5CEFA4U19I7 - Cyclone V E FPGA 49K LE UFBGA-484 | Intel/Altera
MPN: 5CEFA4U19I7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $31.42 | $31.42 |
| 10 | $28.95 | $289.50 |
| 100 | $25.4 | $2,540.00 |
| 500 | $22.18 | $11,090.00 |
| 1,000 | $19.75 | $19,750.00 |
Drop-in alternatives for 5CEFA4U19I7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CEFA5U19I7N
β Drop-Inπ Reference alternative (not in catalog)
5CEFA9F27I7N
β Drop-Inπ Reference alternative (not in catalog)
5CEFA4F23I7N
β Drop-Inπ Reference alternative (not in catalog)
5CEFA2F23I7N
β Drop-Inβ In Stock
$42.85 / Unit
View Datasheet β5CEBA4F23C8N
β Drop-Inβ In Stock
$62.41 / Unit
View Datasheet β5CEFA4U19I7N
β Drop-Inπ Reference alternative (not in catalog)
5CEFA4U19I7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone V E |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| Embedded Memory (Mbits) | 3.46 Mbits |
| 18x18 Multipliers | 224 |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Operating Temperature Range | -40C to +100C (Industrial, I7 grade) |
| Package | 484-ball UFBGA (UBGA-484, 19x19 mm) |
| Mounting Type | Surface Mount (BGA) |
| Transceivers | None (E variant, no GX/GT suffix) |
| Configuration Scheme | Serial/Parallel (Quartus Prime supported) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CEFA4U19I7 484-ball ufbga (ubga-484, 19x19 mm) Pin Configuration Guide
Complete pinout information for 5CEFA4U19I7 (484-ball ufbga (ubga-484, 19x19 mm) package) with [DATA_NEEDED: depends on package variant] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CEFA4U19I7.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: depends on package variant] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CEFA4U19I7 is suitable for 6 applications: Industrial Motor Control and Drive, Video Surveillance and Machine Vision, Software-Defined Radio (SDR) Baseband, Automotive Infotainment and Driver Assistance (Non-Safety), Industrial IoT Edge Gateway, Test and Measurement Instrumentation.
Industrial Motor Control and Drive
The 5CEFA4U19I7 fits industrial motor control because its 224 18x18 hardware multipliers accelerate field-oriented control (FOC) and space-vector PWM algorithms, while the 3.46 Mbits of embedded memory buffer current-loop sample streams. Industrial temperature rating (-40C to +100C) lets it sit beside power stages on factory-floor drive boards. Compared with a microcontroller+DSP two-chip solution, the FPGA consolidates encoder decoding, PWM generation, and safety logic in a single -7 speed-grade device, simplifying the bill of materials for mid-power servo drives.
Recommended
Video Surveillance and Machine Vision
The 5CEFA4U19I7 is well-suited for video surveillance and machine vision pipelines because its 224 hardware multipliers handle real-time Sobel, Gaussian, and Haar filter kernels at HD video rates, while the 3.46 Mbits of on-chip memory stores line buffers to feed external DDR3 memory through the dedicated PHY. The 484-UFBGA package exposes enough I/O to drive a MIPI-CSI, LVDS, or parallel CMOS sensor plus an HDMI/DVI display output. Industrial temperature grade supports outdoor camera enclosures, and Quartus Prime video IP cores (VIP) accelerate bring-up.
Recommended
Software-Defined Radio (SDR) Baseband
The 5CEFA4U19I7 supports software-defined radio baseband processing where its 224 multipliers implement digital down-conversion, FIR filtering, and FFT butterflies at baseband sample rates. While the E variant lacks transceivers, an external ADC/DAC pair feeds the FPGA's LVDS I/O, and the 3.46 Mbits of block memory buffer FFT windows. The -7 speed grade comfortably closes timing at 200 MHz fabric clocks typical of DDC stages. The U19 484-ball package provides sufficient I/O for multi-channel ADC interfaces plus Ethernet or USB bridging.
Recommended
Automotive Infotainment and Driver Assistance (Non-Safety)
The 5CEFA4U19I7 suits non-safety-critical automotive paths such as infotainment HMI rendering, surround-view stitching, and rear-seat entertainment because its industrial -40C to +100C temperature grade exceeds AEC-Q100 grade-3 expectations and its 3.46 Mbits of block memory buffers multi-camera frames. The 484-UFBGA footprint supports LVDS display links to cluster and head-unit panels. Designers targeting safety-critical ASIL paths should select a Cyclone V with explicit ASIL documentation rather than this industrial-grade part.
Recommended
Industrial IoT Edge Gateway
The 5CEFA4U19I7 is a strong fit for industrial IoT edge gateways that aggregate multiple sensor protocols (Modbus, CAN, RS-485, EtherCAT) because the FPGA fabric implements multiple soft-core CPUs and protocol stacks concurrently. The 224 multipliers accelerate on-gateway analytics such as vibration FFT or predictive-maintenance feature extraction. The industrial temperature grade supports DIN-rail and outdoor cabinet installations. Quartus Prime's Nios II soft-core and Ethernet IP cores enable full gateway functionality without an external host MCU.
Recommended
Test and Measurement Instrumentation
The 5CEFA4U19I7 suits test and measurement equipment such as protocol analyzers, logic-analyzer front-ends, and arbitrary waveform generators because its 49K logic elements implement deep state machines and trigger logic while the 224 hardware multipliers generate arbitrary waveforms or compute FFTs of captured signals. The U19 484-ball package provides sufficient I/O for high-pin-count probe pods, and the -7 speed grade ensures deterministic timing for time-interleaved capture. The industrial temperature grade supports lab and field-deployed instrument use.
Recommended
Recommended Products Summary
Engineering reference data for 5CEFA4U19I7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CEFA5U19I7N | 5CEFA9F27I7N | 5CEFA4F23I7N | 5CEFA2F23I7N | 5CEBA4F23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | UFBGA-484 (U19) | UFBGA-484 (U19) - same | FBGA-672 (F27) - different | FBGA-484 (F23) - same pin count | FBGA-484 (F23) - same pin count | FBGA-484 (F23) - same pin count |
| Logic Elements | 49,000 | 77,000 (+57%) | 301,000 (+514%) | 49,000 (same) | 22,000 (-55%) | 49,000 (same) |
| Embedded Memory (bits) | 3,464,192 | [DATA_NEEDED] | [DATA_NEEDED] | 3,464,192 (same) | [DATA_NEEDED] | 3,464,192 (same) |
| 18x18 Multipliers | 224 | [DATA_NEEDED] | [DATA_NEEDED] | 224 (same) | [DATA_NEEDED] | 224 (same) |
| Transceivers | None (E variant) | None (E variant) | None (E variant) | None (E variant) | None (E variant) | Yes (Cyclone V GX adds transceivers) |
| Temperature Grade | Industrial I7 (-40C to +100C) | Industrial I7 (same) | Industrial I7 (same) | Industrial I7 (same) | Industrial I7 (same) | Commercial C8 (0C to +85C) |
| Process Technology | 28 nm TSMC low-power | 28 nm (same) | 28 nm (same) | 28 nm (same) | 28 nm (same) | 28 nm (same) |
| Approx. Unit Price (qty 1, as of 2026-09-05) | $31.42 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-density 49K LE in proven 28nm Cyclone V E process (vs 5CEFA2F23I7N)
- UFBGA-484 package option for high I/O density (vs 5CEFA4F23I7N)
- Same-family drop-in upgrade path to 77K LE (vs 5CEFA5U19I7N)
Design Notes
Estimated: The Cyclone V E 5CEFA4 typically dissipates 0.5W to 1.5W static power at room temperature with light utilization, rising to 2-3W at high toggle rates with all 49K LEs active. Design a 4-layer PCB with separate 1.1V VCCINT, 2.5V VCCAUX, and VCCPD rails; place at least one 100uF bulk plus four 0.1uF and two 10uF ceramic decoupling capacitors within 5 mm of the package. Add a ferrite bead on each rail to isolate switching noise. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet to refine these estimates for your specific utilization before finalizing the PCB stackup.
The 484-ball UFBGA uses 0.8 mm ball pitch, requiring laser-drilled microvias on the top signal layer and back-drilled or blind vias for inner layers to escape the dense BGA grid. Use a minimum 4-layer PCB with continuous GND plane on layer 2 directly beneath the BGA. Fan-out the BGA on layer 1 with 0.1 mm (4 mil) trace width to maximize signal escape; for DDR3 interfaces, match trace lengths within 50 mils and use 100-ohm differential impedance for clocks. JTAG, MSEL configuration, and reference-clock traces should be kept under 50 mm to preserve signal integrity.
Common pitfalls when bringing up the 5CEFA4U19I7 include: (1) incorrect MSEL[3..0] strap resistors for the desired configuration mode (AS, JTAG, or Fast Passive Parallel); (2) missing or undersized decoupling on VCCPD causing configuration failures; (3) attempting to use Cyclone V E variant for protocols requiring transceivers - if you need PCIe or gigabit serial, migrate to Cyclone V GX/GT; (4) not checking silicon revision against the Quartus Prime device support list - older revisions may require specific Quartus versions. Always validate the design on a development kit before committing to custom hardware.
Estimated: At maximum utilization, junction-to-ambient thermal resistance theta_JA for the UFBGA-484 package is approximately 12-15 C/W with a JEDEC-compliant 4-layer test board (per typical Altera thermal models). At 2W dissipation and 70C ambient, junction temperature reaches roughly 100-105C, within the 100C industrial limit but with little margin. Design with thermal vias under the central BGA balls and provide airflow, or derate utilization to keep junction below 90C for long-term reliability. Use the Altera thermal-resistance table for your specific board design rather than relying on the JEDEC value.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial I7 temperature grade exceeds AEC-Q100 grade-3 expectations but the part is not formally AEC-Q100 qualified; consult Intel for ASIL-targeted variants. Lead-free (Pb-free) finish on BGA balls confirmed.
