes 130 user I/O, but the verified source data does not state supported I/O standards, maximum toggle rates, transceiver count, or I/O voltage. After those limits are confirmed, assign interfaces to compatible banks and preserve return paths on the PCB. Add source, destination, connector, and series-termination analysis for high-speed or long traces. Keep configuration and clock routing within the manufacturer's guidelines, and verify the design in the supported Intel FPGA tool flow with timing constraints that match the final hardware.
Thermal validation must use measured or manufacturer-provided values for the final utilization and environmental conditions. The supplied data identifies a 55 nm secondary process description, 16000 logic elements, 130 I/O, and 169-LFBGA package, but does not provide power dissipation, junction temperature, or thermal resistance. Therefore [DATA_NEEDED: thermal resistance, power consumption, and recommended operating temperature] remains unresolved. Estimate switching activity only for planning, then run the manufacturer's power estimator, inspect the package copper and via strategy, and measure the populated board at maximum ambient, airflow, clock, I/O, and enabled-IP load.
The most common substitution and documentation errors are assuming that a same-density MAX 10 device is automatically interchangeable, treating 169-LFBGA and 169-UBGA as a complete pinout, or applying a commercial ordering code to an industrial requirement. The cross-reference material identifies 10M16SAU169C8G as a same-U169-logic-resource option with commercial temperature and speed grade 8, so it is not an unconditional replacement for the industrial, speed-grade-7 target. Confirm temperature, timing, package, configuration, supported software, and lifecycle information before approval. The supplied sources also do not establish compliance or electrical limits; obtain the current manufacturer declarations and datasheet rather than inferring them.
Compliance Information
No authoritative RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration appears in the supplied web data. The target is an FPGA, and AEC-Q100 status was not provided.
